CN101778684B - 包含银以及至少两种含非银的单质的多元素合金粉末 - Google Patents

包含银以及至少两种含非银的单质的多元素合金粉末 Download PDF

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Publication number
CN101778684B
CN101778684B CN200880103412.0A CN200880103412A CN101778684B CN 101778684 B CN101778684 B CN 101778684B CN 200880103412 A CN200880103412 A CN 200880103412A CN 101778684 B CN101778684 B CN 101778684B
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China
Prior art keywords
silver
palladium
alloy
carrier gas
particles
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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CN200880103412.0A
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English (en)
Chinese (zh)
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CN101778684A (zh
Inventor
H·D·格利克斯曼
R·B·小迪默
J·考克
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EIDP Inc
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EI Du Pont de Nemours and Co
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Expired - Fee Related legal-status Critical Current
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/16—Making metallic powder or suspensions thereof using chemical processes
    • B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
    • B22F9/28—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from gaseous metal compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/16—Making metallic powder or suspensions thereof using chemical processes
    • B22F9/30—Making metallic powder or suspensions thereof using chemical processes with decomposition of metal compounds, e.g. by pyrolysis
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/04—Making non-ferrous alloys by powder metallurgy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/008—Selection of materials
    • H01G4/0085—Fried electrodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H10N30/877—Conductive materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2999/00—Aspects linked to processes or compositions used in powder metallurgy

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Catalysts (AREA)
  • Powder Metallurgy (AREA)
CN200880103412.0A 2007-09-07 2008-09-05 包含银以及至少两种含非银的单质的多元素合金粉末 Expired - Fee Related CN101778684B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US96787307P 2007-09-07 2007-09-07
US60/967,873 2007-09-07
PCT/US2008/075349 WO2009032984A1 (en) 2007-09-07 2008-09-05 Multi-element alloy powder containing silver and at least two non-silver containing elements

Publications (2)

Publication Number Publication Date
CN101778684A CN101778684A (zh) 2010-07-14
CN101778684B true CN101778684B (zh) 2015-11-25

Family

ID=39926549

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200880103412.0A Expired - Fee Related CN101778684B (zh) 2007-09-07 2008-09-05 包含银以及至少两种含非银的单质的多元素合金粉末

Country Status (7)

Country Link
US (2) US20090066193A1 (https=)
EP (1) EP2185304B1 (https=)
JP (2) JP2011514432A (https=)
KR (1) KR20100066543A (https=)
CN (1) CN101778684B (https=)
TW (1) TW200932928A (https=)
WO (1) WO2009032984A1 (https=)

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US7704416B2 (en) * 2007-06-29 2010-04-27 E.I. Du Pont De Nemours And Company Conductor paste for ceramic substrate and electric circuit
WO2010019674A1 (en) * 2008-08-13 2010-02-18 E. I. Du Pont De Nemours And Company Multi-element metal powders for silicon solar cells
WO2012063747A1 (ja) 2010-11-08 2012-05-18 ナミックス株式会社 金属粒子及びその製造方法
DE102013000057B4 (de) * 2012-01-02 2016-11-24 Wire Technology Co., Ltd. Legierungsdraht und verfahren zur herstellung desselben
CN102994797A (zh) * 2012-12-10 2013-03-27 大连创达技术交易市场有限公司 一种合金粉末
JP5801496B2 (ja) * 2013-03-12 2015-10-28 Jx日鉱日石金属株式会社 スパッタリングターゲット
JP6184731B2 (ja) 2013-04-25 2017-08-23 Ｄｏｗａエレクトロニクス株式会社 銀−ビスマス粉末、導電性ペースト及び導電膜
CN103617897A (zh) * 2013-09-29 2014-03-05 魏玲 一种新型三层银/铜双金属复合电触头材料
JP2015109633A (ja) * 2013-10-22 2015-06-11 株式会社大真空 圧電振動素子と当該圧電振動素子を用いた圧電デバイスおよび、前記圧電振動素子の製造方法と当該圧電振動素子を用いた圧電デバイスの製造方法
WO2015109177A2 (en) * 2014-01-17 2015-07-23 E. I. Du Pont De Nemours And Company Improved conductivity thick film pastes containing platinum powder
EP3015567A1 (en) * 2014-10-30 2016-05-04 Heraeus Deutschland GmbH & Co. KG Suppression of the formation of hillocks or crystals when sintering metal-organic silver compounds
TWI624969B (zh) * 2015-10-09 2018-05-21 Ngk Spark Plug Co Ltd Piezoelectric element, piezoelectric actuator and piezoelectric transformer
CN108109719A (zh) * 2017-12-21 2018-06-01 惠州市富济电子材料有限公司 一种导电浆料及其制备方法
CN115216665B (zh) * 2022-06-29 2023-11-17 重庆科技学院 一种晶体振荡器合金电极及工艺

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CN1112468A (zh) * 1994-01-05 1995-11-29 纳幕尔杜邦公司 由气溶胶分解制造银-钯合金粉末的方法
US6338809B1 (en) * 1997-02-24 2002-01-15 Superior Micropowders Llc Aerosol method and apparatus, particulate products, and electronic devices made therefrom
EP1386708A2 (en) * 1997-02-24 2004-02-04 Superior MicroPowders LLC Particulate products made by an aerosol method

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GB810750A (en) * 1955-08-29 1959-03-25 Libbey Owens Ford Glass Co Electrically conductive transparent articles
JPS621807A (ja) * 1985-06-26 1987-01-07 Shoei Kagaku Kogyo Kk 金属粉末の製造方法
JPS622404A (ja) * 1985-06-26 1987-01-08 昭栄化学工業株式会社 厚膜ペ−スト
TW261554B (https=) * 1992-10-05 1995-11-01 Du Pont
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US5616165A (en) * 1995-08-25 1997-04-01 E. I. Du Pont De Nemours And Company Method for making gold powders by aerosol decomposition
JP2001513697A (ja) * 1997-02-24 2001-09-04 スーペリア マイクロパウダーズ リミテッド ライアビリティ カンパニー エアロゾル法及び装置、粒子製品、並びに該粒子製品から製造される電子装置
US6159267A (en) * 1997-02-24 2000-12-12 Superior Micropowders Llc Palladium-containing particles, method and apparatus of manufacture, palladium-containing devices made therefrom
DE19928189A1 (de) 1999-06-19 2001-04-19 Bosch Gmbh Robert Piezoaktor
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KR100615870B1 (ko) * 2000-10-02 2006-08-25 아사히 가세이 일렉트로닉스 가부시끼가이샤 기능성 합금 입자
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JP2003178622A (ja) * 2001-12-07 2003-06-27 Nec Tokin Corp 電極ペースト組成物
JP3727904B2 (ja) * 2002-05-16 2005-12-21 株式会社ノリタケカンパニーリミテド 金属粉末およびその製造方法
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JP4478526B2 (ja) * 2004-07-20 2010-06-09 大研化学工業株式会社 非合金金属粉末及び合金金属粉末の製造方法
US7494607B2 (en) * 2005-04-14 2009-02-24 E.I. Du Pont De Nemours And Company Electroconductive thick film composition(s), electrode(s), and semiconductor device(s) formed therefrom
EP1930962B1 (en) * 2005-08-29 2013-03-20 Kyocera Corporation Layered piezoelectric element and injection device using the same
EP1801775A1 (en) * 2005-12-20 2007-06-27 Deutsche Thomson-Brandt Gmbh Method for displaying an image on an organic light emitting display and respective apparatus
US8168889B2 (en) * 2005-12-22 2012-05-01 Namics Corporation Thermosetting conductive paste and multilayer ceramic part having an external electrode formed using the same
CN101501864B (zh) * 2006-06-19 2012-08-08 卡伯特公司 光伏导电部件及其形成方法
US20140018482A1 (en) * 2012-03-26 2014-01-16 E I Du Pont De Nemours And Company Polymer thick film solder alloy/metal conductor compositions

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Publication number Priority date Publication date Assignee Title
CN1112468A (zh) * 1994-01-05 1995-11-29 纳幕尔杜邦公司 由气溶胶分解制造银-钯合金粉末的方法
US6338809B1 (en) * 1997-02-24 2002-01-15 Superior Micropowders Llc Aerosol method and apparatus, particulate products, and electronic devices made therefrom
EP1386708A2 (en) * 1997-02-24 2004-02-04 Superior MicroPowders LLC Particulate products made by an aerosol method

Also Published As

Publication number Publication date
TW200932928A (en) 2009-08-01
US20090066193A1 (en) 2009-03-12
EP2185304A1 (en) 2010-05-19
US20120153238A1 (en) 2012-06-21
WO2009032984A1 (en) 2009-03-12
JP2014231642A (ja) 2014-12-11
KR20100066543A (ko) 2010-06-17
JP2011514432A (ja) 2011-05-06
CN101778684A (zh) 2010-07-14
EP2185304B1 (en) 2013-07-17

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Granted publication date: 20151125

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CF01 Termination of patent right due to non-payment of annual fee