JP5252473B2 - 導電パターン形成フィルムと、そのための導電パターン形成方法及び導電パターン形成装置 - Google Patents

導電パターン形成フィルムと、そのための導電パターン形成方法及び導電パターン形成装置 Download PDF

Info

Publication number
JP5252473B2
JP5252473B2 JP2007268168A JP2007268168A JP5252473B2 JP 5252473 B2 JP5252473 B2 JP 5252473B2 JP 2007268168 A JP2007268168 A JP 2007268168A JP 2007268168 A JP2007268168 A JP 2007268168A JP 5252473 B2 JP5252473 B2 JP 5252473B2
Authority
JP
Japan
Prior art keywords
conductive pattern
pattern forming
pressure
conductive
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2007268168A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008124446A5 (https=
JP2008124446A (ja
Inventor
俊英 鎌田
学 吉田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Institute of Advanced Industrial Science and Technology AIST
Original Assignee
National Institute of Advanced Industrial Science and Technology AIST
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by National Institute of Advanced Industrial Science and Technology AIST filed Critical National Institute of Advanced Industrial Science and Technology AIST
Priority to JP2007268168A priority Critical patent/JP5252473B2/ja
Priority to KR1020097007319A priority patent/KR20090064445A/ko
Priority to EP07829964.1A priority patent/EP2075802B1/en
Priority to US12/443,482 priority patent/US8278561B2/en
Priority to PCT/JP2007/070230 priority patent/WO2008047823A1/ja
Publication of JP2008124446A publication Critical patent/JP2008124446A/ja
Publication of JP2008124446A5 publication Critical patent/JP2008124446A5/ja
Application granted granted Critical
Publication of JP5252473B2 publication Critical patent/JP5252473B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/0016—Apparatus or processes specially adapted for manufacturing conductors or cables for heat treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/0026—Apparatus for manufacturing conducting or semi-conducting layers, e.g. deposition of metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/102—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0257—Nanoparticles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Thermal Sciences (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Electrodes Of Semiconductors (AREA)
JP2007268168A 2006-10-19 2007-10-15 導電パターン形成フィルムと、そのための導電パターン形成方法及び導電パターン形成装置 Expired - Fee Related JP5252473B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2007268168A JP5252473B2 (ja) 2006-10-19 2007-10-15 導電パターン形成フィルムと、そのための導電パターン形成方法及び導電パターン形成装置
KR1020097007319A KR20090064445A (ko) 2006-10-19 2007-10-17 도전 패턴 형성 필름과, 그것을 위한 도전 패턴 형성방법 및 도전 패턴 형성장치
EP07829964.1A EP2075802B1 (en) 2006-10-19 2007-10-17 Conductive pattern forming film, and conductive pattern forming method
US12/443,482 US8278561B2 (en) 2006-10-19 2007-10-17 Conductive pattern forming film, and conductive pattern forming method and conductive pattern forming apparatus for the conductive pattern forming film
PCT/JP2007/070230 WO2008047823A1 (en) 2006-10-19 2007-10-17 Conductive pattern forming film, and conductive pattern forming method and conductive pattern forming apparatus for the conductive pattern forming film

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006284445 2006-10-19
JP2006284445 2006-10-19
JP2007268168A JP5252473B2 (ja) 2006-10-19 2007-10-15 導電パターン形成フィルムと、そのための導電パターン形成方法及び導電パターン形成装置

Publications (3)

Publication Number Publication Date
JP2008124446A JP2008124446A (ja) 2008-05-29
JP2008124446A5 JP2008124446A5 (https=) 2010-02-25
JP5252473B2 true JP5252473B2 (ja) 2013-07-31

Family

ID=39314045

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007268168A Expired - Fee Related JP5252473B2 (ja) 2006-10-19 2007-10-15 導電パターン形成フィルムと、そのための導電パターン形成方法及び導電パターン形成装置

Country Status (5)

Country Link
US (1) US8278561B2 (https=)
EP (1) EP2075802B1 (https=)
JP (1) JP5252473B2 (https=)
KR (1) KR20090064445A (https=)
WO (1) WO2008047823A1 (https=)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8802387B2 (en) * 2008-04-30 2014-08-12 Nanyang Technological University Methods and compounds for detecting beta-lactamase activity
WO2011065271A1 (ja) * 2009-11-24 2011-06-03 独立行政法人産業技術総合研究所 導電性基板とその製造方法
US9412623B2 (en) * 2011-06-08 2016-08-09 Cbrite Inc. Metal oxide TFT with improved source/drain contacts and reliability
US8679905B2 (en) * 2011-06-08 2014-03-25 Cbrite Inc. Metal oxide TFT with improved source/drain contacts
TW201339279A (zh) * 2011-11-24 2013-10-01 Showa Denko Kk 導電圖型形成方法及藉由光照射或微波加熱的導電圖型形成用組成物
CN104885576B (zh) * 2012-12-31 2017-12-05 阿莫绿色技术有限公司 柔性印刷电路基板及其制造方法
KR101560268B1 (ko) * 2014-04-21 2015-10-14 경희대학교 산학협력단 플렉서블 기판용 배리어 막 형성 방법
US10235061B1 (en) * 2016-09-26 2019-03-19 EMC IP Holding Company LLC Granular virtual machine snapshots
WO2019125488A1 (en) * 2017-12-22 2019-06-27 Hewlett-Packard Development Company, L.P. Encoding in three-dimensional objects
CN108718479A (zh) * 2018-07-13 2018-10-30 上海德门信息技术有限公司 一种液晶聚合物银浆的柔性电路基板及其制备方法和应用
EP4145621A4 (en) * 2020-05-01 2024-04-03 Dai Nippon Printing Co., Ltd. PRINTED CIRCUIT BOARD AND METHOD FOR PRODUCING A PRINTED CIRCUIT BOARD
CN216930463U (zh) * 2021-10-09 2022-07-08 北京梦之墨科技有限公司 一种lcp电路板、多层lcp电路板及电子器件
CN114783298B (zh) * 2022-05-25 2023-08-01 苏州华星光电技术有限公司 柔性屏的校平装置和柔性屏的校平方法

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB869295A (en) 1956-09-28 1961-05-31 Nippon Telegraph & Telephone Conductive paint and its application
JPS59195837A (ja) * 1983-04-21 1984-11-07 Sharp Corp Ｌｓｉチツプボンデイング方法
US4960614A (en) * 1987-02-06 1990-10-02 Key-Tech, Inc. Printed circuit board
JPH03152992A (ja) * 1989-10-27 1991-06-28 W R Grace & Co 印刷回路板及びその製造方法
DE69121449T2 (de) * 1990-04-12 1997-02-27 Matsushita Electric Ind Co Ltd Leitende Tintenzusammensetzung und Verfahren zum Herstellen eines dickschichtigen Musters
DE69216658T2 (de) * 1991-02-25 1997-08-07 Canon Kk Vorrichtung und Verfahren zur Verbindung elektrischer Bauelemente
US5197655A (en) * 1992-06-05 1993-03-30 International Business Machines Corporation Fine pitch solder application
US6034331A (en) * 1996-07-23 2000-03-07 Hitachi Chemical Company, Ltd. Connection sheet and electrode connection structure for electrically interconnecting electrodes facing each other, and method using the connection sheet
JP2000113919A (ja) * 1998-08-03 2000-04-21 Sony Corp 電気的接続装置と電気的接続方法
JP2000195584A (ja) * 1998-12-25 2000-07-14 Sony Corp 電気的接続装置と電気的接続方法
KR100305750B1 (ko) * 1999-03-10 2001-09-24 윤덕용 플라스틱 기판의 플립 칩 접속용 이방성 전도성 접착제의 제조방법
JP2001064547A (ja) * 1999-09-01 2001-03-13 Toyo Ink Mfg Co Ltd 活性エネルギー線硬化型導電性ペースト、それを用いた導体回路および非接触ｉｄ
JP2001135138A (ja) * 1999-10-29 2001-05-18 Matsushita Electric Ind Co Ltd 導体ペースト
JP2001243836A (ja) 1999-12-21 2001-09-07 Murata Mfg Co Ltd 導電性ペースト及びそれを用いた印刷配線板
JP2003089282A (ja) * 2001-09-18 2003-03-25 Fuji Xerox Co Ltd スクリーン印刷版及びその製造方法、スクリーン印刷版の製造装置、スクリーン印刷方法、スクリーン印刷装置、並びにスクリーン印刷物
JP4042497B2 (ja) * 2002-04-15 2008-02-06 セイコーエプソン株式会社 導電膜パターンの形成方法、配線基板、電子デバイス、電子機器、並びに非接触型カード媒体
EP1398673A3 (en) * 2002-09-12 2005-08-31 Canon Kabushiki Kaisha Developer
US20040178391A1 (en) 2003-01-29 2004-09-16 Conaghan Brian F. High conductivity inks with low minimum curing temperatures
JP4414145B2 (ja) 2003-03-06 2010-02-10 ハリマ化成株式会社 導電性ナノ粒子ペースト
EP1628363B1 (en) * 2003-06-25 2009-12-16 Hitachi Chemical Company, Ltd. Circuit member connecting structure and method of producing the same
US20050153107A1 (en) * 2004-01-12 2005-07-14 Tdk Corporation Substrate having functional layer pattern formed thereon and method of forming functional layer pattern
JP2005259848A (ja) 2004-03-10 2005-09-22 Toshiba Corp 半導体装置及びその製造方法
JP2006024485A (ja) * 2004-07-09 2006-01-26 Mitsubishi Paper Mills Ltd 導電性膜または導電性画像作製方法
JP4934993B2 (ja) * 2005-05-25 2012-05-23 住友電気工業株式会社 導電性ペーストおよびそれを用いた配線基板

Also Published As

Publication number Publication date
EP2075802A1 (en) 2009-07-01
US8278561B2 (en) 2012-10-02
WO2008047823A1 (en) 2008-04-24
US20100025088A1 (en) 2010-02-04
EP2075802A4 (en) 2010-11-03
KR20090064445A (ko) 2009-06-18
EP2075802B1 (en) 2013-11-20
JP2008124446A (ja) 2008-05-29

Similar Documents

Publication Publication Date Title
JP5252473B2 (ja) 導電パターン形成フィルムと、そのための導電パターン形成方法及び導電パターン形成装置
Wajahat et al. Flexible strain sensors fabricated by meniscus-guided printing of carbon nanotube–polymer composites
US8105126B2 (en) Method for fabricating touch panel
Zhong et al. Continuous patterning of copper nanowire-based transparent conducting electrodes for use in flexible electronic applications
Li et al. Flexible and reconfigurable radio frequency electronics realized by high-throughput screen printing of vanadium dioxide switches
CN101819335B (zh) 热致变色元件及热致变色显示装置
US20100288543A1 (en) Conducting lines, nanoparticles, inks, and patterning
CN101325151B (zh) 关于纳米粒子系统的方法和装置
JP2009146898A (ja) 電子素子
US20080153188A1 (en) Apparatus and method for forming semiconductor layer
Kwon et al. Novel concept for fabricating a flexible transparent electrode using the simple and scalable self-assembly of Ag nanowires
Govind et al. Large‐area fabrication of high performing, flexible, transparent conducting electrodes using screen printing and spray coating techniques
Zhang et al. A novel flexible silver heater fabricated by a solution-based polyimide metalization and inkjet-printed carbon masking technique
JPH05143219A (ja) 透明入力パネル
CN101620491B (zh) 触摸屏
Porro et al. Real-time monitoring of graphene oxide reduction in acrylic printable composite inks
Mitra et al. Inkjet printing and intense pulsed light sintering of multiwall carbon nanotubes for sensor applications
Tomaszewski et al. Investigation of inkjet printed path resistance in the context of manufacture and flexible application
JPWO2011065271A1 (ja) 導電性基板とその製造方法
JP2017163085A (ja) 接合体の製造方法
CN207008580U (zh) 具有由多个层制造的触摸屏的移动通信设备
Kathirvelan Fabrication of flexible carbon heaters and silver interdigitated electrodes using ink-jet printing technology for electro-chemical gas sensor applications
Rohit Optimization and characterization of a capillary contact micro-plotter for printed electronic devices
Cao et al. Electric Field-driven Jet Printing of Flexible Transparent Conductive Films.
Wroblewski et al. Research Article Graphene Platelets as Morphology Tailoring Additive in Carbon Nanotube Transparent and Flexible Electrodes for Heating Applications

Legal Events

Date Code Title Description
A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20100107

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20100108

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20120828

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20130122

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130319

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20130409

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20130410

R150 Certificate of patent or registration of utility model

Ref document number: 5252473

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20160426

Year of fee payment: 3

S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R313533

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees