KR20100027966A - 무전해 도금용 활성화액 - Google Patents

무전해 도금용 활성화액 Download PDF

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Publication number
KR20100027966A
KR20100027966A KR1020090077637A KR20090077637A KR20100027966A KR 20100027966 A KR20100027966 A KR 20100027966A KR 1020090077637 A KR1020090077637 A KR 1020090077637A KR 20090077637 A KR20090077637 A KR 20090077637A KR 20100027966 A KR20100027966 A KR 20100027966A
Authority
KR
South Korea
Prior art keywords
electroless
plating
compound
palladium
solution
Prior art date
Application number
KR1020090077637A
Other languages
English (en)
Korean (ko)
Inventor
기미코 구도
데루아키 시모지
다카시 마츠나미
히데미 나와후네
Original Assignee
오꾸노 케미칼 인더스트리즈 컴파니,리미티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 오꾸노 케미칼 인더스트리즈 컴파니,리미티드 filed Critical 오꾸노 케미칼 인더스트리즈 컴파니,리미티드
Publication of KR20100027966A publication Critical patent/KR20100027966A/ko

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
KR1020090077637A 2008-09-03 2009-08-21 무전해 도금용 활성화액 KR20100027966A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008226257A JP5481700B2 (ja) 2008-09-03 2008-09-03 無電解めっき用活性化液
JPJP-P-2008-226257 2008-09-03

Publications (1)

Publication Number Publication Date
KR20100027966A true KR20100027966A (ko) 2010-03-11

Family

ID=42178848

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020090077637A KR20100027966A (ko) 2008-09-03 2009-08-21 무전해 도금용 활성화액

Country Status (2)

Country Link
JP (1) JP5481700B2 (ja)
KR (1) KR20100027966A (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101638827B1 (ko) * 2015-08-06 2016-07-13 (주)엠케이켐앤텍 무전해 팔라듐 도금 전처리 활성화 방법 및 활성화액의 조성물
KR102041850B1 (ko) 2019-04-08 2019-11-06 (주)엠케이켐앤텍 인쇄회로기판의 구리표면에 무전해 팔라듐 도금을 실시하기 위한 전처리 공정으로 금스트라이크 도금방법, 도금액 조성물 및 전처리 후의 무전해 팔라듐 도금과 무전해 금도금 방법

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2784180B1 (en) * 2013-03-25 2015-12-30 ATOTECH Deutschland GmbH Method for activating a copper surface for electroless plating
KR101444687B1 (ko) * 2014-08-06 2014-09-26 (주)엠케이켐앤텍 무전해 금도금액
TWI762238B (zh) * 2021-03-12 2022-04-21 國立成功大學 一種無電鍍金屬/硫奈米複合材料之製作方法、使用該奈米複合材料之無電鍍金屬/硫陰極、及使用該陰極之電池

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2649750B2 (ja) * 1991-06-13 1997-09-03 石原薬品 株式会社 銅系素材上への選択的無電解めっき方法
JPH0711448A (ja) * 1993-06-29 1995-01-13 Ishihara Chem Co Ltd 銅系素材選択型無電解めっき用触媒液
JP3447463B2 (ja) * 1996-03-05 2003-09-16 株式会社ジャパンエナジー 無電解ニッケルめっき用前処理液および前処理方法
JP2000096252A (ja) * 1998-09-18 2000-04-04 C Uyemura & Co Ltd ハードディスク基板へのめっき方法
JP2004307946A (ja) * 2003-04-08 2004-11-04 Okuno Chem Ind Co Ltd 無電解めっき液用活性化剤および活性化液使用方法
JP2008184679A (ja) * 2007-01-31 2008-08-14 Okuno Chem Ind Co Ltd 無電解パラジウムめっき用活性化組成物

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101638827B1 (ko) * 2015-08-06 2016-07-13 (주)엠케이켐앤텍 무전해 팔라듐 도금 전처리 활성화 방법 및 활성화액의 조성물
KR102041850B1 (ko) 2019-04-08 2019-11-06 (주)엠케이켐앤텍 인쇄회로기판의 구리표면에 무전해 팔라듐 도금을 실시하기 위한 전처리 공정으로 금스트라이크 도금방법, 도금액 조성물 및 전처리 후의 무전해 팔라듐 도금과 무전해 금도금 방법

Also Published As

Publication number Publication date
JP2010059479A (ja) 2010-03-18
JP5481700B2 (ja) 2014-04-23

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Free format text: TRIAL NUMBER: 2016101002236; TRIAL DECISION FOR APPEAL AGAINST DECISION TO DECLINE REFUSAL REQUESTED 20160415

Effective date: 20171129