KR20090068227A - 다층 프린트 배선판 및 그 제조 방법 - Google Patents

다층 프린트 배선판 및 그 제조 방법 Download PDF

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Publication number
KR20090068227A
KR20090068227A KR1020097006805A KR20097006805A KR20090068227A KR 20090068227 A KR20090068227 A KR 20090068227A KR 1020097006805 A KR1020097006805 A KR 1020097006805A KR 20097006805 A KR20097006805 A KR 20097006805A KR 20090068227 A KR20090068227 A KR 20090068227A
Authority
KR
South Korea
Prior art keywords
conductive layer
via hole
blind via
wiring board
multilayer printed
Prior art date
Application number
KR1020097006805A
Other languages
English (en)
Korean (ko)
Inventor
요시오 오카
다카시 가스가
Original Assignee
스미토모덴키고교가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 스미토모덴키고교가부시키가이샤 filed Critical 스미토모덴키고교가부시키가이샤
Publication of KR20090068227A publication Critical patent/KR20090068227A/ko

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1453—Applying the circuit pattern before another process, e.g. before filling of vias with conductive paste, before making printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
KR1020097006805A 2006-10-19 2007-10-12 다층 프린트 배선판 및 그 제조 방법 KR20090068227A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006285140A JP2008103548A (ja) 2006-10-19 2006-10-19 多層プリント配線板及びその製造方法
JPJP-P-2006-285140 2006-10-19

Publications (1)

Publication Number Publication Date
KR20090068227A true KR20090068227A (ko) 2009-06-25

Family

ID=39313949

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020097006805A KR20090068227A (ko) 2006-10-19 2007-10-12 다층 프린트 배선판 및 그 제조 방법

Country Status (5)

Country Link
JP (1) JP2008103548A (fr)
KR (1) KR20090068227A (fr)
CN (1) CN101530014A (fr)
TW (1) TWI406619B (fr)
WO (1) WO2008047718A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10237983B2 (en) 2014-12-23 2019-03-19 Sanmina Corporation Method for forming hole plug

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4763813B2 (ja) * 2009-03-03 2011-08-31 住友電気工業株式会社 多層プリント配線板およびその製造方法
KR20130140618A (ko) * 2010-07-20 2013-12-24 스미토모 덴키 고교 가부시키가이샤 다층 프린트 배선판 및 그 제조 방법
KR101895416B1 (ko) * 2011-12-23 2018-09-06 엘지이노텍 주식회사 인쇄회로기판 및 그 제조방법
JP5793113B2 (ja) * 2012-06-08 2015-10-14 住友電気工業株式会社 フレキシブルプリント配線板
CN103002673B (zh) * 2012-12-21 2015-11-04 景旺电子科技(龙川)有限公司 一种铝基和线路层导通板的制作方法
CN105307405A (zh) * 2014-05-29 2016-02-03 景硕科技股份有限公司 利用聚亚酰胺蚀刻的线路板制作方法
JP2018500770A (ja) * 2014-12-23 2018-01-11 サンミナ コーポレーションＳａｎｍｉｎａ Ｃｏｒｐｏｒａｔｉｏｎ 薄型積層体用ホールプラグ
US10149392B2 (en) * 2015-02-16 2018-12-04 Nippo Mektron, Ltd. Manufacturing method of flexible printed wiring board
CN109803490A (zh) * 2019-03-13 2019-05-24 盐城维信电子有限公司 一种导电银浆连接上下层的双面柔性线路板及其制备方法
JP7004921B2 (ja) * 2019-04-26 2022-01-21 日亜化学工業株式会社 発光モジュールの製造方法及び発光モジュール
CN114980521A (zh) * 2022-06-06 2022-08-30 北京梦之墨科技有限公司 一种电子结构及其制作方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04199782A (ja) * 1990-11-29 1992-07-20 Sharp Corp フレキシブル基板のスルーホール作成方法
JP2001024323A (ja) * 1999-07-12 2001-01-26 Ibiden Co Ltd 導電性ペーストの充填方法および多層プリント配線板用の片面回路基板の製造方法
JP3892209B2 (ja) * 2000-06-22 2007-03-14 大日本印刷株式会社 プリント配線板およびその製造方法
US7059044B2 (en) * 2001-07-18 2006-06-13 Matsushita Electric Industrial Co., Ltd. Method and material for manufacturing circuit-formed substrate
JP2003031917A (ja) * 2001-07-19 2003-01-31 Fujikura Ltd 回路基板の有底穴への導電性ペースト埋込構造
JP4468081B2 (ja) * 2004-06-10 2010-05-26 三菱樹脂株式会社 多層配線基板用導電性ペースト組成物
JP2006287019A (ja) * 2005-04-01 2006-10-19 Hitachi Metals Ltd 貫通電極付基板およびその製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10237983B2 (en) 2014-12-23 2019-03-19 Sanmina Corporation Method for forming hole plug
US11246226B2 (en) 2014-12-23 2022-02-08 Sanmina Corporation Laminate structures with hole plugs and methods of forming laminate structures with hole plugs

Also Published As

Publication number Publication date
JP2008103548A (ja) 2008-05-01
TW200829115A (en) 2008-07-01
TWI406619B (zh) 2013-08-21
WO2008047718A1 (fr) 2008-04-24
CN101530014A (zh) 2009-09-09

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