TW200720458A - Sputter target of multi-component alloys and methods of production - Google Patents

Sputter target of multi-component alloys and methods of production

Info

Publication number
TW200720458A
TW200720458A TW095138435A TW95138435A TW200720458A TW 200720458 A TW200720458 A TW 200720458A TW 095138435 A TW095138435 A TW 095138435A TW 95138435 A TW95138435 A TW 95138435A TW 200720458 A TW200720458 A TW 200720458A
Authority
TW
Taiwan
Prior art keywords
sputter target
production
methods
component alloys
diameter
Prior art date
Application number
TW095138435A
Other languages
English (en)
Inventor
Martin Schlott
Hans-Joachim Pavel
Markus Schultheis
Original Assignee
Heraeus Gmbh W C
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heraeus Gmbh W C filed Critical Heraeus Gmbh W C
Publication of TW200720458A publication Critical patent/TW200720458A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F5/00—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product
    • B22F5/10—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product of articles with cavities or holes, not otherwise provided for in the preceding subgroups
    • B22F5/106—Tube or ring forms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/12—Both compacting and sintering
    • B22F3/14—Both compacting and sintering simultaneously
    • B22F3/15—Hot isostatic pressing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F5/00—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product
    • B22F5/006—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product of flat products, e.g. sheets
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
    • B22F2998/10—Processes characterised by the sequence of their steps

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Powder Metallurgy (AREA)
TW095138435A 2005-10-19 2006-10-18 Sputter target of multi-component alloys and methods of production TW200720458A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102005050424A DE102005050424B4 (de) 2005-10-19 2005-10-19 Sputtertarget aus mehrkomponentigen Legierungen

Publications (1)

Publication Number Publication Date
TW200720458A true TW200720458A (en) 2007-06-01

Family

ID=37450927

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095138435A TW200720458A (en) 2005-10-19 2006-10-18 Sputter target of multi-component alloys and methods of production

Country Status (7)

Country Link
JP (1) JP2009512779A (zh)
KR (1) KR20080056715A (zh)
CN (1) CN101283113A (zh)
AT (1) AT506851B1 (zh)
DE (1) DE102005050424B4 (zh)
TW (1) TW200720458A (zh)
WO (1) WO2007045387A1 (zh)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006003279B4 (de) * 2006-01-23 2010-03-25 W.C. Heraeus Gmbh Sputtertarget mit hochschmelzender Phase
SG174652A1 (en) * 2010-03-31 2011-10-28 Heraeus Gmbh W C Composition of sputtering target, sputtering target, and method of producing the same
JP5723247B2 (ja) * 2011-09-09 2015-05-27 株式会社Ｓｈカッパープロダクツ 円筒型スパッタリングターゲット材、それを用いた配線基板及び薄膜トランジスタの製造方法
JP5472353B2 (ja) * 2012-03-27 2014-04-16 三菱マテリアル株式会社 銀系円筒ターゲット及びその製造方法
DE102012017033A1 (de) * 2012-08-29 2014-05-28 Oerlikon Trading Ag, Trübbach PVD Lichtbogenbeschichtung mit verbesserten reibungsmindernden und verschleissreduzierenden Eigenschaften
GB201216283D0 (en) 2012-09-12 2012-10-24 Stannah Stairlifts Ltd Improvements in or relating to stairlifts
EP3168325B1 (de) * 2015-11-10 2022-01-05 Materion Advanced Materials Germany GmbH Sputtertarget auf der basis einer silberlegierung
TWI752035B (zh) 2016-06-02 2022-01-11 日商田中貴金屬工業股份有限公司 金濺鍍靶材
AT15356U1 (de) 2016-09-29 2017-07-15 Plansee Se Sputtering Target
TWI809013B (zh) 2017-12-06 2023-07-21 日商田中貴金屬工業股份有限公司 金濺鍍靶材的製造方法及金膜的製造方法
JP7274816B2 (ja) 2017-12-06 2023-05-17 田中貴金属工業株式会社 金スパッタリングターゲットとその製造方法
CN111590279A (zh) * 2020-06-03 2020-08-28 福建阿石创新材料股份有限公司 一种高纯金属旋转靶材及其制备方法
CN112030119A (zh) * 2020-08-27 2020-12-04 苏州思菲科新材料科技有限公司 一种铟管靶及其制备方法
CN112981335B (zh) * 2021-02-09 2022-10-04 丰联科光电(洛阳)股份有限公司 一种高纯铜管靶的制备方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2757287B2 (ja) * 1989-11-02 1998-05-25 日立金属株式会社 タングステンターゲットの製造方法
JP3445276B2 (ja) * 1993-12-14 2003-09-08 株式会社東芝 配線形成用Ｍｏ−ＷターゲットとＭｏ−Ｗ配線薄膜、およびそれを用いた液晶表示装置
DE19710903A1 (de) * 1997-03-15 1998-09-17 Leybold Materials Gmbh Sputtertarget zur Herstellung von Phase-Change Schichten (optischen Speicherschichten)
DE19735734B4 (de) * 1997-08-18 2008-01-03 W.C. Heraeus Gmbh Pulvermetallurgisches Sputtertarget auf der Basis von Wismut und Verfahren zu seiner Herstellung
US20020014406A1 (en) * 1998-05-21 2002-02-07 Hiroshi Takashima Aluminum target material for sputtering and method for producing same
JP3743740B2 (ja) * 1998-07-27 2006-02-08 日立金属株式会社 Ｍｏ系焼結ターゲット材
US6176944B1 (en) * 1999-11-01 2001-01-23 Praxair S.T. Technology, Inc. Method of making low magnetic permeability cobalt sputter targets
DE19953470A1 (de) * 1999-11-05 2001-05-23 Heraeus Gmbh W C Rohrtarget
DE10017414A1 (de) * 2000-04-07 2001-10-11 Unaxis Materials Deutschland G Sputtertarget auf der Basis eines Metalls oder einer Metalllegierung und Verfahren zu dessen Herstellung
US6759005B2 (en) * 2002-07-23 2004-07-06 Heraeus, Inc. Fabrication of B/C/N/O/Si doped sputtering targets
JP3754011B2 (ja) * 2002-09-04 2006-03-08 デプト株式会社 電子部品用金属材料、電子部品、電子機器、金属材料の加工方法、電子部品の製造方法及び電子光学部品
US20050279630A1 (en) * 2004-06-16 2005-12-22 Dynamic Machine Works, Inc. Tubular sputtering targets and methods of flowforming the same
AT7491U1 (de) * 2004-07-15 2005-04-25 Plansee Ag Werkstoff für leitbahnen aus kupferlegierung

Also Published As

Publication number Publication date
AT506851B1 (de) 2010-02-15
CN101283113A (zh) 2008-10-08
DE102005050424A1 (de) 2007-04-26
DE102005050424B4 (de) 2009-10-22
AT506851A1 (de) 2009-12-15
JP2009512779A (ja) 2009-03-26
WO2007045387A1 (de) 2007-04-26
KR20080056715A (ko) 2008-06-23

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