KR20080114681A - 리소그래피 임프린팅 시스템 - Google Patents

리소그래피 임프린팅 시스템 Download PDF

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Publication number
KR20080114681A
KR20080114681A KR1020087017591A KR20087017591A KR20080114681A KR 20080114681 A KR20080114681 A KR 20080114681A KR 1020087017591 A KR1020087017591 A KR 1020087017591A KR 20087017591 A KR20087017591 A KR 20087017591A KR 20080114681 A KR20080114681 A KR 20080114681A
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KR
South Korea
Prior art keywords
template
substrate
nano
imprint mold
promoting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020087017591A
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English (en)
Korean (ko)
Inventor
안슈맨 체랄라
판카이 비. 라드
이안 엠. 맥맥킨
병진 최
Original Assignee
몰레큘러 임프린츠 인코퍼레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication of KR20080114681A publication Critical patent/KR20080114681A/ko
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/003—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor characterised by the choice of material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70841—Constructional issues related to vacuum environment, e.g. load-lock chamber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
    • B29C2043/023—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface having a plurality of grooves
    • B29C2043/025—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface having a plurality of grooves forming a microstructure, i.e. fine patterning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • B29C2043/5833—Measuring, controlling or regulating movement of moulds or mould parts, e.g. opening or closing, actuating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface

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  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Public Health (AREA)
  • Epidemiology (AREA)
  • Environmental & Geological Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
KR1020087017591A 2006-04-03 2007-04-02 리소그래피 임프린팅 시스템 Ceased KR20080114681A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US78877906P 2006-04-03 2006-04-03
US60/788,779 2006-04-03

Publications (1)

Publication Number Publication Date
KR20080114681A true KR20080114681A (ko) 2008-12-31

Family

ID=38625508

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020087017591A Ceased KR20080114681A (ko) 2006-04-03 2007-04-02 리소그래피 임프린팅 시스템

Country Status (8)

Country Link
US (1) US7462028B2 (enExample)
EP (1) EP2001602B1 (enExample)
JP (2) JP4536148B2 (enExample)
KR (1) KR20080114681A (enExample)
CN (1) CN101405087A (enExample)
AT (1) ATE513625T1 (enExample)
TW (1) TWI432311B (enExample)
WO (1) WO2007123805A2 (enExample)

Families Citing this family (79)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6119463A (en) 1998-05-12 2000-09-19 Amerigon Thermoelectric heat exchanger
US7442336B2 (en) * 2003-08-21 2008-10-28 Molecular Imprints, Inc. Capillary imprinting technique
US7019819B2 (en) 2002-11-13 2006-03-28 Molecular Imprints, Inc. Chucking system for modulating shapes of substrates
US7077992B2 (en) * 2002-07-11 2006-07-18 Molecular Imprints, Inc. Step and repeat imprint lithography processes
US8211214B2 (en) * 2003-10-02 2012-07-03 Molecular Imprints, Inc. Single phase fluid imprint lithography method
US20060062922A1 (en) 2004-09-23 2006-03-23 Molecular Imprints, Inc. Polymerization technique to attenuate oxygen inhibition of solidification of liquids and composition therefor
US7587901B2 (en) 2004-12-20 2009-09-15 Amerigon Incorporated Control system for thermal module in vehicle
US7611348B2 (en) * 2005-04-19 2009-11-03 Asml Netherlands B.V. Imprint lithography
CN101535021A (zh) 2005-12-08 2009-09-16 分子制模股份有限公司 用于衬底双面图案形成的方法和系统
US7670530B2 (en) 2006-01-20 2010-03-02 Molecular Imprints, Inc. Patterning substrates employing multiple chucks
ATE547285T1 (de) 2006-01-30 2012-03-15 Amerigon Inc Kühlsystem für ein behältnis in einem fahrzeug
US8215946B2 (en) 2006-05-18 2012-07-10 Molecular Imprints, Inc. Imprint lithography system and method
US8539624B2 (en) 2006-05-31 2013-09-24 Gentherm Incorporated Structure based fluid distribution system
US20080087316A1 (en) 2006-10-12 2008-04-17 Masa Inaba Thermoelectric device with internal sensor
EP2609836B1 (en) 2006-10-13 2015-01-07 Gentherm Incorporated Air conditioned bed
TW200842934A (en) * 2006-12-29 2008-11-01 Molecular Imprints Inc Imprint fluid control
KR101319325B1 (ko) * 2006-12-29 2013-10-16 엘지디스플레이 주식회사 패턴의 형성 방법
JP5485701B2 (ja) 2007-01-10 2014-05-07 ジェンサーム インコーポレイティド 熱電素子
US20090014917A1 (en) * 2007-07-10 2009-01-15 Molecular Imprints, Inc. Drop Pattern Generation for Imprint Lithography
US9105809B2 (en) 2007-07-23 2015-08-11 Gentherm Incorporated Segmented thermoelectric device
WO2009036077A1 (en) 2007-09-10 2009-03-19 Amerigon, Inc. Operational control schemes for ventilated seat or bed assemblies
US9125497B2 (en) 2007-10-15 2015-09-08 Gentherm Incorporated Climate controlled bed assembly with intermediate layer
US8119052B2 (en) * 2007-11-02 2012-02-21 Molecular Imprints, Inc. Drop pattern generation for imprint lithography
JP4840668B2 (ja) * 2007-11-30 2011-12-21 綜研化学株式会社 熱インプリント用モールドおよびこのモールドを用いた光学素子の製造方法
US20090148619A1 (en) * 2007-12-05 2009-06-11 Molecular Imprints, Inc. Controlling Thickness of Residual Layer
US20090196826A1 (en) * 2007-12-18 2009-08-06 Board Of Regents, The University Of Texas System Compositions and methods of making non-spherical micro- and nano-particles
WO2009097572A1 (en) 2008-02-01 2009-08-06 Amerigon Incorporated Condensation and humidity sensors for thermoelectric devices
US8361371B2 (en) * 2008-02-08 2013-01-29 Molecular Imprints, Inc. Extrusion reduction in imprint lithography
JP5121549B2 (ja) * 2008-04-21 2013-01-16 株式会社東芝 ナノインプリント方法
US20100015270A1 (en) * 2008-07-15 2010-01-21 Molecular Imprints, Inc. Inner cavity system for nano-imprint lithography
JP5997899B2 (ja) 2008-07-18 2016-09-28 ジェンサーム インコーポレイテッドＧｅｎｔｈｅｒｍ Ｉｎｃｏｒｐｏｒａｔｅｄ 空調されるベッドアセンブリ
US20100096764A1 (en) * 2008-10-20 2010-04-22 Molecular Imprints, Inc. Gas Environment for Imprint Lithography
US8586126B2 (en) 2008-10-21 2013-11-19 Molecular Imprints, Inc. Robust optimization to generate drop patterns in imprint lithography which are tolerant of variations in drop volume and drop placement
US8512797B2 (en) * 2008-10-21 2013-08-20 Molecular Imprints, Inc. Drop pattern generation with edge weighting
TWI414418B (zh) * 2008-10-23 2013-11-11 Molecular Imprints Inc 壓印微影術系統及方法
US20100112220A1 (en) * 2008-11-03 2010-05-06 Molecular Imprints, Inc. Dispense system set-up and characterization
US8575518B2 (en) 2009-01-28 2013-11-05 Gentherm Incorporated Convective heater
JP2012522327A (ja) 2009-03-23 2012-09-20 インテバック・インコーポレイテッド パターニングされた媒体の溝と島の比率の最適化のための方法
WO2010129803A1 (en) 2009-05-06 2010-11-11 Amerigon, Inc. Control schemes and features for climate-controlled beds
US8501054B2 (en) * 2009-07-09 2013-08-06 Inha-Industry Partnership Institute Apparatus and method for manufacturing micro lens array
EP2287666B1 (de) 2009-08-22 2012-06-27 EV Group E. Thallner GmbH Vorrichtung zum Prägen von Substraten
US8332975B2 (en) 2009-08-31 2012-12-18 Gentherm Incorporated Climate-controlled topper member for medical beds
JP5419634B2 (ja) * 2009-10-26 2014-02-19 株式会社東芝 パターン形成方法
US20110140304A1 (en) 2009-12-10 2011-06-16 Molecular Imprints, Inc. Imprint lithography template
WO2011100050A2 (en) 2010-02-09 2011-08-18 Molecular Imprints, Inc. Process gas confinement for nano-imprinting
JP5491931B2 (ja) * 2010-03-30 2014-05-14 富士フイルム株式会社 ナノインプリント方法およびモールド製造方法
JP5822597B2 (ja) * 2010-10-01 2015-11-24 キヤノン株式会社 インプリント装置、及びそれを用いた物品の製造方法
JP5930622B2 (ja) 2010-10-08 2016-06-08 キヤノン株式会社 インプリント装置、及び、物品の製造方法
US9121414B2 (en) 2010-11-05 2015-09-01 Gentherm Incorporated Low-profile blowers and methods
US8741199B2 (en) 2010-12-22 2014-06-03 Qingdao Technological University Method and device for full wafer nanoimprint lithography
JP5787691B2 (ja) * 2011-09-21 2015-09-30 キヤノン株式会社 インプリント装置、それを用いた物品の製造方法
WO2013052823A1 (en) 2011-10-07 2013-04-11 Gentherm Incorporated Thermoelectric device controls and methods
US9989267B2 (en) 2012-02-10 2018-06-05 Gentherm Incorporated Moisture abatement in heating operation of climate controlled systems
KR101515180B1 (ko) * 2012-05-18 2015-04-24 주식회사 휴템 유체압을 이용한 기판접합 장치 및 기판접합 방법
US20130337176A1 (en) * 2012-06-19 2013-12-19 Seagate Technology Llc Nano-scale void reduction
JP2015524997A (ja) 2012-07-06 2015-08-27 ジェンサーム インコーポレイテッドＧｅｎｔｈｅｒｍ Ｉｎｃｏｒｐｏｒａｔｅｄ 誘導充電アセンブリを冷却するシステムおよび方法
US9662962B2 (en) 2013-11-05 2017-05-30 Gentherm Incorporated Vehicle headliner assembly for zonal comfort
DE112014005563T5 (de) 2013-12-05 2016-11-24 Gentherm Incorporated Systeme und Verfahren für klimatisierte Sitze
JP6294679B2 (ja) 2014-01-21 2018-03-14 キヤノン株式会社 インプリント装置及び物品の製造方法
WO2015123585A1 (en) 2014-02-14 2015-08-20 Gentherm Incorporated Conductive convective climate controlled seat
CN106458070B (zh) 2014-05-09 2020-10-16 金瑟姆股份公司 气候控制组件
JP6400090B2 (ja) * 2014-05-29 2018-10-03 キヤノン株式会社 塗布装置、インプリント装置および物品の製造方法
JP6361303B2 (ja) * 2014-06-13 2018-07-25 大日本印刷株式会社 インプリント用モールドおよびインプリント装置
EP3218942B1 (en) 2014-11-14 2020-02-26 Charles J. Cauchy Heating and cooling technologies
US11639816B2 (en) 2014-11-14 2023-05-02 Gentherm Incorporated Heating and cooling technologies including temperature regulating pad wrap and technologies with liquid system
US11857004B2 (en) 2014-11-14 2024-01-02 Gentherm Incorporated Heating and cooling technologies
JP6525567B2 (ja) * 2014-12-02 2019-06-05 キヤノン株式会社 インプリント装置及び物品の製造方法
CN104637843B (zh) * 2015-02-02 2017-12-05 京东方科技集团股份有限公司 封装设备和封装方法
TR201909874T4 (tr) * 2015-02-13 2019-07-22 Morphotonics Holding Bv Farklı substratların tekstüre edilmesine yönelik yöntem ve esnek mühür.
CN107364057A (zh) * 2017-07-10 2017-11-21 天津工业大学 一种不同粗糙度模板的制备方法
JP6992331B2 (ja) * 2017-09-05 2022-01-13 大日本印刷株式会社 インプリントモールド
US10895806B2 (en) * 2017-09-29 2021-01-19 Canon Kabushiki Kaisha Imprinting method and apparatus
JP7077754B2 (ja) * 2018-05-08 2022-05-31 大日本印刷株式会社 インプリントモールド用基板、インプリントモールド及びそれらの製造方法
US20200035898A1 (en) 2018-07-30 2020-01-30 Gentherm Incorporated Thermoelectric device having circuitry that facilitates manufacture
WO2020112902A1 (en) 2018-11-30 2020-06-04 Gentherm Incorporated Thermoelectric conditioning system and methods
US11152557B2 (en) 2019-02-20 2021-10-19 Gentherm Incorporated Thermoelectric module with integrated printed circuit board
US11590687B2 (en) 2020-06-30 2023-02-28 Canon Kabushiki Kaisha Systems and methods for reducing pressure while shaping a film
US12242205B2 (en) 2021-11-30 2025-03-04 Canon Kabushiki Kaisha Reaction chamber with stop-gapped vacuum seal
CN118444526B (zh) * 2024-07-05 2024-09-24 苏州新维度微纳科技有限公司 纳米压印模具及纳米压印的方法

Family Cites Families (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4279628A (en) 1979-12-31 1981-07-21 Energy Synergistics, Inc. Apparatus for drying a natural gas stream
DE8007086U1 (de) 1980-03-14 1982-03-18 Multivac Sepp Haggenmüller KG, 8941 Wolfertschwenden Vorrichtung zum formen von behaeltnissen aus einer folie
US4767584A (en) 1985-04-03 1988-08-30 Massachusetts Institute Of Technology Process of and apparatus for producing design patterns in materials
DE3514022C1 (de) 1985-04-18 1986-07-10 Fa. Carl Freudenberg, 6940 Weinheim Vorrichtung zum gegenseitigen Verkleben thermisch erweichbarer Partikel zu einem Kunststoffkoerper
US5108532A (en) * 1988-02-02 1992-04-28 Northrop Corporation Method and apparatus for shaping, forming, consolidating and co-consolidating thermoplastic or thermosetting composite products
US5821175A (en) 1988-07-08 1998-10-13 Cauldron Limited Partnership Removal of surface contaminants by irradiation using various methods to achieve desired inert gas flow over treated surface
JPH0292603A (ja) * 1988-09-30 1990-04-03 Hoya Corp 案内溝付き情報記録用基板の製造方法
US5545367A (en) 1992-04-15 1996-08-13 Soane Technologies, Inc. Rapid prototype three dimensional stereolithography
FR2690375B1 (fr) 1992-04-22 1994-07-08 Aerospatiale Dispositif de compactage a chaud pour la fabrication de pieces necessitant des montees en pression et en temperature simultanees.
US5997273A (en) 1995-08-01 1999-12-07 Laquer; Henry Louis Differential pressure HIP forging in a controlled gaseous environment
US6482742B1 (en) * 2000-07-18 2002-11-19 Stephen Y. Chou Fluid pressure imprint lithography
US5669303A (en) * 1996-03-04 1997-09-23 Motorola Apparatus and method for stamping a surface
US6257866B1 (en) * 1996-06-18 2001-07-10 Hy-Tech Forming Systems, Inc. Apparatus for accurately forming plastic sheet
DE19819761C2 (de) 1998-05-04 2000-05-31 Jenoptik Jena Gmbh Einrichtung zur Trennung eines geformten Substrates von einem Prägewerkzeug
US5997963A (en) 1998-05-05 1999-12-07 Ultratech Stepper, Inc. Microchamber
US6099771A (en) 1998-07-08 2000-08-08 Lear Corporation Vacuum compression method for forming molded thermoplastic floor mat having a "Class A" finish
US5947027A (en) * 1998-09-08 1999-09-07 Motorola, Inc. Printing apparatus with inflatable means for advancing a substrate towards the stamping surface
JP3291488B2 (ja) 1999-05-27 2002-06-10 三洋電機株式会社 流体の被除去物除去方法
EP1072954A3 (en) * 1999-07-28 2002-05-22 Lucent Technologies Inc. Lithographic process for device fabrication
US6873087B1 (en) * 1999-10-29 2005-03-29 Board Of Regents, The University Of Texas System High precision orientation alignment and gap control stages for imprint lithography processes
SE515607C2 (sv) * 1999-12-10 2001-09-10 Obducat Ab Anordning och metod vid tillverkning av strukturer
DE10010001A1 (de) * 2000-03-02 2001-09-06 Celanese Ventures Gmbh Neue Blendpolymermembranen zum Einsatz in Brennstoffzellen
JP2001358056A (ja) 2000-06-15 2001-12-26 Canon Inc 露光装置
US7322287B2 (en) * 2000-07-18 2008-01-29 Nanonex Corporation Apparatus for fluid pressure imprint lithography
JP2004505273A (ja) * 2000-08-01 2004-02-19 ボード・オブ・リージエンツ，ザ・ユニバーシテイ・オブ・テキサス・システム 転写リソグラフィのための透明テンプレートと基板の間のギャップおよび配向を高精度でセンシングするための方法
EP2306242A3 (en) * 2000-10-12 2011-11-02 Board of Regents, The University of Texas System Method of forming a pattern on a substrate
JP2002208563A (ja) 2001-01-09 2002-07-26 Ebara Corp 被加工物の加工装置及び加工方法
JP2003109915A (ja) * 2001-09-28 2003-04-11 National Institute Of Advanced Industrial & Technology 剥離性雰囲気でのインプリントリソグラフィー方法及び装置
US20030071016A1 (en) * 2001-10-11 2003-04-17 Wu-Sheng Shih Patterned structure reproduction using nonsticking mold
US6764386B2 (en) 2002-01-11 2004-07-20 Applied Materials, Inc. Air bearing-sealed micro-processing chamber
MY144124A (en) * 2002-07-11 2011-08-15 Molecular Imprints Inc Step and repeat imprint lithography systems
US7019819B2 (en) * 2002-11-13 2006-03-28 Molecular Imprints, Inc. Chucking system for modulating shapes of substrates
US6932934B2 (en) 2002-07-11 2005-08-23 Molecular Imprints, Inc. Formation of discontinuous films during an imprint lithography process
TWI266970B (en) * 2002-08-01 2006-11-21 Molecular Imprints Inc Scatterometry alignment for imprint lithography
JP2004071934A (ja) * 2002-08-08 2004-03-04 Kanegafuchi Chem Ind Co Ltd 微細パターンの製造方法および転写材料
JP3700001B2 (ja) * 2002-09-10 2005-09-28 独立行政法人産業技術総合研究所 インプリント方法及び装置
US20040132301A1 (en) * 2002-09-12 2004-07-08 Harper Bruce M. Indirect fluid pressure imprinting
US6986815B2 (en) 2003-01-08 2006-01-17 General Electric Company Flow system flush process
US6951173B1 (en) * 2003-05-14 2005-10-04 Molecular Imprints, Inc. Assembly and method for transferring imprint lithography templates
JP2005045168A (ja) * 2003-07-25 2005-02-17 Tokyo Electron Ltd インプリント方法およびインプリント装置
JP4313109B2 (ja) * 2003-08-01 2009-08-12 明昌機工株式会社 高精度プレス機
JP2005101201A (ja) 2003-09-24 2005-04-14 Canon Inc ナノインプリント装置
US7090716B2 (en) * 2003-10-02 2006-08-15 Molecular Imprints, Inc. Single phase fluid imprint lithography method
WO2005079512A2 (en) * 2004-02-19 2005-09-01 Capital One Financial Corporation Data card
KR100558754B1 (ko) * 2004-02-24 2006-03-10 한국기계연구원 Ｕｖ 나노임프린트 리소그래피 공정 및 이 공정을수행하는 장치
US7670534B2 (en) 2005-09-21 2010-03-02 Molecular Imprints, Inc. Method to control an atmosphere between a body and a substrate

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JP4536148B2 (ja) 2010-09-01
JP4917159B2 (ja) 2012-04-18
JP2010179655A (ja) 2010-08-19
EP2001602A2 (en) 2008-12-17
ATE513625T1 (de) 2011-07-15
US7462028B2 (en) 2008-12-09
JP2009532245A (ja) 2009-09-10
WO2007123805A3 (en) 2007-12-27
CN101405087A (zh) 2009-04-08
EP2001602A4 (en) 2009-04-01
US20070275114A1 (en) 2007-11-29
TW200744830A (en) 2007-12-16
WO2007123805A2 (en) 2007-11-01
EP2001602B1 (en) 2011-06-22
TWI432311B (zh) 2014-04-01

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