JP4917159B2 - リソグラフィ・インプリント・システム - Google Patents
リソグラフィ・インプリント・システム Download PDFInfo
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- JP4917159B2 JP4917159B2 JP2010063842A JP2010063842A JP4917159B2 JP 4917159 B2 JP4917159 B2 JP 4917159B2 JP 2010063842 A JP2010063842 A JP 2010063842A JP 2010063842 A JP2010063842 A JP 2010063842A JP 4917159 B2 JP4917159 B2 JP 4917159B2
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- template
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- nanoimprint mold
- partial vacuum
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- 238000001459 lithography Methods 0.000 title description 10
- 238000000034 method Methods 0.000 claims abstract description 16
- 239000000758 substrate Substances 0.000 claims description 45
- 239000012530 fluid Substances 0.000 claims description 7
- 238000005329 nanolithography Methods 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims 2
- 238000001127 nanoimprint lithography Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 description 7
- 238000000059 patterning Methods 0.000 description 7
- 239000007789 gas Substances 0.000 description 6
- 239000002861 polymer material Substances 0.000 description 4
- 239000007788 liquid Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 239000012636 effector Substances 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920002313 fluoropolymer Polymers 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 231100000572 poisoning Toxicity 0.000 description 1
- 230000000607 poisoning effect Effects 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000013518 transcription Methods 0.000 description 1
- 230000035897 transcription Effects 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/003—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor characterised by the choice of material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
- B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
- G03F7/70841—Constructional issues related to vacuum environment, e.g. load-lock chamber
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
- B29C2043/023—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface having a plurality of grooves
- B29C2043/025—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface having a plurality of grooves forming a microstructure, i.e. fine patterning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/58—Measuring, controlling or regulating
- B29C2043/5833—Measuring, controlling or regulating movement of moulds or mould parts, e.g. opening or closing, actuating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
Landscapes
- Engineering & Computer Science (AREA)
- Nanotechnology (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Mechanical Engineering (AREA)
- Mathematical Physics (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Health & Medical Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Description
1.純粋なヘリウム、又はCO2などの他のプロセス・ガスの雰囲気の生成及び維持、
2.部分又は完全真空インプリント(充填時間、欠陥、酸素中毒を減少させる)、
3.剥離力の減少又は除去。
Claims (7)
- ナノリソグラフィ・インプリント・プロセス中にテンプレートと基板の間に特定の環境を生成するためのシステムであって、
前記基板と、
前記基板に接近して配置された前記テンプレートを貫通する少なくとも1つの孔を有するテンプレートであって、そのテンプレート上のナノインプリント・モールドと前記基板の対応する位置との間に空間容積を生成する、テンプレートと、
前記ナノインプリント・モールドと前記基板との間の前記空間容積中のガスを部分排気させる手段であって、前記少なくとも1つの孔に結合された手段
とを備えることを特徴とするシステム。 - 前記孔は前記テンプレートのアクティブ領域と前記基板の間に空気流を提供することを特徴とする請求項1記載のシステム。
- 前記孔は前記テンプレートのアクティブ領域から外部環境に向かって空気流を提供することを特徴とする請求項2記載のシステム。
- 前記テンプレートは、前記ナノインプリント・モールドの周囲に配置された前記テンプレートを貫通する複数の孔をさらに備え、前記部分真空環境を作成する手段は、前記ナノインプリント・モールドと前記基板を囲む前記所望の容積内にガスの前記部分真空環境を生成するために前記複数の孔を利用することを特徴とする請求項1に記載のシステム。
- 前記テンプレートは、前記ナノインプリント・モールドのまわりの前記テンプレートに形成されたチャネルをさらに備え、前記チャネルは前記排気させる手段に結合されていることを特徴とする請求項1に記載のシステム。
- 前記部分真空環境を作成する手段は、前記テンプレートの側面と物体の側面との間に前記インターフェース隙間を生成するように前記テンプレートのまわりに配置された、前記エア・ベアリング面を有する前記物体をさらに備え、それによって、前記インターフェース隙間を上向きに通過する空気流が前記テンプレートと前記基板との間からガスを排気することを特徴とする請求項1に記載のシステム。
- 前記ナノインプリント・モールドと前記基板の間に分配される重合可能な流体をさらに備えることを特徴とする請求項1記載のシステム。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US78877906P | 2006-04-03 | 2006-04-03 | |
US60/788,779 | 2006-04-03 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009504231A Division JP4536148B2 (ja) | 2006-04-03 | 2007-04-02 | リソグラフィ・インプリント・システム |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010179655A JP2010179655A (ja) | 2010-08-19 |
JP4917159B2 true JP4917159B2 (ja) | 2012-04-18 |
Family
ID=38625508
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009504231A Active JP4536148B2 (ja) | 2006-04-03 | 2007-04-02 | リソグラフィ・インプリント・システム |
JP2010063842A Active JP4917159B2 (ja) | 2006-04-03 | 2010-03-19 | リソグラフィ・インプリント・システム |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009504231A Active JP4536148B2 (ja) | 2006-04-03 | 2007-04-02 | リソグラフィ・インプリント・システム |
Country Status (8)
Country | Link |
---|---|
US (1) | US7462028B2 (ja) |
EP (1) | EP2001602B1 (ja) |
JP (2) | JP4536148B2 (ja) |
KR (1) | KR20080114681A (ja) |
CN (1) | CN101405087A (ja) |
AT (1) | ATE513625T1 (ja) |
TW (1) | TWI432311B (ja) |
WO (1) | WO2007123805A2 (ja) |
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EP2001602B1 (en) | 2011-06-22 |
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WO2007123805A3 (en) | 2007-12-27 |
CN101405087A (zh) | 2009-04-08 |
JP2009532245A (ja) | 2009-09-10 |
JP2010179655A (ja) | 2010-08-19 |
TWI432311B (zh) | 2014-04-01 |
KR20080114681A (ko) | 2008-12-31 |
JP4536148B2 (ja) | 2010-09-01 |
TW200744830A (en) | 2007-12-16 |
US7462028B2 (en) | 2008-12-09 |
ATE513625T1 (de) | 2011-07-15 |
US20070275114A1 (en) | 2007-11-29 |
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