KR20090093880A - 반도체 장치 - Google Patents
반도체 장치Info
- Publication number
- KR20090093880A KR20090093880A KR1020090016884A KR20090016884A KR20090093880A KR 20090093880 A KR20090093880 A KR 20090093880A KR 1020090016884 A KR1020090016884 A KR 1020090016884A KR 20090016884 A KR20090016884 A KR 20090016884A KR 20090093880 A KR20090093880 A KR 20090093880A
- Authority
- KR
- South Korea
- Prior art keywords
- source
- lead
- gate
- die pad
- semiconductor chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electrodes Of Semiconductors (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Wire Bonding (AREA)
- Die Bonding (AREA)
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| US8580612B2 (en) * | 2009-02-12 | 2013-11-12 | Infineon Technologies Ag | Chip assembly |
| US8400778B2 (en) * | 2010-02-02 | 2013-03-19 | Monolithic Power Systems, Inc. | Layout schemes and apparatus for multi-phase power switch-mode voltage regulator |
| JP5601863B2 (ja) * | 2010-03-29 | 2014-10-08 | 三菱電機株式会社 | 電力半導体装置 |
| JP5775321B2 (ja) | 2011-02-17 | 2015-09-09 | トランスフォーム・ジャパン株式会社 | 半導体装置及びその製造方法、電源装置 |
| CN102163587A (zh) * | 2011-03-23 | 2011-08-24 | 常州市兴源电子有限公司 | 集成电路封装用互连铝带 |
| CN102956509A (zh) * | 2011-08-31 | 2013-03-06 | 飞思卡尔半导体公司 | 功率器件和封装该功率器件的方法 |
| JP5676771B2 (ja) | 2011-09-30 | 2015-02-25 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| WO2013179638A1 (ja) * | 2012-05-29 | 2013-12-05 | 日本精工株式会社 | 半導体モジュール及びその製造方法 |
| JP2014187080A (ja) * | 2013-03-22 | 2014-10-02 | Panasonic Corp | 半導体素子、半導体装置及び複合モジュール |
| JP2015005623A (ja) * | 2013-06-20 | 2015-01-08 | 株式会社東芝 | 半導体装置 |
| US9263563B2 (en) * | 2013-10-31 | 2016-02-16 | Infineon Technologies Austria Ag | Semiconductor device package |
| US9536800B2 (en) | 2013-12-07 | 2017-01-03 | Fairchild Semiconductor Corporation | Packaged semiconductor devices and methods of manufacturing |
| JP6137421B2 (ja) * | 2014-12-24 | 2017-05-31 | 日本精工株式会社 | パワー半導体モジュール及びこれを用いた電動パワーステアリング装置 |
| JP2015216407A (ja) * | 2015-08-31 | 2015-12-03 | 三菱電機株式会社 | 半導体装置 |
| JP6636846B2 (ja) * | 2016-04-14 | 2020-01-29 | ローム株式会社 | 半導体装置および半導体装置の製造方法 |
| JP6663340B2 (ja) * | 2016-10-28 | 2020-03-11 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| JP6901902B2 (ja) * | 2017-04-27 | 2021-07-14 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
| US9978672B1 (en) | 2017-05-24 | 2018-05-22 | Infineon Technologies Ag | Transistor package with terminals coupled via chip carrier |
| JP6808849B2 (ja) * | 2017-10-26 | 2021-01-06 | 新電元工業株式会社 | 半導体装置 |
| CN111341762A (zh) * | 2018-12-19 | 2020-06-26 | 江苏宏微科技股份有限公司 | 一种用于大功率多管芯封装结构 |
| JP7334435B2 (ja) * | 2019-03-22 | 2023-08-29 | 富士電機株式会社 | 半導体装置および半導体装置の検査方法 |
| JP7312604B2 (ja) * | 2019-05-13 | 2023-07-21 | ローム株式会社 | 半導体装置 |
| JP7649127B2 (ja) * | 2020-11-04 | 2025-03-19 | ローム株式会社 | 半導体装置 |
| JP7653305B2 (ja) | 2021-06-02 | 2025-03-28 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| CN113410217B (zh) * | 2021-07-23 | 2025-10-17 | 苏州华太电子技术股份有限公司 | 一种双管芯合封的共源共栅SiC功率器件 |
| IT202100020552A1 (it) * | 2021-07-30 | 2023-01-30 | St Microelectronics Srl | Procedimento per assemblare dispositivi a semiconduttore e dispositivo a semiconduttore corrispondente |
| DE102024204844A1 (de) * | 2024-05-27 | 2025-11-27 | Robert Bosch Gesellschaft mit beschränkter Haftung | Halbleiterbauelement und Schaltungsanordnung |
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| JP3070145B2 (ja) * | 1991-06-19 | 2000-07-24 | ソニー株式会社 | 半導体装置 |
| US6084264A (en) * | 1998-11-25 | 2000-07-04 | Siliconix Incorporated | Trench MOSFET having improved breakdown and on-resistance characteristics |
| KR20000057810A (ko) * | 1999-01-28 | 2000-09-25 | 가나이 쓰토무 | 반도체 장치 |
| US20010001494A1 (en) * | 1999-04-01 | 2001-05-24 | Christopher B. Kocon | Power trench mos-gated device and process for forming same |
| JP4112816B2 (ja) * | 2001-04-18 | 2008-07-02 | 株式会社東芝 | 半導体装置および半導体装置の製造方法 |
| US6630726B1 (en) * | 2001-11-07 | 2003-10-07 | Amkor Technology, Inc. | Power semiconductor package with strap |
| JP4115882B2 (ja) * | 2003-05-14 | 2008-07-09 | 株式会社ルネサステクノロジ | 半導体装置 |
| US7250672B2 (en) * | 2003-11-13 | 2007-07-31 | International Rectifier Corporation | Dual semiconductor die package with reverse lead form |
| US7633140B2 (en) * | 2003-12-09 | 2009-12-15 | Alpha And Omega Semiconductor Incorporated | Inverted J-lead for power devices |
| JP5291864B2 (ja) * | 2006-02-21 | 2013-09-18 | ルネサスエレクトロニクス株式会社 | Dc/dcコンバータ用半導体装置の製造方法およびdc/dcコンバータ用半導体装置 |
| JP4916745B2 (ja) * | 2006-03-28 | 2012-04-18 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
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