KR20080056715A - 다성분 합금으로 제조되는 스퍼터링 타겟 및 생산 방법 - Google Patents

다성분 합금으로 제조되는 스퍼터링 타겟 및 생산 방법 Download PDF

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Publication number
KR20080056715A
KR20080056715A KR1020087006552A KR20087006552A KR20080056715A KR 20080056715 A KR20080056715 A KR 20080056715A KR 1020087006552 A KR1020087006552 A KR 1020087006552A KR 20087006552 A KR20087006552 A KR 20087006552A KR 20080056715 A KR20080056715 A KR 20080056715A
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KR
South Korea
Prior art keywords
sputter target
target
phase
producing
sputter
Prior art date
Application number
KR1020087006552A
Other languages
English (en)
Korean (ko)
Inventor
마틴 슐로트
한스-요아힘 파벨
마르커스 슐테이스
Original Assignee
베.체.헤레우스게엠베하
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 베.체.헤레우스게엠베하 filed Critical 베.체.헤레우스게엠베하
Publication of KR20080056715A publication Critical patent/KR20080056715A/ko

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F5/00—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product
    • B22F5/10—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product of articles with cavities or holes, not otherwise provided for in the preceding subgroups
    • B22F5/106—Tube or ring forms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/12—Both compacting and sintering
    • B22F3/14—Both compacting and sintering simultaneously
    • B22F3/15—Hot isostatic pressing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F5/00—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product
    • B22F5/006—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product of flat products, e.g. sheets
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
    • B22F2998/10—Processes characterised by the sequence of their steps

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Powder Metallurgy (AREA)
KR1020087006552A 2005-10-19 2006-10-11 다성분 합금으로 제조되는 스퍼터링 타겟 및 생산 방법 KR20080056715A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102005050424A DE102005050424B4 (de) 2005-10-19 2005-10-19 Sputtertarget aus mehrkomponentigen Legierungen
DE102005050424.8 2005-10-19

Publications (1)

Publication Number Publication Date
KR20080056715A true KR20080056715A (ko) 2008-06-23

Family

ID=37450927

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020087006552A KR20080056715A (ko) 2005-10-19 2006-10-11 다성분 합금으로 제조되는 스퍼터링 타겟 및 생산 방법

Country Status (7)

Country Link
JP (1) JP2009512779A (de)
KR (1) KR20080056715A (de)
CN (1) CN101283113A (de)
AT (1) AT506851B1 (de)
DE (1) DE102005050424B4 (de)
TW (1) TW200720458A (de)
WO (1) WO2007045387A1 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006003279B4 (de) * 2006-01-23 2010-03-25 W.C. Heraeus Gmbh Sputtertarget mit hochschmelzender Phase
SG174652A1 (en) * 2010-03-31 2011-10-28 Heraeus Gmbh W C Composition of sputtering target, sputtering target, and method of producing the same
JP5723247B2 (ja) * 2011-09-09 2015-05-27 株式会社Ｓｈカッパープロダクツ 円筒型スパッタリングターゲット材、それを用いた配線基板及び薄膜トランジスタの製造方法
JP5472353B2 (ja) 2012-03-27 2014-04-16 三菱マテリアル株式会社 銀系円筒ターゲット及びその製造方法
DE102012017033A1 (de) * 2012-08-29 2014-05-28 Oerlikon Trading Ag, Trübbach PVD Lichtbogenbeschichtung mit verbesserten reibungsmindernden und verschleissreduzierenden Eigenschaften
GB201216283D0 (en) 2012-09-12 2012-10-24 Stannah Stairlifts Ltd Improvements in or relating to stairlifts
EP3168325B1 (de) * 2015-11-10 2022-01-05 Materion Advanced Materials Germany GmbH Sputtertarget auf der basis einer silberlegierung
KR102614205B1 (ko) 2016-06-02 2023-12-14 다나카 기킨조쿠 고교 가부시키가이샤 금 스퍼터링 타깃
AT15356U1 (de) * 2016-09-29 2017-07-15 Plansee Se Sputtering Target
JP7274816B2 (ja) 2017-12-06 2023-05-17 田中貴金属工業株式会社 金スパッタリングターゲットとその製造方法
EP3722454A4 (de) 2017-12-06 2021-04-14 Tanaka Kikinzoku Kogyo K.K. Verfahren zur herstellung eines goldsputtertargets und verfahren zur herstellung eines goldfilms
CN111590279A (zh) * 2020-06-03 2020-08-28 福建阿石创新材料股份有限公司 一种高纯金属旋转靶材及其制备方法
CN112030119A (zh) * 2020-08-27 2020-12-04 苏州思菲科新材料科技有限公司 一种铟管靶及其制备方法
CN112981335B (zh) * 2021-02-09 2022-10-04 丰联科光电(洛阳)股份有限公司 一种高纯铜管靶的制备方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2757287B2 (ja) * 1989-11-02 1998-05-25 日立金属株式会社 タングステンターゲットの製造方法
EP0735152B1 (de) * 1993-12-14 2002-04-17 Kabushiki Kaisha Toshiba Molybdän-wolfram-material zum verdrahten, molybdän-wolfram-target zum verdrahten, verfahren zu deren herstellung und dünne molybdän-wolfram verdrahtung
DE19710903A1 (de) * 1997-03-15 1998-09-17 Leybold Materials Gmbh Sputtertarget zur Herstellung von Phase-Change Schichten (optischen Speicherschichten)
DE19735734B4 (de) * 1997-08-18 2008-01-03 W.C. Heraeus Gmbh Pulvermetallurgisches Sputtertarget auf der Basis von Wismut und Verfahren zu seiner Herstellung
US20020014406A1 (en) * 1998-05-21 2002-02-07 Hiroshi Takashima Aluminum target material for sputtering and method for producing same
JP3743740B2 (ja) * 1998-07-27 2006-02-08 日立金属株式会社 Ｍｏ系焼結ターゲット材
US6176944B1 (en) * 1999-11-01 2001-01-23 Praxair S.T. Technology, Inc. Method of making low magnetic permeability cobalt sputter targets
DE19953470A1 (de) * 1999-11-05 2001-05-23 Heraeus Gmbh W C Rohrtarget
DE10017414A1 (de) * 2000-04-07 2001-10-11 Unaxis Materials Deutschland G Sputtertarget auf der Basis eines Metalls oder einer Metalllegierung und Verfahren zu dessen Herstellung
US6759005B2 (en) * 2002-07-23 2004-07-06 Heraeus, Inc. Fabrication of B/C/N/O/Si doped sputtering targets
JP3754011B2 (ja) * 2002-09-04 2006-03-08 デプト株式会社 電子部品用金属材料、電子部品、電子機器、金属材料の加工方法、電子部品の製造方法及び電子光学部品
US20050279630A1 (en) * 2004-06-16 2005-12-22 Dynamic Machine Works, Inc. Tubular sputtering targets and methods of flowforming the same
AT7491U1 (de) * 2004-07-15 2005-04-25 Plansee Ag Werkstoff für leitbahnen aus kupferlegierung

Also Published As

Publication number Publication date
AT506851A1 (de) 2009-12-15
CN101283113A (zh) 2008-10-08
AT506851B1 (de) 2010-02-15
DE102005050424A1 (de) 2007-04-26
TW200720458A (en) 2007-06-01
JP2009512779A (ja) 2009-03-26
WO2007045387A1 (de) 2007-04-26
DE102005050424B4 (de) 2009-10-22

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