JP5862916B1 - 銅系金属又は銀系金属の黒化処理用組成物 - Google Patents
銅系金属又は銀系金属の黒化処理用組成物 Download PDFInfo
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- JP5862916B1 JP5862916B1 JP2015543179A JP2015543179A JP5862916B1 JP 5862916 B1 JP5862916 B1 JP 5862916B1 JP 2015543179 A JP2015543179 A JP 2015543179A JP 2015543179 A JP2015543179 A JP 2015543179A JP 5862916 B1 JP5862916 B1 JP 5862916B1
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- Prior art keywords
- silver
- water
- copper
- compound
- soluble
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- 239000002184 metal Substances 0.000 title claims abstract description 83
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 82
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 76
- 239000010949 copper Substances 0.000 title claims abstract description 76
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 75
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 title claims abstract description 67
- 239000000203 mixture Substances 0.000 title claims abstract description 40
- 229920000768 polyamine Polymers 0.000 claims abstract description 73
- 229910052709 silver Inorganic materials 0.000 claims abstract description 63
- 239000004332 silver Substances 0.000 claims abstract description 63
- 150000001875 compounds Chemical class 0.000 claims abstract description 49
- 239000004952 Polyamide Substances 0.000 claims abstract description 48
- 229920002647 polyamide Polymers 0.000 claims abstract description 48
- -1 copper metals Chemical class 0.000 claims abstract description 42
- 239000007864 aqueous solution Substances 0.000 claims abstract description 28
- 150000004820 halides Chemical class 0.000 claims abstract description 17
- 150000002736 metal compounds Chemical class 0.000 claims abstract description 15
- 229940100890 silver compound Drugs 0.000 claims abstract description 14
- 150000003379 silver compounds Chemical class 0.000 claims abstract description 14
- 229910052757 nitrogen Inorganic materials 0.000 claims abstract description 13
- 125000004433 nitrogen atom Chemical group N* 0.000 claims abstract description 13
- 239000002253 acid Substances 0.000 claims abstract description 12
- 150000003304 ruthenium compounds Chemical class 0.000 claims abstract description 12
- 125000005263 alkylenediamine group Chemical group 0.000 claims abstract description 11
- 150000002941 palladium compounds Chemical class 0.000 claims abstract description 11
- 229910001316 Ag alloy Inorganic materials 0.000 claims abstract description 10
- 229910000881 Cu alloy Inorganic materials 0.000 claims abstract description 10
- 229910001507 metal halide Inorganic materials 0.000 claims abstract description 9
- 150000005309 metal halides Chemical class 0.000 claims abstract description 9
- 229920001281 polyalkylene Polymers 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims description 30
- 150000007513 acids Chemical class 0.000 claims description 5
- 229910052736 halogen Inorganic materials 0.000 abstract description 2
- 150000002367 halogens Chemical class 0.000 abstract description 2
- 239000010953 base metal Substances 0.000 abstract 1
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- 238000006243 chemical reaction Methods 0.000 description 28
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- 239000011347 resin Substances 0.000 description 19
- 229920005989 resin Polymers 0.000 description 19
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 17
- 125000000467 secondary amino group Chemical group [H]N([*:1])[*:2] 0.000 description 16
- 238000004519 manufacturing process Methods 0.000 description 13
- 150000002739 metals Chemical class 0.000 description 12
- 239000000047 product Substances 0.000 description 12
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- 239000007788 liquid Substances 0.000 description 8
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 8
- 239000011541 reaction mixture Substances 0.000 description 8
- 125000001302 tertiary amino group Chemical group 0.000 description 8
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- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 7
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 6
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 6
- 125000002723 alicyclic group Chemical group 0.000 description 6
- 125000003277 amino group Chemical group 0.000 description 6
- PAFZNILMFXTMIY-UHFFFAOYSA-N cyclohexylamine Chemical compound NC1CCCCC1 PAFZNILMFXTMIY-UHFFFAOYSA-N 0.000 description 6
- 239000001257 hydrogen Substances 0.000 description 6
- 229910052739 hydrogen Inorganic materials 0.000 description 6
- 239000012948 isocyanate Substances 0.000 description 6
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- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 5
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- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 4
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- 239000004202 carbamide Substances 0.000 description 4
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 4
- 150000002334 glycols Chemical class 0.000 description 4
- LEQAOMBKQFMDFZ-UHFFFAOYSA-N glyoxal Chemical compound O=CC=O LEQAOMBKQFMDFZ-UHFFFAOYSA-N 0.000 description 4
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 4
- 238000005342 ion exchange Methods 0.000 description 4
- 150000002513 isocyanates Chemical class 0.000 description 4
- 239000004973 liquid crystal related substance Substances 0.000 description 4
- 239000007800 oxidant agent Substances 0.000 description 4
- 229910052763 palladium Inorganic materials 0.000 description 4
- 229920000962 poly(amidoamine) Polymers 0.000 description 4
- XFNJVJPLKCPIBV-UHFFFAOYSA-N trimethylenediamine Chemical compound NCCCN XFNJVJPLKCPIBV-UHFFFAOYSA-N 0.000 description 4
- 150000003672 ureas Chemical class 0.000 description 4
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 3
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 3
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- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 150000008051 alkyl sulfates Chemical class 0.000 description 3
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 3
- 229910001919 chlorite Inorganic materials 0.000 description 3
- 229910052619 chlorite group Inorganic materials 0.000 description 3
- QBWCMBCROVPCKQ-UHFFFAOYSA-N chlorous acid Chemical compound OCl=O QBWCMBCROVPCKQ-UHFFFAOYSA-N 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical compound I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 description 3
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 3
- WQYVRQLZKVEZGA-UHFFFAOYSA-N hypochlorite Chemical compound Cl[O-] WQYVRQLZKVEZGA-UHFFFAOYSA-N 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000006068 polycondensation reaction Methods 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 238000010992 reflux Methods 0.000 description 3
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 3
- AOBIOSPNXBMOAT-UHFFFAOYSA-N 2-[2-(oxiran-2-ylmethoxy)ethoxymethyl]oxirane Chemical compound C1OC1COCCOCC1CO1 AOBIOSPNXBMOAT-UHFFFAOYSA-N 0.000 description 2
- RXFCIXRFAJRBSG-UHFFFAOYSA-N 3,2,3-tetramine Chemical compound NCCCNCCNCCCN RXFCIXRFAJRBSG-UHFFFAOYSA-N 0.000 description 2
- XYUINKARGUCCQJ-UHFFFAOYSA-N 3-imino-n-propylpropan-1-amine Chemical compound CCCNCCC=N XYUINKARGUCCQJ-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 2
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 2
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- 125000002947 alkylene group Chemical group 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- SRSXLGNVWSONIS-UHFFFAOYSA-N benzenesulfonic acid Chemical compound OS(=O)(=O)C1=CC=CC=C1 SRSXLGNVWSONIS-UHFFFAOYSA-N 0.000 description 2
- 229940092714 benzenesulfonic acid Drugs 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 2
- 229910052794 bromium Inorganic materials 0.000 description 2
- GZUXJHMPEANEGY-UHFFFAOYSA-N bromomethane Chemical compound BrC GZUXJHMPEANEGY-UHFFFAOYSA-N 0.000 description 2
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
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- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
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- 150000008282 halocarbons Chemical class 0.000 description 2
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- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
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- JDBDDNFATWXGQZ-UHFFFAOYSA-N 5-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1=CC(C)CC2C(=O)OC(=O)C12 JDBDDNFATWXGQZ-UHFFFAOYSA-N 0.000 description 1
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- OSDWBNJEKMUWAV-UHFFFAOYSA-N Allyl chloride Chemical compound ClCC=C OSDWBNJEKMUWAV-UHFFFAOYSA-N 0.000 description 1
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 1
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 description 1
- UNMYWSMUMWPJLR-UHFFFAOYSA-L Calcium iodide Chemical compound [Ca+2].[I-].[I-] UNMYWSMUMWPJLR-UHFFFAOYSA-L 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 description 1
- FBPFZTCFMRRESA-JGWLITMVSA-N D-glucitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-JGWLITMVSA-N 0.000 description 1
- XBPCUCUWBYBCDP-UHFFFAOYSA-N Dicyclohexylamine Chemical compound C1CCCCC1NC1CCCCC1 XBPCUCUWBYBCDP-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical class C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- CTKINSOISVBQLD-UHFFFAOYSA-N Glycidol Chemical compound OCC1CO1 CTKINSOISVBQLD-UHFFFAOYSA-N 0.000 description 1
- SQSPRWMERUQXNE-UHFFFAOYSA-N Guanylurea Chemical compound NC(=N)NC(N)=O SQSPRWMERUQXNE-UHFFFAOYSA-N 0.000 description 1
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- WSMYVTOQOOLQHP-UHFFFAOYSA-N Malondialdehyde Chemical compound O=CCC=O WSMYVTOQOOLQHP-UHFFFAOYSA-N 0.000 description 1
- MGJKQDOBUOMPEZ-UHFFFAOYSA-N N,N'-dimethylurea Chemical compound CNC(=O)NC MGJKQDOBUOMPEZ-UHFFFAOYSA-N 0.000 description 1
- XTUVJUMINZSXGF-UHFFFAOYSA-N N-methylcyclohexylamine Chemical compound CNC1CCCCC1 XTUVJUMINZSXGF-UHFFFAOYSA-N 0.000 description 1
- PAMIQIKDUOTOBW-UHFFFAOYSA-N N-methylcyclohexylamine Natural products CN1CCCCC1 PAMIQIKDUOTOBW-UHFFFAOYSA-N 0.000 description 1
- XGEGHDBEHXKFPX-UHFFFAOYSA-N N-methylthiourea Natural products CNC(N)=O XGEGHDBEHXKFPX-UHFFFAOYSA-N 0.000 description 1
- WMTLVUCMBWBYSO-UHFFFAOYSA-N N=C=O.N=C=O.C=1C=CC=CC=1OC1=CC=CC=C1 Chemical compound N=C=O.N=C=O.C=1C=CC=CC=1OC1=CC=CC=C1 WMTLVUCMBWBYSO-UHFFFAOYSA-N 0.000 description 1
- QORUGOXNWQUALA-UHFFFAOYSA-N N=C=O.N=C=O.N=C=O.C1=CC=C(C(C2=CC=CC=C2)C2=CC=CC=C2)C=C1 Chemical compound N=C=O.N=C=O.N=C=O.C1=CC=C(C(C2=CC=CC=C2)C2=CC=CC=C2)C=C1 QORUGOXNWQUALA-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- 229910021607 Silver chloride Inorganic materials 0.000 description 1
- AWMVMTVKBNGEAK-UHFFFAOYSA-N Styrene oxide Chemical compound C1OC1C1=CC=CC=C1 AWMVMTVKBNGEAK-UHFFFAOYSA-N 0.000 description 1
- PCSMJKASWLYICJ-UHFFFAOYSA-N Succinic aldehyde Chemical compound O=CCCC=O PCSMJKASWLYICJ-UHFFFAOYSA-N 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical group [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- 239000004110 Zinc silicate Substances 0.000 description 1
- OXIKYYJDTWKERT-UHFFFAOYSA-N [4-(aminomethyl)cyclohexyl]methanamine Chemical compound NCC1CCC(CN)CC1 OXIKYYJDTWKERT-UHFFFAOYSA-N 0.000 description 1
- PDJOVHJAHKEEGW-UHFFFAOYSA-N [8-(aminomethyl)-4-tricyclo[5.2.1.02,6]decanyl]methanamine Chemical compound C1C2CC(CN)C1C1C2CC(CN)C1 PDJOVHJAHKEEGW-UHFFFAOYSA-N 0.000 description 1
- 229910052946 acanthite Inorganic materials 0.000 description 1
- IKHGUXGNUITLKF-XPULMUKRSA-N acetaldehyde Chemical compound [14CH]([14CH3])=O IKHGUXGNUITLKF-XPULMUKRSA-N 0.000 description 1
- 239000003929 acidic solution Substances 0.000 description 1
- 239000004480 active ingredient Substances 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 229910001508 alkali metal halide Inorganic materials 0.000 description 1
- 150000008045 alkali metal halides Chemical class 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- SWLVFNYSXGMGBS-UHFFFAOYSA-N ammonium bromide Chemical compound [NH4+].[Br-] SWLVFNYSXGMGBS-UHFFFAOYSA-N 0.000 description 1
- 235000019270 ammonium chloride Nutrition 0.000 description 1
- BFNBIHQBYMNNAN-UHFFFAOYSA-N ammonium sulfate Chemical compound N.N.OS(O)(=O)=O BFNBIHQBYMNNAN-UHFFFAOYSA-N 0.000 description 1
- 229910052921 ammonium sulfate Inorganic materials 0.000 description 1
- 235000011130 ammonium sulphate Nutrition 0.000 description 1
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical group [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- KCXMKQUNVWSEMD-UHFFFAOYSA-N benzyl chloride Chemical compound ClCC1=CC=CC=C1 KCXMKQUNVWSEMD-UHFFFAOYSA-N 0.000 description 1
- 229940073608 benzyl chloride Drugs 0.000 description 1
- RDHPKYGYEGBMSE-UHFFFAOYSA-N bromoethane Chemical compound CCBr RDHPKYGYEGBMSE-UHFFFAOYSA-N 0.000 description 1
- CDQSJQSWAWPGKG-UHFFFAOYSA-N butane-1,1-diol Chemical compound CCCC(O)O CDQSJQSWAWPGKG-UHFFFAOYSA-N 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N butyric aldehyde Natural products CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 1
- 229940046413 calcium iodide Drugs 0.000 description 1
- 229910001640 calcium iodide Inorganic materials 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- NEHMKBQYUWJMIP-NJFSPNSNSA-N chloro(114C)methane Chemical compound [14CH3]Cl NEHMKBQYUWJMIP-NJFSPNSNSA-N 0.000 description 1
- HRYZWHHZPQKTII-UHFFFAOYSA-N chloroethane Chemical compound CCCl HRYZWHHZPQKTII-UHFFFAOYSA-N 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- ARUKYTASOALXFG-UHFFFAOYSA-N cycloheptylcycloheptane Chemical compound C1CCCCCC1C1CCCCCC1 ARUKYTASOALXFG-UHFFFAOYSA-N 0.000 description 1
- KPJMSEDDVUVYEZ-UHFFFAOYSA-N cyclohex-3-ene-1,2-dicarboxylic acid;terephthalic acid Chemical compound OC(=O)C1CCC=CC1C(O)=O.OC(=O)C1=CC=C(C(O)=O)C=C1 KPJMSEDDVUVYEZ-UHFFFAOYSA-N 0.000 description 1
- PDXRQENMIVHKPI-UHFFFAOYSA-N cyclohexane-1,1-diol Chemical compound OC1(O)CCCCC1 PDXRQENMIVHKPI-UHFFFAOYSA-N 0.000 description 1
- QSAWQNUELGIYBC-UHFFFAOYSA-N cyclohexane-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCCCC1C(O)=O QSAWQNUELGIYBC-UHFFFAOYSA-N 0.000 description 1
- UYAUGHKQCCCFDK-UHFFFAOYSA-N cyclohexane-1,3,5-triamine Chemical compound NC1CC(N)CC(N)C1 UYAUGHKQCCCFDK-UHFFFAOYSA-N 0.000 description 1
- VKIRRGRTJUUZHS-UHFFFAOYSA-N cyclohexane-1,4-diamine Chemical compound NC1CCC(N)CC1 VKIRRGRTJUUZHS-UHFFFAOYSA-N 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- KQWGXHWJMSMDJJ-UHFFFAOYSA-N cyclohexyl isocyanate Chemical compound O=C=NC1CCCCC1 KQWGXHWJMSMDJJ-UHFFFAOYSA-N 0.000 description 1
- YZFOGXKZTWZVFN-UHFFFAOYSA-N cyclopentane-1,1-dicarboxylic acid Chemical compound OC(=O)C1(C(O)=O)CCCC1 YZFOGXKZTWZVFN-UHFFFAOYSA-N 0.000 description 1
- UYDJAHJCGZTTHB-UHFFFAOYSA-N cyclopentane-1,1-diol Chemical compound OC1(O)CCCC1 UYDJAHJCGZTTHB-UHFFFAOYSA-N 0.000 description 1
- 239000013527 degreasing agent Substances 0.000 description 1
- 238000005237 degreasing agent Methods 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 150000005690 diesters Chemical class 0.000 description 1
- DENRZWYUOJLTMF-UHFFFAOYSA-N diethyl sulfate Chemical compound CCOS(=O)(=O)OCC DENRZWYUOJLTMF-UHFFFAOYSA-N 0.000 description 1
- 229940008406 diethyl sulfate Drugs 0.000 description 1
- VAYGXNSJCAHWJZ-UHFFFAOYSA-N dimethyl sulfate Chemical compound COS(=O)(=O)OC VAYGXNSJCAHWJZ-UHFFFAOYSA-N 0.000 description 1
- KFIKNZBXPKXFTA-UHFFFAOYSA-N dipotassium;dioxido(dioxo)ruthenium Chemical compound [K+].[K+].[O-][Ru]([O-])(=O)=O KFIKNZBXPKXFTA-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- GKIPXFAANLTWBM-UHFFFAOYSA-N epibromohydrin Chemical compound BrCC1CO1 GKIPXFAANLTWBM-UHFFFAOYSA-N 0.000 description 1
- PQJJJMRNHATNKG-UHFFFAOYSA-N ethyl bromoacetate Chemical compound CCOC(=O)CBr PQJJJMRNHATNKG-UHFFFAOYSA-N 0.000 description 1
- 229960003750 ethyl chloride Drugs 0.000 description 1
- VEUUMBGHMNQHGO-UHFFFAOYSA-N ethyl chloroacetate Chemical compound CCOC(=O)CCl VEUUMBGHMNQHGO-UHFFFAOYSA-N 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 239000000499 gel Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 229940071870 hydroiodic acid Drugs 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- PNDPGZBMCMUPRI-UHFFFAOYSA-N iodine Chemical compound II PNDPGZBMCMUPRI-UHFFFAOYSA-N 0.000 description 1
- 239000011630 iodine Substances 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- HVTICUPFWKNHNG-UHFFFAOYSA-N iodoethane Chemical compound CCI HVTICUPFWKNHNG-UHFFFAOYSA-N 0.000 description 1
- INQOMBQAUSQDDS-UHFFFAOYSA-N iodomethane Chemical compound IC INQOMBQAUSQDDS-UHFFFAOYSA-N 0.000 description 1
- 125000001261 isocyanato group Chemical group *N=C=O 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 125000005647 linker group Chemical group 0.000 description 1
- 229910001629 magnesium chloride Inorganic materials 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- AYLRODJJLADBOB-QMMMGPOBSA-N methyl (2s)-2,6-diisocyanatohexanoate Chemical compound COC(=O)[C@@H](N=C=O)CCCCN=C=O AYLRODJJLADBOB-QMMMGPOBSA-N 0.000 description 1
- AYLRODJJLADBOB-UHFFFAOYSA-N methyl 2,6-diisocyanatohexanoate Chemical compound COC(=O)C(N=C=O)CCCCN=C=O AYLRODJJLADBOB-UHFFFAOYSA-N 0.000 description 1
- YDCHPLOFQATIDS-UHFFFAOYSA-N methyl 2-bromoacetate Chemical compound COC(=O)CBr YDCHPLOFQATIDS-UHFFFAOYSA-N 0.000 description 1
- QABLOFMHHSOFRJ-UHFFFAOYSA-N methyl 2-chloroacetate Chemical compound COC(=O)CCl QABLOFMHHSOFRJ-UHFFFAOYSA-N 0.000 description 1
- 229940102396 methyl bromide Drugs 0.000 description 1
- XGEGHDBEHXKFPX-NJFSPNSNSA-N methylurea Chemical compound [14CH3]NC(N)=O XGEGHDBEHXKFPX-NJFSPNSNSA-N 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- HBEQXAKJSGXAIQ-UHFFFAOYSA-N oxopalladium Chemical compound [Pd]=O HBEQXAKJSGXAIQ-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 229910003445 palladium oxide Inorganic materials 0.000 description 1
- YJVFFLUZDVXJQI-UHFFFAOYSA-L palladium(ii) acetate Chemical compound [Pd+2].CC([O-])=O.CC([O-])=O YJVFFLUZDVXJQI-UHFFFAOYSA-L 0.000 description 1
- INIOZDBICVTGEO-UHFFFAOYSA-L palladium(ii) bromide Chemical compound Br[Pd]Br INIOZDBICVTGEO-UHFFFAOYSA-L 0.000 description 1
- GPNDARIEYHPYAY-UHFFFAOYSA-N palladium(ii) nitrate Chemical compound [Pd+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O GPNDARIEYHPYAY-UHFFFAOYSA-N 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 229920001515 polyalkylene glycol Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 150000003141 primary amines Chemical group 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 229910001925 ruthenium oxide Inorganic materials 0.000 description 1
- GTCKPGDAPXUISX-UHFFFAOYSA-N ruthenium(3+);trinitrate Chemical compound [Ru+3].[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O GTCKPGDAPXUISX-UHFFFAOYSA-N 0.000 description 1
- YBCAZPLXEGKKFM-UHFFFAOYSA-K ruthenium(iii) chloride Chemical compound [Cl-].[Cl-].[Cl-].[Ru+3] YBCAZPLXEGKKFM-UHFFFAOYSA-K 0.000 description 1
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- CQLFBEKRDQMJLZ-UHFFFAOYSA-M silver acetate Chemical compound [Ag+].CC([O-])=O CQLFBEKRDQMJLZ-UHFFFAOYSA-M 0.000 description 1
- 229940071536 silver acetate Drugs 0.000 description 1
- HKZLPVFGJNLROG-UHFFFAOYSA-M silver monochloride Chemical compound [Cl-].[Ag+] HKZLPVFGJNLROG-UHFFFAOYSA-M 0.000 description 1
- 229910001961 silver nitrate Inorganic materials 0.000 description 1
- 229910001923 silver oxide Inorganic materials 0.000 description 1
- XUARKZBEFFVFRG-UHFFFAOYSA-N silver sulfide Chemical compound [S-2].[Ag+].[Ag+] XUARKZBEFFVFRG-UHFFFAOYSA-N 0.000 description 1
- 229940056910 silver sulfide Drugs 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- UKLNMMHNWFDKNT-UHFFFAOYSA-M sodium chlorite Chemical compound [Na+].[O-]Cl=O UKLNMMHNWFDKNT-UHFFFAOYSA-M 0.000 description 1
- 229960002218 sodium chlorite Drugs 0.000 description 1
- 239000001488 sodium phosphate Substances 0.000 description 1
- 229910000162 sodium phosphate Inorganic materials 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 229940014800 succinic anhydride Drugs 0.000 description 1
- 229910052717 sulfur Chemical group 0.000 description 1
- 239000011593 sulfur Chemical group 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- AMJYHMCHKZQLAY-UHFFFAOYSA-N tris(2-isocyanatophenoxy)-sulfanylidene-$l^{5}-phosphane Chemical compound O=C=NC1=CC=CC=C1OP(=S)(OC=1C(=CC=CC=1)N=C=O)OC1=CC=CC=C1N=C=O AMJYHMCHKZQLAY-UHFFFAOYSA-N 0.000 description 1
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 description 1
- XSMMCTCMFDWXIX-UHFFFAOYSA-N zinc silicate Chemical compound [Zn+2].[O-][Si]([O-])=O XSMMCTCMFDWXIX-UHFFFAOYSA-N 0.000 description 1
- 235000019352 zinc silicate Nutrition 0.000 description 1
- LTVDFSLWFKLJDQ-UHFFFAOYSA-N α-tocopherolquinone Chemical compound CC(C)CCCC(C)CCCC(C)CCCC(C)(O)CCC1=C(C)C(=O)C(C)=C(C)C1=O LTVDFSLWFKLJDQ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
- C23C22/60—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using alkaline aqueous solutions with pH greater than 8
- C23C22/63—Treatment of copper or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
- C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
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- C23C22/48—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 not containing phosphates, hexavalent chromium compounds, fluorides or complex fluorides, molybdates, tungstates, vanadates or oxalates
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Abstract
Description
しかしながら、上記した銅表面を酸化処理する方法では、黒色化の程度が不十分なために反射率を十分に低減することができない。また硫化物処理では、銅回路の表面や側面が粗化されて配線の精度が低下するといった問題点がある(下記特許文献2参照)
また、近年、比較的簡単な配線回路形成方法として、導電性銀ペーストを用いて回路を形成方法が実施されている。この様な銀ペーストから形成される配線回路をタッチパネル、液晶ディスプレイなどの表示装置に用いる場合にも、銀を主成分とする導体部分を黒色化して反射率を低減することが要求される。
項1. (i)水溶性パラジウム化合物、水溶性ルテニウム化合物、及び水溶性銀化合物からなる群から選ばれた少なくとも一種の水溶性金属化合物、
(ii)ハロゲン化水素酸、金属ハロゲン化物及びハロゲン化アンモニウムからなる群から選ばれた少なくとも一種のハロゲン化物、並びに
(iii)アルキレンジアミン、ポリアルキレンポリアミン、ポリアミドポリアミン及びポリアミドポリアミンの架橋化物からなる群から選ばれた少なくとも一種の窒素原子含有化合物
を含む水溶液からなる銅系金属又は銀系金属の黒化処理用組成物。
項2. (i)水溶性パラジウム化合物、水溶性ルテニウム化合物、及び水溶性銀化合物水溶性銀化合物からなる群から選ばれた少なくとも一種の水溶性金属化合物を金属成分の濃度として0.0001〜0.5mol/L、
(ii)ハロゲン化水素酸、金属ハロゲン化物及びハロゲン化アンモニウムからなる群から選ばれた少なくとも一種のハロゲン化物を0.1〜500g/L、並びに
(iii)アルキレンジアミン、ポリアルキレンポリアミン、ポリアミドポリアミン及びポリアミドポリアミンの架橋化物からなる群から選ばれた少なくとも一種の窒素原子を含む化合物を0.001〜100g/L、
含む水溶液からなる銅系金属又は銀系金属の黒化処理用組成物。
項3. 銅若しくは銅合金からなる銅系金属を含む物品、又は銀若しくは銀合金からなる銀系金属を含む物品を被処理物として、請求項1又は2に記載の黒化処理用組成物に該被処理物を接触させることを特徴とする、銅系金属又は銀系金属の黒化方法。
本発明の黒化処理用組成物は、下記(i)〜(iii)の成分を有効成分として含有する水溶液である。
(i)水溶性パラジウム化合物、水溶性ルテニウム化合物、及び水溶性銀化合物からなる群から選ばれた少なくとも一種の水溶性金属化合物、
(ii)金属ハロゲン化物及びハロゲン化アンモニウムからなる群から選ばれた少なくとも一種のハロゲン化物、並びに
(iii)アルキレンジアミン、ポリアルキレンポリアミン、ポリアミドポリアミン及びポリアミドポリアミンの架橋化物からなる群から選ばれた少なくとも一種の窒素原子を含む化合物。
本発明の黒化処理用組成物では、水溶性パラジウム化合物、水溶性ルテニウム化合物、及び水溶性銀化合物からなる群から選ばれた少なくとも一種の水溶性金属化合物を用いる。
本発明の黒化処理用組成物には、ハロゲン化水素酸、金属ハロゲン化物及びハロゲン化アンモニウムからなる群から選ばれた少なくとも一種のハロゲン化物を添加することが必要である。これらのハロゲン化物を添加することによって、水溶性金属化合物を水溶液中において安定に存在させることができる。
本発明では、アルキレンジアミン、ポリアルキレンポリアミン、ポリアミドポリアミン及びポリアミドポリアミンの架橋化物からなる群から選ばれた少なくとも一種の窒素原子を含む化合物を用いることが必要である。
アルキレンジアミンの具体例としては、1,2−プロパンジアミン、1,3−プロパンジアミン、ヘキサメチレンジアミン等を挙げることができる。
ポリアルキレンポリアミンの具体例としては、ジエチレントリアミン、トリエチレンテトラミン、テトラエチレンペンタミン、ペンタエチレンヘキサミン、イミノビスプロピルアミン、3−アザヘキサン−1,6−ジアミン、4,7−ジアザデカン−1,10−ジアミン等を挙げることができる。
本発明で用いる窒素原子含有化合物の内で、ポリアミドポリアミンとしては、例えば、ポリアミンと二塩基性カルボン酸系化合物とを重縮合することによって得られたものを用いることができる。また、ポリアミンと二塩基性カルボン酸系化合物に加えて、さらに他の成分を反応させたものであってもよい。この様な成分としては、アルキル化剤、尿素類、酸化剤、活性水素を少なくとも1個有する脂環式化合物等を例示できる。
ポリアミドポリアミンの架橋化物としては、上記したポリアミドポリアミンに架橋性化合物を反応させたものを用いることができる。
本発明の黒化処理用組成物による処理対象は、銅若しくは銅合金からなる銅系金属、又は銀若しくは銀合金からなる銀系金属である。銅合金及び銀合金としては、それぞれ、例えば、銅又は銀を50重量%以上、好ましくは70重量%以上含む合金を用いることができる。
温度計、リービッヒ冷却器及び攪拌機を備えた反応容器に、ジエチレントリアミン55重量部、フタル酸29重量部、水10重量部及び98%硫酸6重量部を仕込み、150〜160℃で15時間、脱水反応させた。次いで、得られた反応混合物にイオン交換水を加えて樹脂分濃度を50重量%に調整し、粘度680Pas、1級及び2級アミノ基の合計量2.578mmol/gのポリアミドアミン樹脂の水溶液を得た。この水溶液をポリアミドポリアミン1とする。
温度計、リービッヒ冷却器及び攪拌機を備えた反応容器に、ジエチレントリアミン72重量部、アジピン酸22重量部、水3重量部及び98%硫酸3重量部を仕込み、150〜160℃で15時間、脱水反応させた。次いで、得られた反応混合物にイオン交換水を加えて樹脂分濃度を50重量%に調整し、粘度650Pas、1級及び2級アミノ基の合計量3.1mmol/gのポリアミドアミン樹脂の水溶液を得た。この水溶液をポリアミドポリアミン2とする。
温度計、リービッヒ冷却器及び攪拌機を備えた反応容器に、トリエチレントリアミン30重量部、コハク酸30 重量部、水30重量部及び98%硫酸10重量部を仕込み、150〜160℃で15時間、脱水反応させた。次いで、得られた反応混合物にイオン交換水を加えて樹脂分濃度を50重量%に調整し、粘度620Pas、1級及び2級アミノ基の合計量3.2mmol/gのポリアミドアミン樹脂の水溶液を得た。この水溶液をポリアミドポリアミン3とする。
温度計、リービッヒ冷却器及び攪拌機を備えた反応容器に、ジエチレントリアミン39重量部、マレイン酸40 重量部、水20重量部及び98%硫酸1重量部を仕込み、150〜160℃で15時間、脱水反応させた。次いで、得られた反応混合物にイオン交換水を加えて樹脂分濃度を50重量%に調整し、粘度611Pas、1級及び2級アミノ基の合計量3.0mmol/gのポリアミドアミン樹脂の水溶液を得た。この水溶液をポリアミドポリアミン4とする。
温度計、還流冷却器及び攪拌機を備えた反応容器に、製造例1で得たポリアミドポリアミン1を55.1重量部と水を30.2 重量部仕込み、30℃に保温しながら、エピクロルヒドリン10 重量部を2時間かけて滴下した後、4時間反応させた。
製造例5と同様にして、ポリアミドポリアミン1を35.1重量部と水を31.2 重量部仕込み、30 ℃ に保温しながら、エピクロルヒドリン23.3重量部を5時間かけ滴下した後、10 時間反応させた。これにイオン交換水10.7 重量部を滴下した後、温度を50℃ まで昇温した。50℃に到達後、直ちに水1.6重量部を滴下し、硫酸により反応混合物のpHを3.4に調整し、更に水を加えて樹脂濃度を15%に希釈して、粘度6.4mPas 、カチオン化度29.0 % 、一級、二級及び三級アミノ基の合計量0.444 mmol/gの水溶性樹脂の水溶液を得た。この水溶液をポリアミドポリアミンの架橋物2とする。
温度計、還流冷却器及び攪拌機を備えた反応容器に、製造例2で得たポリアミドポリアミン2を30.3重量部と水を39 重量部仕込み、30℃に保温しながら、エピクロルヒドリン18 重量部を2時間かけて滴下した後、6時間反応させた。
温度計、還流冷却器及び攪拌機を備えた反応容器に、製造例2で得たポリアミドポリアミン2を30.3重量部と水を29.9 重量部仕込み、30℃に保温しながら、ポリエチレングリコールジグリシジルエーテル11.1 重量部を2時間かけて滴下した後、4時間反応させた。
縦5cm×5cm×厚さ0.2mmの圧延銅板を被処理物として用い、市販の浸漬用脱脂剤(奥野製薬工業製、商標名:DP-320クリーン)に45℃で1分間浸漬して脱脂処理を行い、水洗した。その後、該被処理物を下記表1に示す組成のNo.1〜10の各黒化処理液中に、30℃で3分間浸漬して黒化処理を行った。
下記表3及び表4に示す組成のNo.11〜30の各黒化処理液を用いること以外は、実施例1と同様にして、圧延銅板の黒化処理を行った。
銀粉(同和ハイテック(株)製:銀粉ST)75重量%、ガラスフリット(奥野製薬工業(株)製:GF3550)5重量%、及びオイル(奥野製薬工業(株)製:OIL-6018)20重量%を主成分とする銀ペーストを調製し、これを縦5cm×横5cm×厚さ0.5mmのアルミナ基板の全面にスクリーン印刷し、600℃で10分間焼成して、アルミナ基板上に銀ペースト皮膜を形成した。
Claims (3)
- (i)水溶性パラジウム化合物、水溶性ルテニウム化合物、及び水溶性銀化合物からなる群から選ばれた少なくとも一種の水溶性金属化合物、
(ii)ハロゲン化水素酸、金属ハロゲン化物及びハロゲン化アンモニウムからなる群から選ばれた少なくとも一種のハロゲン化物、並びに
(iii)アルキレンジアミン、ポリアルキレンポリアミン、ポリアミドポリアミン及びポリアミドポリアミンの架橋化物からなる群から選ばれた少なくとも一種の窒素原子含有化合物
を含む水溶液からなる銅系金属又は銀系金属の黒化処理用組成物。 - (i)水溶性パラジウム化合物、水溶性ルテニウム化合物、及び水溶性銀化合物水溶性銀化合物からなる群から選ばれた少なくとも一種の水溶性金属化合物を金属成分の濃度として0.0001〜0.5mol/L、
(ii)ハロゲン化水素酸、金属ハロゲン化物及びハロゲン化アンモニウムからなる群から選ばれた少なくとも一種のハロゲン化物を0.1〜500g/L、並びに
(iii)アルキレンジアミン、ポリアルキレンポリアミン、ポリアミドポリアミン及びポリアミドポリアミンの架橋化物からなる群から選ばれた少なくとも一種の窒素原子を含む化合物を0.001〜100g/L、
含む水溶液からなる銅系金属又は銀系金属の黒化処理用組成物。 - 銅若しくは銅合金からなる銅系金属を含む物品、又は銀若しくは銀合金からなる銀系金属を含む物品を被処理物として、請求項1又は2に記載の黒化処理用組成物に該被処理物を接触させることを特徴とする、銅系金属又は銀系金属の黒化方法。
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TW200718347A (en) * | 2005-07-14 | 2007-05-01 | Mitsui Mining & Smelting Co | Blackening surface treated copper foil and electromagnetic wave shielding conductive mesh for front panel of plasma display using the blackening surface treated copper foil |
JP4802248B2 (ja) * | 2005-12-16 | 2011-10-26 | エルジー・ケム・リミテッド | 導電性パターンの製造方法およびこれによって製造された導電性パターン |
TW200907107A (en) * | 2007-07-20 | 2009-02-16 | Mec Co Ltd | Surface treating agent |
CN101130869A (zh) | 2007-09-20 | 2008-02-27 | 吴江市天地人真空炉业有限公司 | 铜的古铜色化学着色方法 |
US8518281B2 (en) * | 2008-06-03 | 2013-08-27 | Kesheng Feng | Acid-resistance promoting composition |
JP2011070820A (ja) | 2009-09-24 | 2011-04-07 | Panasonic Electric Works Co Ltd | 透明導電膜付き基材及びその製造方法 |
KR101216864B1 (ko) * | 2010-12-29 | 2012-12-28 | 한국이엔에쓰 주식회사 | 인쇄회로기판 및 그 제조방법 |
JP5985812B2 (ja) * | 2011-11-04 | 2016-09-06 | Jx金属株式会社 | 印刷回路用銅箔 |
JP5559288B2 (ja) * | 2012-11-13 | 2014-07-23 | メック株式会社 | プリント配線板の製造方法及び表面処理装置 |
CN103313532A (zh) * | 2013-05-20 | 2013-09-18 | 江苏迈世达电子有限公司 | 用于加工电路板盲孔的直接镭射钻孔方法 |
-
2015
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003008199A (ja) * | 2001-06-13 | 2003-01-10 | Internatl Business Mach Corp <Ibm> | プリント配線基板の銅表面粗化方法ならびにプリント配線基板およびその製造方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019049617A1 (ja) * | 2017-09-05 | 2019-03-14 | 富士フイルム株式会社 | 導電性フィルム、タッチパネルセンサー、及びタッチパネル |
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JPWO2015198899A1 (ja) | 2017-04-20 |
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CN106460188B (zh) | 2018-11-20 |
CN106460188A (zh) | 2017-02-22 |
US10184186B2 (en) | 2019-01-22 |
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KR20170005443A (ko) | 2017-01-13 |
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