KR20090111861A - 박막 발광 다이오드칩 및 박막 발광 다이오드칩의 제조 방법 - Google Patents

박막 발광 다이오드칩 및 박막 발광 다이오드칩의 제조 방법 Download PDF

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Publication number
KR20090111861A
KR20090111861A KR1020097017989A KR20097017989A KR20090111861A KR 20090111861 A KR20090111861 A KR 20090111861A KR 1020097017989 A KR1020097017989 A KR 1020097017989A KR 20097017989 A KR20097017989 A KR 20097017989A KR 20090111861 A KR20090111861 A KR 20090111861A
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South Korea
Prior art keywords
emitting diode
light emitting
thin film
diode chip
film light
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KR1020097017989A
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English (en)
Korean (ko)
Inventor
시그프레이드 허만
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오스람 옵토 세미컨덕터스 게엠베하
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Publication of KR20090111861A publication Critical patent/KR20090111861A/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
    • H01L33/22—Roughened surfaces, e.g. at the interface between epitaxial layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/20—Making multilayered or multicoloured articles
    • B29C43/203—Making multilayered articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2011/00—Optical elements, e.g. lenses, prisms
    • B29L2011/0016—Lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Led Devices (AREA)
KR1020097017989A 2007-01-29 2008-01-22 박막 발광 다이오드칩 및 박막 발광 다이오드칩의 제조 방법 KR20090111861A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102007004304A DE102007004304A1 (de) 2007-01-29 2007-01-29 Dünnfilm-Leuchtdioden-Chip und Verfahren zur Herstellung eines Dünnfilm-Leuchtdioden-Chips
DE102007004304.1 2007-01-29
PCT/EP2008/050716 WO2008092774A1 (de) 2007-01-29 2008-01-22 Dünnfilm-leuchtdioden-chip und verfahren zur herstellung eines dünnfilm-leuchtdioden-chips

Publications (1)

Publication Number Publication Date
KR20090111861A true KR20090111861A (ko) 2009-10-27

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020097017989A KR20090111861A (ko) 2007-01-29 2008-01-22 박막 발광 다이오드칩 및 박막 발광 다이오드칩의 제조 방법

Country Status (7)

Country Link
US (1) US9142720B2 (zh)
EP (1) EP2132791B1 (zh)
KR (1) KR20090111861A (zh)
CN (1) CN101601143B (zh)
DE (1) DE102007004304A1 (zh)
TW (1) TWI396299B (zh)
WO (1) WO2008092774A1 (zh)

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EP2132791B1 (de) 2016-07-20
US20100072500A1 (en) 2010-03-25
TWI396299B (zh) 2013-05-11
CN101601143B (zh) 2013-12-25
CN101601143A (zh) 2009-12-09
DE102007004304A1 (de) 2008-07-31
WO2008092774A1 (de) 2008-08-07
US9142720B2 (en) 2015-09-22
TW200847487A (en) 2008-12-01
EP2132791A1 (de) 2009-12-16

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