WO2015198899A1 - 銅系金属又は銀系金属の黒化処理用組成物 - Google Patents
銅系金属又は銀系金属の黒化処理用組成物 Download PDFInfo
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- WO2015198899A1 WO2015198899A1 PCT/JP2015/067135 JP2015067135W WO2015198899A1 WO 2015198899 A1 WO2015198899 A1 WO 2015198899A1 JP 2015067135 W JP2015067135 W JP 2015067135W WO 2015198899 A1 WO2015198899 A1 WO 2015198899A1
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
- C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
- C23C22/48—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 not containing phosphates, hexavalent chromium compounds, fluorides or complex fluorides, molybdates, tungstates, vanadates or oxalates
- C23C22/58—Treatment of other metallic material
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
- C23C22/60—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using alkaline aqueous solutions with pH greater than 8
- C23C22/63—Treatment of copper or alloys based thereon
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
- C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
- C23C22/48—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 not containing phosphates, hexavalent chromium compounds, fluorides or complex fluorides, molybdates, tungstates, vanadates or oxalates
- C23C22/52—Treatment of copper or alloys based thereon
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
- C23C22/60—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using alkaline aqueous solutions with pH greater than 8
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
- C23C22/68—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous solutions with pH between 6 and 8
Definitions
- the present invention relates to a composition for blackening treatment of a copper-based metal or a silver-based metal.
- a display device such as a touch panel or a liquid crystal display
- the reflectance of a copper wiring circuit arranged under the liquid crystal layer is high, the reflection affects the appearance of the display device and impairs display accuracy. is there. For this reason, it is required to reduce the reflectance by blackening a conductor portion made of a copper circuit or other copper material.
- the present invention has been made in view of the current state of the prior art described above, and its main purpose is a conductor portion and a film formed from a copper circuit and a silver paste of a printed wiring board, and other various copper and copper alloys.
- a novel blackening treatment that can sufficiently blacken articles containing silver-based metals such as silver, silver alloys, etc. without impairing the smoothness of copper-based metals or silver-based metals It is to provide a composition for use.
- the present inventor has intensively studied to achieve the above-mentioned purpose. As a result, it contains at least one water-soluble metal compound selected from the group consisting of a water-soluble palladium compound, a water-soluble ruthenium compound, and a water-soluble silver compound, and further contains a halide and a specific compound containing a nitrogen atom.
- the smoothness of copper-based metals and silver-based metals is impaired by treating articles containing copper-based metals, such as copper and copper alloys, or articles containing silver-based metals, such as silver and silver alloys, using the aqueous solutions they contain.
- the present inventors have found that the copper-based metal or the silver-based metal can be sufficiently blackened to reduce the reflectivity and improve the decorativeness, thereby completing the present invention.
- the present invention provides the following copper-based or silver-based metal blackening composition and a copper-based or silver-based blackening method.
- Item 1 at least one water-soluble metal compound selected from the group consisting of a water-soluble palladium compound, a water-soluble ruthenium compound, and a water-soluble silver compound;
- IIi at least one halide selected from the group consisting of hydrohalic acids, metal halides and ammonium halides; and
- a composition for blackening treatment of a copper-based metal or a silver-based metal comprising an aqueous solution containing at least one nitrogen atom-containing compound selected from the group consisting of: Item 2.
- a water-soluble palladium compound, a water-soluble ruthenium compound, and a water-soluble silver compound at least one water-soluble metal compound selected from the group consisting of water-soluble silver compounds as a concentration of the metal component of 0.0001 to 0.5 mol / L,
- alkylene diamine, polyalkylene polyamine, polyamide polyamine and 0.001 to 100 g / L of a compound containing at least one nitrogen atom selected from the group consisting of crosslinked products of polyamide polyamines
- a composition for blackening treatment of a copper-based metal or a silver-based metal comprising
- Item 3 An article containing a copper-based metal made of copper or a copper alloy, or an article containing a silver-based metal made of silver or a silver alloy as a treatment object, the composition for blackening treatment according to claim 1 or 2 being treated.
- an article containing a copper-based metal such as copper metal or copper alloy or a silver-based metal such as silver metal or silver alloy is treated, without impairing smoothness or appearance.
- the copper-based metal part or the silver-based metal part can be uniformly blackened.
- a circuit formed from a copper circuit or a silver paste used for a touch panel, a liquid crystal display, or a silver paste, a coating portion, etc. without reducing the accuracy of wiring, It can be blackened uniformly to reduce reflection.
- the copper-based metal portions or silver-based metal portions are uniformly blackened to provide a good decorative appearance. Can be granted.
- the blackening composition of the present invention is an aqueous solution containing the following components (i) to (iii) as active ingredients.
- a compound containing a kind of nitrogen atom is an aqueous solution containing the following components (i) to (iii) as active ingredients.
- the blackening composition of the present invention uses at least one water-soluble metal compound selected from the group consisting of a water-soluble palladium compound, a water-soluble ruthenium compound, and a water-soluble silver compound.
- any palladium compound that is soluble in the blackening composition of the present invention can be used without particular limitation.
- Specific examples include palladium chloride, palladium sulfate, palladium oxide, palladium iodide, palladium bromide, palladium nitrate, palladium acetate, tetraammine palladium chloride, dinitrodiammine palladium, dichlorodiethylenediamine palladium, and the like.
- the water-soluble ruthenium compound may be a ruthenium compound that is soluble in the blackening composition of the present invention.
- Specific examples include ruthenium chloride, ruthenium nitrate, ruthenate (sodium ruthenate, potassium ruthenate, etc. ) Ruthenium oxide and the like.
- the water-soluble silver compound may be a silver compound that is soluble in the blackening composition of the present invention.
- Specific examples include silver nitrate, silver hypocyano acid, silver acetate, silver oxide, silver methanesulfonate, silver sulfide, silver chloride, and the like.
- the water-soluble palladium compound, water-soluble ruthenium compound, and water-soluble silver compound can be used singly or in combination of two or more of the same or different compounds.
- the concentration of the water-soluble metal compound is preferably about 0.0001 to 0.5 mol / L, preferably about 0.001 to 0.1 mol / L, as the concentration of the metal component contained in the water-soluble metal compound. More preferred. If the concentration of the water-soluble metal compound is too low, the copper-based metal and the silver-based metal cannot be sufficiently blackened. On the other hand, if the concentration is too high, the cost increases, which is not preferable.
- (Ii) Halide It is necessary to add at least one halide selected from the group consisting of hydrohalic acid, metal halide and ammonium halide to the blackening composition of the present invention. By adding these halides, the water-soluble metal compound can be stably present in the aqueous solution.
- halide chloride, bromide, iodide and the like can be used.
- halides include hydrohalic acids such as hydrochloric acid, hydrobromic acid and hydroiodic acid; alkali metal halides such as sodium chloride and potassium bromide; alkaline earths such as magnesium chloride and calcium iodide
- metal halides such as metal halides
- ammonium halides such as ammonium chloride and ammonium bromide.
- these halides can be used singly or in combination of two or more.
- the concentration of the halide is preferably about 0.1 to 500 g / L, more preferably about 1 to 300 g / L. If the halide concentration is too low, the stability of the treatment solution decreases, and if the halide concentration is too high, the cost increases, which is not preferable.
- Nitrogen atom-containing compound In the present invention, it is necessary to use a compound containing at least one nitrogen atom selected from the group consisting of alkylenediamine, polyalkylene polyamine, polyamide polyamine and a crosslinked product of polyamide polyamine.
- a copper-based metal By performing blackening treatment of a copper-based metal or a silver-based metal using a blackening composition containing a compound containing these specific nitrogen atoms in addition to a water-soluble metal compound and a halide, a copper-based metal It becomes possible to sufficiently blacken the metal or the silver-based metal.
- the concentration of the nitrogen atom-containing compound is preferably about 0.001 to 100 g / L, more preferably about 0.01 to 50 g / L. If the concentration of the nitrogen atom-containing compound is outside the above range, the copper-based metal or silver-based metal cannot be sufficiently blackened, which is not preferable.
- Alkylenediamine Specific examples of the alkylene diamine include 1,2-propanediamine, 1,3-propanediamine, hexamethylenediamine and the like.
- polyalkylene polyamine examples include diethylenetriamine, triethylenetetramine, tetraethylenepentamine, pentaethylenehexamine, iminobispropylamine, 3-azahexane-1,6-diamine, and 4,7-diazadecane-1,10-diamine. Etc.
- (C) Polyamide polyamine Among the nitrogen atom-containing compounds used in the present invention, as the polyamide polyamine, for example, those obtained by polycondensation of a polyamine and a dibasic carboxylic acid compound can be used. In addition to the polyamine and the dibasic carboxylic acid compound, another component may be reacted. Examples of such components include alkylating agents, ureas, oxidizing agents, and alicyclic compounds having at least one active hydrogen.
- the polyamine at least one compound selected from the group consisting of alkylene diamines and polyalkylene polyamines can be used.
- a compound having two primary amino groups and these primary amino groups bonded via an alkylene to which a secondary amino group may be bonded can be used.
- alkylenediamines include 1,2-propanediamine, 1,3-propanediamine, hexamethylenediamine, and the like.
- polyalkylenepolyamines examples include diethylenetriamine, Examples include triethylenetetramine, tetraethylenepentamine, pentaethylenehexamine, iminobispropylamine, 3-azahexane-1,6-diamine, 4,7-diazadecane-1,10-diamine, and the like. These polyamines can be used singly or in combination of two or more. Of these, diethylenetriamine and triethylenetetramine are industrially advantageous. If desired, a small amount of monoamine or ammonia can be used in combination with the polyamine.
- dibasic carboxylic acid compound a dibasic carboxylic acid having two carboxyl groups in the molecule, a compound derived from the dibasic carboxylic acid, for example, an ester, an acid anhydride, or the like is used. Can do.
- the dibasic carboxylic acid compound may be aliphatic, aromatic or alicyclic.
- Examples of the free dibasic carboxylic acid include aliphatic dicarboxylic acids such as succinic acid, glutaric acid, adipic acid, sebacic acid, maleic acid and fumaric acid; aromatic dicarboxylic acids such as phthalic acid, isophthalic acid and terephthalic acid Tetrahydrophthalic acid, hexahydrophthalic acid, cyclohexane-1,3- or -1,4-dicarboxylic acid, cyclopentanedicarboxylic acid, 3- or 4-methyltetrahydrophthalic acid, 3- or 4-methylhexahydro
- Examples include alicyclic dicarboxylic acids such as phthalic acid.
- the position of the unsaturated bond is not particularly limited. The same applies to the following.
- dibasic carboxylic acid esters mono- or di-esters of the above free acid and lower alcohol, polyesters of the above free acid and glycols, and the like can be used.
- acid anhydrides include succinic anhydride, phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, 3- or 4-methyltetrahydrophthalic anhydride, 3- or 4-methylhexahydroanhydride And phthalic acid.
- Polyester which is a reaction product of dibasic carboxylic acid and glycols is also advantageously used, and those having a free carboxyl group are particularly preferred.
- the glycols used here include alkylene glycols such as ethylene glycol, propylene glycol and butanediol, cycloalkylene glycols such as cyclopentanediol and cyclohexanediol, alkenylene glycols such as butenediol and octenediol, and diethylene glycol. , Dialkylene glycol, triethylene glycol, polyethylene glycol, polyalkylene glycols such as polytetramethylene glycol, ethylene oxide adducts of bisphenol A, and the like.
- a dibasic carboxylic acid type compound can be used individually by 1 type or in combination of 2 or more types.
- the reaction between the polyamine and the dibasic carboxylic acid compound is a polycondensation reaction by dehydration or dealcoholization, whereby a polyamide polyamine is formed.
- the amount of the dibasic carboxylic acid compound used can usually be in the range of 0.1 to 2 moles per mole of polyamine and in the range of 0.2 to 1.2 moles. Is preferred.
- a mineral acid, a sulfonic acid or the like can be used as a catalyst.
- mineral acids include hydrochloric acid, sulfuric acid, nitric acid, phosphoric acid, and examples of sulfonic acids include benzenesulfonic acid, paratoluenesulfonic acid, and the like.
- sulfuric acid, benzenesulfonic acid, paratoluenesulfonic acid and the like are preferable.
- the amount used is usually about 0.005 to 0.1 mol times, preferably about 0.01 to 0.05 mol times based on the total amount of primary and secondary amino groups of the polyamine. And it is sufficient.
- Examples of the method of reacting the polyamine and the dibasic carboxylic acid compound include a method of reacting at about 50 to 250 ° C. under normal pressure or reduced pressure while removing water and the like. In order to control a rapid exotherm at the initial stage of the reaction, for example, water may be added and reacted. Water may be an amount necessary for suppressing rapid heat generation, and is usually about 0.1 to 30 parts by weight with respect to 100 parts by weight of the total amount of polyamine and dibasic carboxylic acid compound. .
- This reaction is usually performed until the viscosity of the reaction solution containing the polycondensate polyamidopolyamine obtained is measured at 25 ° C. and a water content of 50% by weight is about 50 mPas or more, preferably about 100 to 1000 mPas. Just do it.
- the polyamide polyamine may be obtained by further reacting other components in addition to the polyamine and the dibasic carboxylic acid compound.
- Such components include at least one compound selected from the group consisting of alkylating agents, ureas, oxidizing agents, and alicyclic compounds having at least one active hydrogen (hereinafter referred to as “reforming component”).
- reforming component alicyclic compounds having at least one active hydrogen
- examples of the alkylating agent include methyl chloride, methyl bromide, methyl iodide, ethyl chloride, ethyl bromide, ethyl iodide, allyl chloride, benzyl chloride, 2-chloroethyldimethyl.
- Halogenated hydrocarbons such as amines
- Halogenated acetates such as methyl chloroacetate, methyl bromoacetate, ethyl chloroacetate, ethyl bromoacetate
- ethylene chlorohydrin 3-chloro-2-hydroxypropyltrimethylammonium chloride, etc.
- Examples include chlorohydrins; epoxy compounds such as propylene oxide, glycidol, styrene oxide, and 1,2- epoxybutane; alkyl sulfates such as dimethyl sulfate and diethyl sulfate. These alkylating agents can be used singly or in combination of two or more. Of these, halogenated hydrocarbons, halogenated acetates, epoxy compounds not containing halogen, alkyl sulfates, and the like are preferable, and alkyl sulfates are particularly preferable.
- Q represents oxygen or sulfur
- R represents hydrogen or alkyl having about 1 to 4 carbon atoms.
- Specific examples include urea, thiourea, guanylurea, methylurea, dimethylurea and the like.
- Ureas can be used singly or in combination of two or more. From an industrial point of view, urea is preferred.
- oxidizing agent examples include hydrogen peroxide, ozone, alkali metal hypochlorite, inorganic or organic peroxides, and hydrogen peroxide is particularly preferable.
- an alicyclic compound having at least one active hydrogen an alicyclic amine, an alicyclic epoxy compound, or the like can be used.
- the alicyclic amine is a compound having an alicyclic ring having about 5 to 12 ring carbon atoms, preferably a cyclohexane ring, and at least one primary or secondary amino group. is there.
- the amino group may be directly bonded to the alicyclic ring, or may be indirectly bonded to the alicyclic ring via a linking group such as alkylene.
- alicyclic amine having at least one active hydrogen examples include cyclohexylamine, dicyclohexylamine, N-methylcyclohexylamine, 1,3- or 1,4-diaminocyclohexane, 4,4′-diamino-3, 3'-dimethyldicyclohexylmethane, 4,4'-diamino-3,3'-dimethylbicyclohexyl, isophoronediamine, 1,3-, 1,2- or 1,4-bis (aminomethyl) cyclohexane, N-amino Propylcyclohexylamine, 1,5- or 2,6-bis (aminomethyl) octahydro-4,7-methanoindene, 2,2-bis (4-aminocyclohexyl) propane, bis (4-aminocyclohexyl) methane, 4 , 4'-Oxybis (cyclohexylamine), 4,4'-s
- reforming components that is, an alicyclic compound having at least one alkylating agent, urea, oxidizing agent, and active hydrogen can be used alone or in combination of two or more.
- the modifying component can be reacted at any stage of the polyamide polyamine production process. For example, after the polyamine is reacted with a dibasic carboxylic acid compound to form a polyamide polyamine, the resulting polyamide polyamine can be reacted with a modifying component.
- the modifying component reacts with the primary, secondary or tertiary amino group of the polyamide polyamine or the primary or secondary amino group of the polyamine polyamide, thereby increasing the valence of the amino group.
- a quaternary amino group is formed by reaction with a tertiary amino group, and the degree of cationization increases.
- the reaction between the modifying component and the polyamide polyamine is usually carried out in an aqueous solution, and the water content thereof is comparable to or higher than the water content in the reaction between the polyamide polyamine and the crosslinkable compound described below. A high water content is preferred.
- the reaction temperature with the reforming component is usually about 10 to 80 ° C., preferably about 15 to 75 ° C., and particularly preferably about 20 to 70 ° C.
- the amount of the modifying component used is usually about 0.3 to 2 mole times, preferably about 0.5 to 1 mole times the total amount of primary, secondary and tertiary amino groups of the polyamide polyamine. do it.
- (D) Crosslinked product of polyamide polyamine
- a product obtained by reacting the above-described polyamide polyamine with a crosslinkable compound can be used.
- crosslinkable compound at least one compound selected from the group consisting of aldehydes, epihalohydrins, ⁇ , ⁇ -dihalo- ⁇ -hydrins, glycidyl compounds, and isocyanates can be used.
- the aldehydes may be compounds having at least one —CHO group in the molecule, such as alkyl aldehydes such as formaldehyde, acetaldehyde, propionaldehyde, glyoxal, propanedial, Examples thereof include alkyldialdehydes such as butane dial. Industrially, formaldehyde, glyoxal, etc. are advantageous.
- epihalohydrins are compounds represented by the following general formula.
- X represents a halogen atom such as chlorine, bromine or iodine
- w is 1, 2 or 3.
- epihalohydrins include epichlorohydrin and epibromohydrin.
- ⁇ , ⁇ -dihalo- ⁇ -hydrins are compounds represented by the following general formula.
- Y and Z are the same or different and each represents a halogen atom such as chlorine, bromine or iodine.
- ⁇ , ⁇ -dihalo- ⁇ -hydrins include 1,3-dichloro-2-propanol.
- the glycidyl compound is a compound having at least two glycidyl groups in the molecule.
- alkylene glycol diglycidyl ethers such as ethylene glycol diglycidyl ether and propylene glycol diglycidyl ether
- polyoxyalkylene glycol diglycidyl ethers such as polyethylene glycol diglycidyl ether and polypropylene glycol diglycidyl ether
- resorcindi Aromatic diglycidyl ethers such as glycidyl ether, bisphenol A diglycidyl ether; trimethylolpropane di- or tri-glycidyl ether, sorbitol di-, tri-, tetra-, penta- or hexa-glycidyl ether, pentaerythritol di- , Tri- or tetra-glycidyl ether, and the like.
- isocyanates are compounds having at least two isocyanato groups in the molecule. Specific examples include isophorone diisocyanate, 3- (2-isocyanatocyclohexyl) propyl isocyanate, bis (isocyanatomethyl) cyclohexane, isopropylidenebis (cyclohexyl isocyanate), transcyclohexane-1,4-diisocyanate, bicycloheptane triisocyanate.
- Aliphatic isocyanates such as hexamethylene diisocyanate, trimethylhexane-1,6-diisocyanate, methyl 2,6-diisocyanatohexanoate (also called lysine diisocyanate) ;; Tolylene diisocyanate, triphenyl Methane triisocyanate, tris (isocyanatophenyl) thiophosphate, phenylene diisocyanate, dianisidine di Aromatic isocyanates such as isocyanate and diphenyl ether diisocyanate are listed.
- aldehydes, epihalohydrins, ⁇ , ⁇ -dihalo- ⁇ -hydrins, glycidyl compounds and crosslinkable compounds consisting of isocyanates can be used singly or in combination of two or more.
- aldehydes, epihalohydrins, ⁇ , ⁇ -dihalo- ⁇ -hydrins, glycidyl compounds and isocyanates those belonging to different types can be used in combination.
- the order of reacting the crosslinkable compound is arbitrary, and is not particularly limited.
- the crosslinkable compound is reacted therewith. be able to.
- the primary amine part reacts with the crosslinkable compound to form a crosslinked structure.
- the tertiary amino group formed by the reaction further reacts with the crosslinkable compound to become a quaternary amino group, and the degree of cationization increases.
- the polyamide polyamine contains a modifying component
- the polyamide polyamine obtained by reacting the modifying component may be reacted with a crosslinkable compound, or the polyamine and the dibasic carboxylic acid compound.
- the polyamide polyamine obtained by polycondensation may be reacted with a crosslinkable compound and then the modifying component may be reacted.
- the amount of the crosslinkable compound used can usually be in the range of about 0.1 to 2 mol times the total amount of primary and secondary amino groups of the polyamide polyamine, and is 0.2 to 1.1 mol. It is preferable that the range is about double.
- This reaction is usually carried out in an aqueous solution.
- the water content is usually about 30 to 80% by weight, preferably about 40 to 70% by weight. If the reaction is carried out with a water content of more than 80%, the reaction rate tends to decrease, which is not preferred. If the reaction is carried out with a water content of less than 30%, the reaction rate tends to increase, and the reaction solution gels. It is not preferable because it tends to be.
- the reaction temperature of the polyamide polyamine and the crosslinkable compound is usually about 10 to 80 ° C., preferably about 15 to 70 ° C., more preferably about 20 to 60 ° C.
- the reaction between the polyamide polyamine and the crosslinkable compound may be performed, for example, until the amount of the unreacted crosslinkable compound is about 10% or less with respect to the amount of the crosslinkable compound used.
- the crosslinked product of polyamide polyamine preferably has a viscosity of about 1 to 300 mPas, preferably about 2 to 200 mPas, measured at 25 ° C. with a water content of 85% by weight.
- the weight average molecular weight of the polyamide polyamine that gives this viscosity is about 1,000 to 1,000,000.
- the degree of cationization which means the ratio of quaternary amino groups to the total amount of primary, secondary, tertiary, quaternary amino groups contained in the water-soluble resin, is preferably 10% to 90%.
- Blackening treatment method of copper-based metal or silver-based metal is a copper-based metal made of copper or a copper alloy or a silver-based metal made of silver or a silver alloy.
- a copper-based metal made of copper or a copper alloy or a silver-based metal made of silver or a silver alloy.
- the copper alloy and the silver alloy for example, an alloy containing 50% by weight or more, preferably 70% by weight or more of copper or silver can be used.
- copper-based metals include circuit parts of printed wiring boards, electroless plating methods, electroplating methods, etc.
- the formed copper circuit part can be mentioned.
- the silver-based metal include a circuit portion and a coating portion made of silver paste formed on a semiconductor package, an electronic component, and the like.
- the blackening treatment can be performed using these copper-based metal or silver-based metal as a treatment target. Thereby, the reflectance of a circuit, a film, etc. by a copper circuit part or a silver paste can be reduced.
- the copper-based metal portion or the silver light metal portion is uniformly blackened. Good decorativeness can be imparted.
- the method for blackening copper-based metal or silver-based metal using the blackening treatment composition of the present invention is not particularly limited.
- a degreasing treatment or a treatment of immersing in an acidic solution such as sulfuric acid or hydrochloric acid is performed according to a conventional method, and after washing with water, the composition for blackening treatment is treated with a copper-based metal or What is necessary is just to contact a silver-type metal.
- a specific method for bringing the blackening composition into contact with the copper-based metal or the silver-based metal is not particularly limited. What is necessary is just to immerse the articles
- the blackening treatment of the copper-based metal or the silver-based metal can also be performed by a method of spraying the blackening composition on the surface of the copper-based metal or the silver-based metal.
- the liquid temperature of the blackening composition is usually preferably about 10 to 90 ° C, and about 20 to 60 ° C. More preferably.
- the pH of the blackening composition during blackening treatment is preferably about 0 to 13, more preferably about 0 to 8.
- the treatment time for the blackening treatment may be a time at which the desired blackening can be achieved. In the case of treatment by an immersion method, it is usually about 0.1 to 10 minutes.
- Production Example 1 A reaction vessel equipped with a thermometer, Liebig condenser and stirrer was charged with 55 parts by weight of diethylenetriamine, 29 parts by weight of phthalic acid, 10 parts by weight of water and 6 parts by weight of 98% sulfuric acid, and dehydration reaction was carried out at 150 to 160 ° C. for 15 hours. I let you. Next, ion exchange water is added to the obtained reaction mixture to adjust the resin concentration to 50% by weight, and an aqueous solution of a polyamidoamine resin having a viscosity of 680 Pas and a total amount of primary and secondary amino groups of 2.578 mmol / g. Obtained. This aqueous solution is designated as polyamide polyamine 1.
- Production Example 2 A reaction vessel equipped with a thermometer, Liebig condenser and stirrer was charged with 72 parts by weight of diethylenetriamine, 22 parts by weight of adipic acid, 3 parts by weight of water and 3 parts by weight of 98% sulfuric acid, and dehydration reaction was carried out at 150 to 160 ° C. for 15 hours. I let you. Next, ion exchange water is added to the resulting reaction mixture to adjust the resin concentration to 50% by weight, and an aqueous solution of polyamidoamine resin having a viscosity of 650 Pas and a total amount of primary and secondary amino groups of 3.1 mmol / g is prepared. Obtained. This aqueous solution is designated as polyamide polyamine 2.
- Production Example 3 A reaction vessel equipped with a thermometer, a Liebig condenser and a stirrer was charged with 30 parts by weight of triethylenetriamine, 30 parts by weight of succinic acid, 30 parts by weight of water and 10 parts by weight of 98% sulfuric acid, and the mixture was heated at 150 to 160 ° C. for 15 hours. Dehydration reaction was performed. Next, ion exchange water is added to the resulting reaction mixture to adjust the resin concentration to 50% by weight, and an aqueous solution of a polyamidoamine resin having a viscosity of 620 Pas, a total amount of primary and secondary amino groups of 3.2 mmol / g is added. Obtained. This aqueous solution is designated as polyamide polyamine 3.
- Production Example 4 A reaction vessel equipped with a thermometer, Liebig condenser and stirrer was charged with 39 parts by weight of diethylenetriamine, 40 parts by weight of maleic acid, 20 parts by weight of water and 1 part by weight of 98% sulfuric acid, and dehydration reaction was carried out at 150 to 160 ° C. for 15 hours. I let you. Next, ion exchange water is added to the resulting reaction mixture to adjust the resin concentration to 50% by weight, and an aqueous solution of polyamidoamine resin having a viscosity of 611 Pas, a total amount of primary and secondary amino groups of 3.0 mmol / g. Obtained. This aqueous solution is designated as polyamide polyamine 4.
- Production Example 5 A reaction vessel equipped with a thermometer, a reflux condenser and a stirrer was charged with 55.1 parts by weight of the polyamide polyamine 1 obtained in Production Example 1 and 30.2 parts by weight of water, and 10 wt. The portion was added dropwise over 2 hours and then reacted for 4 hours.
- aqueous solution of a water-soluble resin having a cationization degree of 19.2% by weight and a total amount of primary, secondary and tertiary amino groups of 0.387 mmol / g was obtained. This aqueous solution is referred to as a polyamide polyamine crosslinked product 1.
- Production Example 6 In the same manner as in Production Example 5, 35.1 parts by weight of polyamide polyamine 1 and 31.2 parts by weight of water were charged, and 23.3 parts by weight of epichlorohydrin was added dropwise over 5 hours while keeping the temperature at 30 ° C. Reacted. After 10.7 parts by weight of ion-exchanged water was added dropwise thereto, the temperature was raised to 50 ° C. Immediately after reaching 50 ° C., 1.6 parts by weight of water was added dropwise, the pH of the reaction mixture was adjusted to 3.4 with sulfuric acid, water was further added to dilute the resin concentration to 15%, and a viscosity of 6.4 mPas.
- aqueous solution of a water-soluble resin having a cationization degree of 29.0% and a total amount of primary, secondary and tertiary amino groups of 0.444 mmol / g was obtained.
- This aqueous solution is referred to as polyamide polyamine cross-linked product 2.
- Production Example 7 A reaction vessel equipped with a thermometer, a reflux condenser and a stirrer was charged with 30.3 parts by weight of polyamide polyamine 2 obtained in Production Example 2 and 39 parts by weight of water, and while maintaining the temperature at 30 ° C., 18 parts by weight of epichlorohydrin was added. After dripping over 2 hours, it was made to react for 6 hours.
- Production Example 8 A reaction vessel equipped with a thermometer, a reflux condenser and a stirrer was charged with 30.3 parts by weight of the polyamidopolyamine 2 obtained in Production Example 2 and 29.9 parts by weight of water. After 11.1 parts by weight of glycidyl ether was added dropwise over 2 hours, the reaction was allowed to proceed for 4 hours.
- Example 1 Degreased by using a rolled copper plate of 5cm x 5cm x 0.2mm in thickness as the object to be treated, and dipping in a commercially available degreasing agent (trade name: DP-320 Clean, manufactured by Okuno Pharmaceutical Co., Ltd.) for 1 minute at 45 ° C Treated and washed with water. Thereafter, the article to be treated was blackened by immersing it in each of the blackening treatment solutions No. 1 to No. 10 having the compositions shown in Table 1 below at 30 ° C. for 3 minutes.
- a commercially available degreasing agent trade name: DP-320 Clean, manufactured by Okuno Pharmaceutical Co., Ltd.
- the color tone was observed visually and the reflectance of light with a wavelength of 400 nm and 700 nm was further measured using the light reflectance measuring device.
- a printed wiring board in which a wiring circuit made of copper with a line width of about 3 to 5 ⁇ m is formed on a substrate made of resin is used as an object to be processed, and a blackening process is performed by the same process as the above method.
- the surface and side surfaces of the part were observed with a scanning electron microscope (SEM) at a magnification of 4000 times to evaluate the smoothness of the wiring part. The observation result is indicated by a mark “ ⁇ ” when smooth, and a mark “X” when rough.
- SEM scanning electron microscope
- a sulfide treatment a treatment of immersing in an aqueous solution containing 5 ml / L of ammonium sulfate at 25 ° C. for 3 minutes is performed.
- a chlorite treatment sodium chlorite is 30 g / L
- sodium hydroxide is 10 g. / L
- 10-g / L of sodium phosphate were immersed in an aqueous solution at 25 ° C. for 3 minutes.
- the blackness can be blackened to some extent, but the reflectance is not sufficiently lowered, and the side surface and the surface of the copper circuit are roughened and the smoothness is lowered. . Moreover, when the chlorite treatment was performed, the degree of blackening was insufficient, and the reflectance could not be reduced sufficiently.
- the copper material could be sufficiently blackened and the reflectivity could be greatly reduced without substantially reducing the smoothness.
- Example 2 Blacking treatment was performed on the rolled copper sheet in the same manner as in Example 1 except that the blackening treatment solutions No. 11 to 30 having the compositions shown in Table 3 and Table 4 below were used.
- Example 5 For each sample after the treatment, the color tone was observed in the same manner as in Example 1, and the reflectance of light having wavelengths of 400 nm and 700 nm was measured. Further, in the same manner as in Example 1, the printed wiring board on which the wiring circuit made of copper was formed was subjected to blackening treatment, and the smoothness of the wiring portion was evaluated. The results are shown in Table 5 below.
- Example 3 Silver powder (Dowwa High-Tech Co., Ltd .: Silver Powder ST) 75% by weight, Glass Frit (Okuno Pharmaceutical Co., Ltd .: GF3550) 5% by weight, and Oil (Okuno Pharmaceutical Co., Ltd .: OIL-6018) 20% by weight
- a silver paste consisting mainly of 5% is prepared, screen-printed on the entire surface of an alumina substrate having a length of 5 cm, a width of 5 cm, and a thickness of 0.5 mm, and baked at 600 ° C. for 10 minutes to form a silver paste film on the alumina substrate. Formed.
- the silver paste film was blackened in the same manner as in Example 1 except that the ceramic substrate on which the above-described silver paste film was formed was used as the object to be processed. In the same manner as above, the color tone was observed, and the reflectance of light having wavelengths of 400 nm and 700 nm was measured.
- the blackening treatment liquids No. 1 to 10 used in Example 1 and the treatment liquid having the same composition as the No. 11 to 30 blackening treatment liquid used in Example 2 were used. The results are shown in Tables 6 and 7 below.
- the blackening treatment liquid No. 1 to 30 as the blackening treatment composition of the present invention is used. By performing the blackening treatment, it was confirmed that the silver paste film was uniformly blackened and the reflectance was greatly reduced.
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Abstract
Description
しかしながら、上記した銅表面を酸化処理する方法では、黒色化の程度が不十分なために反射率を十分に低減することができない。また硫化物処理では、銅回路の表面や側面が粗化されて配線の精度が低下するといった問題点がある(下記特許文献2参照)
また、近年、比較的簡単な配線回路形成方法として、導電性銀ペーストを用いて回路を形成方法が実施されている。この様な銀ペーストから形成される配線回路をタッチパネル、液晶ディスプレイなどの表示装置に用いる場合にも、銀を主成分とする導体部分を黒色化して反射率を低減することが要求される。
項1. (i)水溶性パラジウム化合物、水溶性ルテニウム化合物、及び水溶性銀化合物からなる群から選ばれた少なくとも一種の水溶性金属化合物、
(ii)ハロゲン化水素酸、金属ハロゲン化物及びハロゲン化アンモニウムからなる群から選ばれた少なくとも一種のハロゲン化物、並びに
(iii)アルキレンジアミン、ポリアルキレンポリアミン、ポリアミドポリアミン及びポリアミドポリアミンの架橋化物からなる群から選ばれた少なくとも一種の窒素原子含有化合物
を含む水溶液からなる銅系金属又は銀系金属の黒化処理用組成物。
項2. (i)水溶性パラジウム化合物、水溶性ルテニウム化合物、及び水溶性銀化合物水溶性銀化合物からなる群から選ばれた少なくとも一種の水溶性金属化合物を金属成分の濃度として0.0001~0.5mol/L、
(ii)ハロゲン化水素酸、金属ハロゲン化物及びハロゲン化アンモニウムからなる群から選ばれた少なくとも一種のハロゲン化物を0.1~500g/L、並びに
(iii)アルキレンジアミン、ポリアルキレンポリアミン、ポリアミドポリアミン及びポリアミドポリアミンの架橋化物からなる群から選ばれた少なくとも一種の窒素原子を含む化合物を0.001~100g/L、
含む水溶液からなる銅系金属又は銀系金属の黒化処理用組成物。
項3. 銅若しくは銅合金からなる銅系金属を含む物品、又は銀若しくは銀合金からなる銀系金属を含む物品を被処理物として、請求項1又は2に記載の黒化処理用組成物に該被処理物を接触させることを特徴とする、銅系金属又は銀系金属の黒化方法。
本発明の黒化処理用組成物は、下記(i)~(iii)の成分を有効成分として含有する水溶液である。
(i)水溶性パラジウム化合物、水溶性ルテニウム化合物、及び水溶性銀化合物からなる群から選ばれた少なくとも一種の水溶性金属化合物、
(ii)金属ハロゲン化物及びハロゲン化アンモニウムからなる群から選ばれた少なくとも一種のハロゲン化物、並びに
(iii)アルキレンジアミン、ポリアルキレンポリアミン、ポリアミドポリアミン及びポリアミドポリアミンの架橋化物からなる群から選ばれた少なくとも一種の窒素原子を含む化合物。
本発明の黒化処理用組成物では、水溶性パラジウム化合物、水溶性ルテニウム化合物、及び水溶性銀化合物からなる群から選ばれた少なくとも一種の水溶性金属化合物を用いる。
本発明の黒化処理用組成物には、ハロゲン化水素酸、金属ハロゲン化物及びハロゲン化アンモニウムからなる群から選ばれた少なくとも一種のハロゲン化物を添加することが必要である。これらのハロゲン化物を添加することによって、水溶性金属化合物を水溶液中において安定に存在させることができる。
本発明では、アルキレンジアミン、ポリアルキレンポリアミン、ポリアミドポリアミン及びポリアミドポリアミンの架橋化物からなる群から選ばれた少なくとも一種の窒素原子を含む化合物を用いることが必要である。
アルキレンジアミンの具体例としては、1,2-プロパンジアミン、1,3-プロパンジアミン、ヘキサメチレンジアミン等を挙げることができる。
ポリアルキレンポリアミンの具体例としては、ジエチレントリアミン、トリエチレンテトラミン、テトラエチレンペンタミン、ペンタエチレンヘキサミン、イミノビスプロピルアミン、3-アザヘキサン-1,6-ジアミン、4,7-ジアザデカン-1,10-ジアミン等を挙げることができる。
本発明で用いる窒素原子含有化合物の内で、ポリアミドポリアミンとしては、例えば、ポリアミンと二塩基性カルボン酸系化合物とを重縮合することによって得られたものを用いることができる。また、ポリアミンと二塩基性カルボン酸系化合物に加えて、さらに他の成分を反応させたものであってもよい。この様な成分としては、アルキル化剤、尿素類、酸化剤、活性水素を少なくとも1個有する脂環式化合物等を例示できる。
ポリアミドポリアミンの架橋化物としては、上記したポリアミドポリアミンに架橋性化合物を反応させたものを用いることができる。
本発明の黒化処理用組成物による処理対象は、銅若しくは銅合金からなる銅系金属、又は銀若しくは銀合金からなる銀系金属である。銅合金及び銀合金としては、それぞれ、例えば、銅又は銀を50重量%以上、好ましくは70重量%以上含む合金を用いることができる。
温度計、リービッヒ冷却器及び攪拌機を備えた反応容器に、ジエチレントリアミン55重量部、フタル酸29重量部、水10重量部及び98%硫酸6重量部を仕込み、150~160℃で15時間、脱水反応させた。次いで、得られた反応混合物にイオン交換水を加えて樹脂分濃度を50重量%に調整し、粘度680Pas、1級及び2級アミノ基の合計量2.578mmol/gのポリアミドアミン樹脂の水溶液を得た。この水溶液をポリアミドポリアミン1とする。
温度計、リービッヒ冷却器及び攪拌機を備えた反応容器に、ジエチレントリアミン72重量部、アジピン酸22重量部、水3重量部及び98%硫酸3重量部を仕込み、150~160℃で15時間、脱水反応させた。次いで、得られた反応混合物にイオン交換水を加えて樹脂分濃度を50重量%に調整し、粘度650Pas、1級及び2級アミノ基の合計量3.1mmol/gのポリアミドアミン樹脂の水溶液を得た。この水溶液をポリアミドポリアミン2とする。
温度計、リービッヒ冷却器及び攪拌機を備えた反応容器に、トリエチレントリアミン30重量部、コハク酸30 重量部、水30重量部及び98%硫酸10重量部を仕込み、150~160℃で15時間、脱水反応させた。次いで、得られた反応混合物にイオン交換水を加えて樹脂分濃度を50重量%に調整し、粘度620Pas、1級及び2級アミノ基の合計量3.2mmol/gのポリアミドアミン樹脂の水溶液を得た。この水溶液をポリアミドポリアミン3とする。
温度計、リービッヒ冷却器及び攪拌機を備えた反応容器に、ジエチレントリアミン39重量部、マレイン酸40 重量部、水20重量部及び98%硫酸1重量部を仕込み、150~160℃で15時間、脱水反応させた。次いで、得られた反応混合物にイオン交換水を加えて樹脂分濃度を50重量%に調整し、粘度611Pas、1級及び2級アミノ基の合計量3.0mmol/gのポリアミドアミン樹脂の水溶液を得た。この水溶液をポリアミドポリアミン4とする。
温度計、還流冷却器及び攪拌機を備えた反応容器に、製造例1で得たポリアミドポリアミン1を55.1重量部と水を30.2 重量部仕込み、30℃に保温しながら、エピクロルヒドリン10 重量部を2時間かけて滴下した後、4時間反応させた。
製造例5と同様にして、ポリアミドポリアミン1を35.1重量部と水を31.2 重量部仕込み、30 ℃ に保温しながら、エピクロルヒドリン23.3重量部を5時間かけ滴下した後、10 時間反応させた。これにイオン交換水10.7 重量部を滴下した後、温度を50℃ まで昇温した。50℃に到達後、直ちに水1.6重量部を滴下し、硫酸により反応混合物のpHを3.4に調整し、更に水を加えて樹脂濃度を15%に希釈して、粘度6.4mPas 、カチオン化度29.0 % 、一級、二級及び三級アミノ基の合計量0.444 mmol/gの水溶性樹脂の水溶液を得た。この水溶液をポリアミドポリアミンの架橋物2とする。
温度計、還流冷却器及び攪拌機を備えた反応容器に、製造例2で得たポリアミドポリアミン2を30.3重量部と水を39 重量部仕込み、30℃に保温しながら、エピクロルヒドリン18 重量部を2時間かけて滴下した後、6時間反応させた。
温度計、還流冷却器及び攪拌機を備えた反応容器に、製造例2で得たポリアミドポリアミン2を30.3重量部と水を29.9 重量部仕込み、30℃に保温しながら、ポリエチレングリコールジグリシジルエーテル11.1 重量部を2時間かけて滴下した後、4時間反応させた。
縦5cm×5cm×厚さ0.2mmの圧延銅板を被処理物として用い、市販の浸漬用脱脂剤(奥野製薬工業製、商標名:DP-320クリーン)に45℃で1分間浸漬して脱脂処理を行い、水洗した。その後、該被処理物を下記表1に示す組成のNo.1~10の各黒化処理液中に、30℃で3分間浸漬して黒化処理を行った。
下記表3及び表4に示す組成のNo.11~30の各黒化処理液を用いること以外は、実施例1と同様にして、圧延銅板の黒化処理を行った。
銀粉(同和ハイテック(株)製:銀粉ST)75重量%、ガラスフリット(奥野製薬工業(株)製:GF3550)5重量%、及びオイル(奥野製薬工業(株)製:OIL-6018)20重量%を主成分とする銀ペーストを調製し、これを縦5cm×横5cm×厚さ0.5mmのアルミナ基板の全面にスクリーン印刷し、600℃で10分間焼成して、アルミナ基板上に銀ペースト皮膜を形成した。
Claims (3)
- (i)水溶性パラジウム化合物、水溶性ルテニウム化合物、及び水溶性銀化合物からなる群から選ばれた少なくとも一種の水溶性金属化合物、
(ii)ハロゲン化水素酸、金属ハロゲン化物及びハロゲン化アンモニウムからなる群から選ばれた少なくとも一種のハロゲン化物、並びに
(iii)アルキレンジアミン、ポリアルキレンポリアミン、ポリアミドポリアミン及びポリアミドポリアミンの架橋化物からなる群から選ばれた少なくとも一種の窒素原子含有化合物
を含む水溶液からなる銅系金属又は銀系金属の黒化処理用組成物。 - (i)水溶性パラジウム化合物、水溶性ルテニウム化合物、及び水溶性銀化合物水溶性銀化合物からなる群から選ばれた少なくとも一種の水溶性金属化合物を金属成分の濃度として0.0001~0.5mol/L、
(ii)ハロゲン化水素酸、金属ハロゲン化物及びハロゲン化アンモニウムからなる群から選ばれた少なくとも一種のハロゲン化物を0.1~500g/L、並びに
(iii)アルキレンジアミン、ポリアルキレンポリアミン、ポリアミドポリアミン及びポリアミドポリアミンの架橋化物からなる群から選ばれた少なくとも一種の窒素原子を含む化合物を0.001~100g/L、
含む水溶液からなる銅系金属又は銀系金属の黒化処理用組成物。 - 銅若しくは銅合金からなる銅系金属を含む物品、又は銀若しくは銀合金からなる銀系金属を含む物品を被処理物として、請求項1又は2に記載の黒化処理用組成物に該被処理物を接触させることを特徴とする、銅系金属又は銀系金属の黒化方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/310,947 US10184186B2 (en) | 2014-06-24 | 2015-06-15 | Composition for blackening copper-based or silver-based metals |
CN201580032533.0A CN106460188B (zh) | 2014-06-24 | 2015-06-15 | 铜系金属或银系金属的黑化处理用组合物 |
JP2015543179A JP5862916B1 (ja) | 2014-06-24 | 2015-06-15 | 銅系金属又は銀系金属の黒化処理用組成物 |
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TW200718347A (en) * | 2005-07-14 | 2007-05-01 | Mitsui Mining & Smelting Co | Blackening surface treated copper foil and electromagnetic wave shielding conductive mesh for front panel of plasma display using the blackening surface treated copper foil |
EP1960194B1 (en) * | 2005-12-16 | 2013-08-07 | LG Chem. Ltd. | Method for preparing conductive pattern and conductive pattern prepared by the method |
TW200907107A (en) * | 2007-07-20 | 2009-02-16 | Mec Co Ltd | Surface treating agent |
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US10184186B2 (en) | 2019-01-22 |
KR20170005443A (ko) | 2017-01-13 |
CN106460188A (zh) | 2017-02-22 |
US20170073818A1 (en) | 2017-03-16 |
KR101827765B1 (ko) | 2018-02-09 |
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