KR20090064445A - 도전 패턴 형성 필름과, 그것을 위한 도전 패턴 형성방법 및 도전 패턴 형성장치 - Google Patents

도전 패턴 형성 필름과, 그것을 위한 도전 패턴 형성방법 및 도전 패턴 형성장치 Download PDF

Info

Publication number
KR20090064445A
KR20090064445A KR1020097007319A KR20097007319A KR20090064445A KR 20090064445 A KR20090064445 A KR 20090064445A KR 1020097007319 A KR1020097007319 A KR 1020097007319A KR 20097007319 A KR20097007319 A KR 20097007319A KR 20090064445 A KR20090064445 A KR 20090064445A
Authority
KR
South Korea
Prior art keywords
conductive pattern
pattern forming
film
pressure
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020097007319A
Other languages
English (en)
Korean (ko)
Inventor
도시히데 가마타
마나부 요시다
Original Assignee
도꾸리쯔교세이호진상교기쥬쯔소고겡뀨죠
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도꾸리쯔교세이호진상교기쥬쯔소고겡뀨죠 filed Critical 도꾸리쯔교세이호진상교기쥬쯔소고겡뀨죠
Publication of KR20090064445A publication Critical patent/KR20090064445A/ko
Ceased legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/0016—Apparatus or processes specially adapted for manufacturing conductors or cables for heat treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/0026—Apparatus for manufacturing conducting or semi-conducting layers, e.g. deposition of metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/102—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0257—Nanoparticles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Thermal Sciences (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Electrodes Of Semiconductors (AREA)
KR1020097007319A 2006-10-19 2007-10-17 도전 패턴 형성 필름과, 그것을 위한 도전 패턴 형성방법 및 도전 패턴 형성장치 Ceased KR20090064445A (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JPJP-P-2006-284445 2006-10-19
JP2006284445 2006-10-19
JPJP-P-2007-268168 2007-10-15
JP2007268168A JP5252473B2 (ja) 2006-10-19 2007-10-15 導電パターン形成フィルムと、そのための導電パターン形成方法及び導電パターン形成装置

Publications (1)

Publication Number Publication Date
KR20090064445A true KR20090064445A (ko) 2009-06-18

Family

ID=39314045

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020097007319A Ceased KR20090064445A (ko) 2006-10-19 2007-10-17 도전 패턴 형성 필름과, 그것을 위한 도전 패턴 형성방법 및 도전 패턴 형성장치

Country Status (5)

Country Link
US (1) US8278561B2 (https=)
EP (1) EP2075802B1 (https=)
JP (1) JP5252473B2 (https=)
KR (1) KR20090064445A (https=)
WO (1) WO2008047823A1 (https=)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8802387B2 (en) * 2008-04-30 2014-08-12 Nanyang Technological University Methods and compounds for detecting beta-lactamase activity
WO2011065271A1 (ja) * 2009-11-24 2011-06-03 独立行政法人産業技術総合研究所 導電性基板とその製造方法
US9412623B2 (en) * 2011-06-08 2016-08-09 Cbrite Inc. Metal oxide TFT with improved source/drain contacts and reliability
US8679905B2 (en) * 2011-06-08 2014-03-25 Cbrite Inc. Metal oxide TFT with improved source/drain contacts
TW201339279A (zh) * 2011-11-24 2013-10-01 Showa Denko Kk 導電圖型形成方法及藉由光照射或微波加熱的導電圖型形成用組成物
CN104885576B (zh) * 2012-12-31 2017-12-05 阿莫绿色技术有限公司 柔性印刷电路基板及其制造方法
KR101560268B1 (ko) * 2014-04-21 2015-10-14 경희대학교 산학협력단 플렉서블 기판용 배리어 막 형성 방법
US10235061B1 (en) * 2016-09-26 2019-03-19 EMC IP Holding Company LLC Granular virtual machine snapshots
WO2019125488A1 (en) * 2017-12-22 2019-06-27 Hewlett-Packard Development Company, L.P. Encoding in three-dimensional objects
CN108718479A (zh) * 2018-07-13 2018-10-30 上海德门信息技术有限公司 一种液晶聚合物银浆的柔性电路基板及其制备方法和应用
EP4145621A4 (en) * 2020-05-01 2024-04-03 Dai Nippon Printing Co., Ltd. PRINTED CIRCUIT BOARD AND METHOD FOR PRODUCING A PRINTED CIRCUIT BOARD
CN216930463U (zh) * 2021-10-09 2022-07-08 北京梦之墨科技有限公司 一种lcp电路板、多层lcp电路板及电子器件
CN114783298B (zh) * 2022-05-25 2023-08-01 苏州华星光电技术有限公司 柔性屏的校平装置和柔性屏的校平方法

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB869295A (en) 1956-09-28 1961-05-31 Nippon Telegraph & Telephone Conductive paint and its application
JPS59195837A (ja) * 1983-04-21 1984-11-07 Sharp Corp Ｌｓｉチツプボンデイング方法
US4960614A (en) * 1987-02-06 1990-10-02 Key-Tech, Inc. Printed circuit board
JPH03152992A (ja) * 1989-10-27 1991-06-28 W R Grace & Co 印刷回路板及びその製造方法
DE69121449T2 (de) * 1990-04-12 1997-02-27 Matsushita Electric Ind Co Ltd Leitende Tintenzusammensetzung und Verfahren zum Herstellen eines dickschichtigen Musters
DE69216658T2 (de) * 1991-02-25 1997-08-07 Canon Kk Vorrichtung und Verfahren zur Verbindung elektrischer Bauelemente
US5197655A (en) * 1992-06-05 1993-03-30 International Business Machines Corporation Fine pitch solder application
US6034331A (en) * 1996-07-23 2000-03-07 Hitachi Chemical Company, Ltd. Connection sheet and electrode connection structure for electrically interconnecting electrodes facing each other, and method using the connection sheet
JP2000113919A (ja) * 1998-08-03 2000-04-21 Sony Corp 電気的接続装置と電気的接続方法
JP2000195584A (ja) * 1998-12-25 2000-07-14 Sony Corp 電気的接続装置と電気的接続方法
KR100305750B1 (ko) * 1999-03-10 2001-09-24 윤덕용 플라스틱 기판의 플립 칩 접속용 이방성 전도성 접착제의 제조방법
JP2001064547A (ja) * 1999-09-01 2001-03-13 Toyo Ink Mfg Co Ltd 活性エネルギー線硬化型導電性ペースト、それを用いた導体回路および非接触ｉｄ
JP2001135138A (ja) * 1999-10-29 2001-05-18 Matsushita Electric Ind Co Ltd 導体ペースト
JP2001243836A (ja) 1999-12-21 2001-09-07 Murata Mfg Co Ltd 導電性ペースト及びそれを用いた印刷配線板
JP2003089282A (ja) * 2001-09-18 2003-03-25 Fuji Xerox Co Ltd スクリーン印刷版及びその製造方法、スクリーン印刷版の製造装置、スクリーン印刷方法、スクリーン印刷装置、並びにスクリーン印刷物
JP4042497B2 (ja) * 2002-04-15 2008-02-06 セイコーエプソン株式会社 導電膜パターンの形成方法、配線基板、電子デバイス、電子機器、並びに非接触型カード媒体
EP1398673A3 (en) * 2002-09-12 2005-08-31 Canon Kabushiki Kaisha Developer
US20040178391A1 (en) 2003-01-29 2004-09-16 Conaghan Brian F. High conductivity inks with low minimum curing temperatures
JP4414145B2 (ja) 2003-03-06 2010-02-10 ハリマ化成株式会社 導電性ナノ粒子ペースト
EP1628363B1 (en) * 2003-06-25 2009-12-16 Hitachi Chemical Company, Ltd. Circuit member connecting structure and method of producing the same
US20050153107A1 (en) * 2004-01-12 2005-07-14 Tdk Corporation Substrate having functional layer pattern formed thereon and method of forming functional layer pattern
JP2005259848A (ja) 2004-03-10 2005-09-22 Toshiba Corp 半導体装置及びその製造方法
JP2006024485A (ja) * 2004-07-09 2006-01-26 Mitsubishi Paper Mills Ltd 導電性膜または導電性画像作製方法
JP4934993B2 (ja) * 2005-05-25 2012-05-23 住友電気工業株式会社 導電性ペーストおよびそれを用いた配線基板

Also Published As

Publication number Publication date
EP2075802A1 (en) 2009-07-01
JP5252473B2 (ja) 2013-07-31
US8278561B2 (en) 2012-10-02
WO2008047823A1 (en) 2008-04-24
US20100025088A1 (en) 2010-02-04
EP2075802A4 (en) 2010-11-03
EP2075802B1 (en) 2013-11-20
JP2008124446A (ja) 2008-05-29

Similar Documents

Publication Publication Date Title
JP5252473B2 (ja) 導電パターン形成フィルムと、そのための導電パターン形成方法及び導電パターン形成装置
US20100288543A1 (en) Conducting lines, nanoparticles, inks, and patterning
EP2248399B1 (en) Printed electronics
Li et al. Flexible and reconfigurable radio frequency electronics realized by high-throughput screen printing of vanadium dioxide switches
Li et al. Hybrid PEDOT: PSS to obtain high-performance Ag NW-based flexible transparent electrodes for transparent heaters
US20150277647A1 (en) Pressure-sensitive element, method of producing the pressure-sensitive element, touch panel equipped with the pressure-sensitive element, and method of producing the pressure-sensitive element
CN101325151B (zh) 关于纳米粒子系统的方法和装置
Saha et al. Investigation of printing properties on paper substrate
Zhang et al. A novel flexible silver heater fabricated by a solution-based polyimide metalization and inkjet-printed carbon masking technique
Govind et al. Large‐area fabrication of high performing, flexible, transparent conducting electrodes using screen printing and spray coating techniques
KR101756368B1 (ko) 유연한 전도성 복합체 필름의 패턴 형성 방법
Hung et al. Dip pen nanolithography of conductive silver traces
CN114088258A (zh) 一种包含cnt复合有机材料的柔性压力传感器及其制备方法
Scandurra et al. Low‐temperature sintered conductive silver patterns obtained by inkjet printing for plastic electronics
Liu et al. In situ growth of silver film on polyimide with tuned morphologies for flexible electronics
Wroblewski et al. Graphene platelets as morphology tailoring additive in carbon nanotube transparent and flexible electrodes for heating applications
Al-Naiemy et al. A systematic approach for the design, fabrication, and testing of microstrip antennas using inkjet printing technology
JP5434242B2 (ja) 可撓性電子回路基板およびその製造方法、並びに画像表示装置
CN113764137A (zh) 纳米银线导电膜的制备方法、纳米银线导电膜及其应用
Kusaka et al. Push-pull process for contact defect-free patterning in reverse offset printing
Joshi et al. Impact of pulse thermal processing on the properties of inkjet printed metal and flexible sensors
US20120326714A1 (en) Method for the production of printed magnetic functional elements for resistive sensors and printed magnetic functional elements
Wiranto et al. The Effect of SnO2 Mixture on a PVA-Based Thick Film Relative Humidity Sensor
Kathirvelan Fabrication of flexible carbon heaters and silver interdigitated electrodes using ink-jet printing technology for electro-chemical gas sensor applications
JP2017163085A (ja) 接合体の製造方法

Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20090409

Patent event code: PA01051R01D

Comment text: International Patent Application

A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20090513

Comment text: Request for Examination of Application

PG1501 Laying open of application
E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20110421

Patent event code: PE09021S01D

E601 Decision to refuse application
PE0601 Decision on rejection of patent

Patent event date: 20120725

Comment text: Decision to Refuse Application

Patent event code: PE06012S01D

Patent event date: 20111226

Comment text: Notification of reason for refusal

Patent event code: PE06011S01I

Patent event date: 20110421

Comment text: Notification of reason for refusal

Patent event code: PE06011S01I