KR20100066543A - 은 및 은을 포함하지 않은 적어도 2가지의 원소를 함유하는 다-원소 합금 분말 - Google Patents

은 및 은을 포함하지 않은 적어도 2가지의 원소를 함유하는 다-원소 합금 분말 Download PDF

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Publication number
KR20100066543A
KR20100066543A KR1020107007436A KR20107007436A KR20100066543A KR 20100066543 A KR20100066543 A KR 20100066543A KR 1020107007436 A KR1020107007436 A KR 1020107007436A KR 20107007436 A KR20107007436 A KR 20107007436A KR 20100066543 A KR20100066543 A KR 20100066543A
Authority
KR
South Korea
Prior art keywords
silver
gas
elements
carrier gas
finely divided
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
KR1020107007436A
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English (en)
Korean (ko)
Inventor
호워드 데이비드 글릭스만
주니어 러쎌 버트럼 디에머
존 코커
Original Assignee
이 아이 듀폰 디 네모아 앤드 캄파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 이 아이 듀폰 디 네모아 앤드 캄파니 filed Critical 이 아이 듀폰 디 네모아 앤드 캄파니
Publication of KR20100066543A publication Critical patent/KR20100066543A/ko
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/16—Making metallic powder or suspensions thereof using chemical processes
    • B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
    • B22F9/28—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from gaseous metal compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/16—Making metallic powder or suspensions thereof using chemical processes
    • B22F9/30—Making metallic powder or suspensions thereof using chemical processes with decomposition of metal compounds, e.g. by pyrolysis
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/04—Making non-ferrous alloys by powder metallurgy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/008—Selection of materials
    • H01G4/0085—Fried electrodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H10N30/877—Conductive materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2999/00—Aspects linked to processes or compositions used in powder metallurgy

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Catalysts (AREA)
  • Powder Metallurgy (AREA)
KR1020107007436A 2007-09-07 2008-09-05 은 및 은을 포함하지 않은 적어도 2가지의 원소를 함유하는 다-원소 합금 분말 Abandoned KR20100066543A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US96787307P 2007-09-07 2007-09-07
US60/967,873 2007-09-07

Publications (1)

Publication Number Publication Date
KR20100066543A true KR20100066543A (ko) 2010-06-17

Family

ID=39926549

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020107007436A Abandoned KR20100066543A (ko) 2007-09-07 2008-09-05 은 및 은을 포함하지 않은 적어도 2가지의 원소를 함유하는 다-원소 합금 분말

Country Status (7)

Country Link
US (2) US20090066193A1 (https=)
EP (1) EP2185304B1 (https=)
JP (2) JP2011514432A (https=)
KR (1) KR20100066543A (https=)
CN (1) CN101778684B (https=)
TW (1) TW200932928A (https=)
WO (1) WO2009032984A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10978635B2 (en) 2015-10-09 2021-04-13 Ngk Spark Plug Co., Ltd. Piezoelectric element, piezoelectric actuator and piezoelectric transformer

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US7704416B2 (en) * 2007-06-29 2010-04-27 E.I. Du Pont De Nemours And Company Conductor paste for ceramic substrate and electric circuit
WO2010019674A1 (en) * 2008-08-13 2010-02-18 E. I. Du Pont De Nemours And Company Multi-element metal powders for silicon solar cells
WO2012063747A1 (ja) 2010-11-08 2012-05-18 ナミックス株式会社 金属粒子及びその製造方法
DE102013000057B4 (de) * 2012-01-02 2016-11-24 Wire Technology Co., Ltd. Legierungsdraht und verfahren zur herstellung desselben
CN102994797A (zh) * 2012-12-10 2013-03-27 大连创达技术交易市场有限公司 一种合金粉末
JP5801496B2 (ja) * 2013-03-12 2015-10-28 Jx日鉱日石金属株式会社 スパッタリングターゲット
JP6184731B2 (ja) 2013-04-25 2017-08-23 Ｄｏｗａエレクトロニクス株式会社 銀−ビスマス粉末、導電性ペースト及び導電膜
CN103617897A (zh) * 2013-09-29 2014-03-05 魏玲 一种新型三层银/铜双金属复合电触头材料
JP2015109633A (ja) * 2013-10-22 2015-06-11 株式会社大真空 圧電振動素子と当該圧電振動素子を用いた圧電デバイスおよび、前記圧電振動素子の製造方法と当該圧電振動素子を用いた圧電デバイスの製造方法
WO2015109177A2 (en) * 2014-01-17 2015-07-23 E. I. Du Pont De Nemours And Company Improved conductivity thick film pastes containing platinum powder
EP3015567A1 (en) * 2014-10-30 2016-05-04 Heraeus Deutschland GmbH & Co. KG Suppression of the formation of hillocks or crystals when sintering metal-organic silver compounds
CN108109719A (zh) * 2017-12-21 2018-06-01 惠州市富济电子材料有限公司 一种导电浆料及其制备方法
CN115216665B (zh) * 2022-06-29 2023-11-17 重庆科技学院 一种晶体振荡器合金电极及工艺

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GB810750A (en) * 1955-08-29 1959-03-25 Libbey Owens Ford Glass Co Electrically conductive transparent articles
JPS621807A (ja) * 1985-06-26 1987-01-07 Shoei Kagaku Kogyo Kk 金属粉末の製造方法
JPS622404A (ja) * 1985-06-26 1987-01-08 昭栄化学工業株式会社 厚膜ペ−スト
TW261554B (https=) * 1992-10-05 1995-11-01 Du Pont
TW256798B (https=) * 1992-10-05 1995-09-11 Du Pont
US5429657A (en) * 1994-01-05 1995-07-04 E. I. Du Pont De Nemours And Company Method for making silver-palladium alloy powders by aerosol decomposition
US5616165A (en) * 1995-08-25 1997-04-01 E. I. Du Pont De Nemours And Company Method for making gold powders by aerosol decomposition
EP1386708B1 (en) * 1997-02-24 2014-06-18 Cabot Corporation Particulate products made by an aerosol method
US6338809B1 (en) * 1997-02-24 2002-01-15 Superior Micropowders Llc Aerosol method and apparatus, particulate products, and electronic devices made therefrom
JP2001513697A (ja) * 1997-02-24 2001-09-04 スーペリア マイクロパウダーズ リミテッド ライアビリティ カンパニー エアロゾル法及び装置、粒子製品、並びに該粒子製品から製造される電子装置
US6159267A (en) * 1997-02-24 2000-12-12 Superior Micropowders Llc Palladium-containing particles, method and apparatus of manufacture, palladium-containing devices made therefrom
DE19928189A1 (de) 1999-06-19 2001-04-19 Bosch Gmbh Robert Piezoaktor
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KR100615870B1 (ko) * 2000-10-02 2006-08-25 아사히 가세이 일렉트로닉스 가부시끼가이샤 기능성 합금 입자
US6679938B1 (en) * 2001-01-26 2004-01-20 University Of Maryland Method of producing metal particles by spray pyrolysis using a co-solvent and apparatus therefor
JP2003178622A (ja) * 2001-12-07 2003-06-27 Nec Tokin Corp 電極ペースト組成物
JP3727904B2 (ja) * 2002-05-16 2005-12-21 株式会社ノリタケカンパニーリミテド 金属粉末およびその製造方法
TWI319776B (en) * 2003-07-23 2010-01-21 Silver alloy material, circuit substrate, electronic device, and method for manufacturing circuit substrate
EP1988585B1 (en) * 2003-09-25 2009-11-18 Kyocera Corporation Multi-layer piezoelectric device
JP2005146406A (ja) * 2003-10-23 2005-06-09 Zenhachi Okumi 微粒子の製造方法及びそのための装置
JP4478526B2 (ja) * 2004-07-20 2010-06-09 大研化学工業株式会社 非合金金属粉末及び合金金属粉末の製造方法
US7494607B2 (en) * 2005-04-14 2009-02-24 E.I. Du Pont De Nemours And Company Electroconductive thick film composition(s), electrode(s), and semiconductor device(s) formed therefrom
EP1930962B1 (en) * 2005-08-29 2013-03-20 Kyocera Corporation Layered piezoelectric element and injection device using the same
EP1801775A1 (en) * 2005-12-20 2007-06-27 Deutsche Thomson-Brandt Gmbh Method for displaying an image on an organic light emitting display and respective apparatus
US8168889B2 (en) * 2005-12-22 2012-05-01 Namics Corporation Thermosetting conductive paste and multilayer ceramic part having an external electrode formed using the same
CN101501864B (zh) * 2006-06-19 2012-08-08 卡伯特公司 光伏导电部件及其形成方法
US20140018482A1 (en) * 2012-03-26 2014-01-16 E I Du Pont De Nemours And Company Polymer thick film solder alloy/metal conductor compositions

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10978635B2 (en) 2015-10-09 2021-04-13 Ngk Spark Plug Co., Ltd. Piezoelectric element, piezoelectric actuator and piezoelectric transformer

Also Published As

Publication number Publication date
CN101778684B (zh) 2015-11-25
TW200932928A (en) 2009-08-01
US20090066193A1 (en) 2009-03-12
EP2185304A1 (en) 2010-05-19
US20120153238A1 (en) 2012-06-21
WO2009032984A1 (en) 2009-03-12
JP2014231642A (ja) 2014-12-11
JP2011514432A (ja) 2011-05-06
CN101778684A (zh) 2010-07-14
EP2185304B1 (en) 2013-07-17

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A201 Request for examination
PA0105 International application

Patent event date: 20100406

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Patent event date: 20100406

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PG1501 Laying open of application
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PE0902 Notice of grounds for rejection

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Patent event date: 20120309

Patent event code: PE09021S01D

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

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Patent event date: 20120928

NORF Unpaid initial registration fee
PC1904 Unpaid initial registration fee