CN101283113A - 多组分合金溅射靶及其制备方法 - Google Patents

多组分合金溅射靶及其制备方法 Download PDF

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Publication number
CN101283113A
CN101283113A CNA200680037768XA CN200680037768A CN101283113A CN 101283113 A CN101283113 A CN 101283113A CN A200680037768X A CNA200680037768X A CN A200680037768XA CN 200680037768 A CN200680037768 A CN 200680037768A CN 101283113 A CN101283113 A CN 101283113A
Authority
CN
China
Prior art keywords
sputtering target
target
phase
described material
diameter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA200680037768XA
Other languages
English (en)
Chinese (zh)
Inventor
马丁·施洛特
汉斯-约阿希姆·帕维尔
马库斯·舒尔特海斯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
WC Heraus GmbH and Co KG
Original Assignee
WC Heraus GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by WC Heraus GmbH and Co KG filed Critical WC Heraus GmbH and Co KG
Publication of CN101283113A publication Critical patent/CN101283113A/zh
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F5/00—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product
    • B22F5/10—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product of articles with cavities or holes, not otherwise provided for in the preceding subgroups
    • B22F5/106—Tube or ring forms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/12—Both compacting and sintering
    • B22F3/14—Both compacting and sintering simultaneously
    • B22F3/15—Hot isostatic pressing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F5/00—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product
    • B22F5/006—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product of flat products, e.g. sheets
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
    • B22F2998/10—Processes characterised by the sequence of their steps

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Powder Metallurgy (AREA)
CNA200680037768XA 2005-10-19 2006-10-11 多组分合金溅射靶及其制备方法 Pending CN101283113A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102005050424.8 2005-10-19
DE102005050424A DE102005050424B4 (de) 2005-10-19 2005-10-19 Sputtertarget aus mehrkomponentigen Legierungen

Publications (1)

Publication Number Publication Date
CN101283113A true CN101283113A (zh) 2008-10-08

Family

ID=37450927

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA200680037768XA Pending CN101283113A (zh) 2005-10-19 2006-10-11 多组分合金溅射靶及其制备方法

Country Status (7)

Country Link
JP (1) JP2009512779A (de)
KR (1) KR20080056715A (de)
CN (1) CN101283113A (de)
AT (1) AT506851B1 (de)
DE (1) DE102005050424B4 (de)
TW (1) TW200720458A (de)
WO (1) WO2007045387A1 (de)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102206804A (zh) * 2010-03-31 2011-10-05 W.C.贺利氏有限公司 溅射靶及其制备方法
CN104246002A (zh) * 2012-03-27 2014-12-24 三菱综合材料株式会社 银系圆筒靶材及其制造方法
CN109790617A (zh) * 2016-09-29 2019-05-21 普兰西股份有限公司 溅镀靶材
CN111590279A (zh) * 2020-06-03 2020-08-28 福建阿石创新材料股份有限公司 一种高纯金属旋转靶材及其制备方法
CN112030119A (zh) * 2020-08-27 2020-12-04 苏州思菲科新材料科技有限公司 一种铟管靶及其制备方法
CN112981335A (zh) * 2021-02-09 2021-06-18 洛阳高新四丰电子材料有限公司 一种高纯铜管靶的制备方法

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006003279B4 (de) * 2006-01-23 2010-03-25 W.C. Heraeus Gmbh Sputtertarget mit hochschmelzender Phase
JP5723247B2 (ja) * 2011-09-09 2015-05-27 株式会社Ｓｈカッパープロダクツ 円筒型スパッタリングターゲット材、それを用いた配線基板及び薄膜トランジスタの製造方法
DE102012017033A1 (de) * 2012-08-29 2014-05-28 Oerlikon Trading Ag, Trübbach PVD Lichtbogenbeschichtung mit verbesserten reibungsmindernden und verschleissreduzierenden Eigenschaften
GB201216283D0 (en) 2012-09-12 2012-10-24 Stannah Stairlifts Ltd Improvements in or relating to stairlifts
EP3168325B1 (de) * 2015-11-10 2022-01-05 Materion Advanced Materials Germany GmbH Sputtertarget auf der basis einer silberlegierung
KR20190015346A (ko) 2016-06-02 2019-02-13 다나카 기킨조쿠 고교 가부시키가이샤 금 스퍼터링 타깃
JP7274816B2 (ja) 2017-12-06 2023-05-17 田中貴金属工業株式会社 金スパッタリングターゲットとその製造方法
TWI809013B (zh) 2017-12-06 2023-07-21 日商田中貴金屬工業股份有限公司 金濺鍍靶材的製造方法及金膜的製造方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2757287B2 (ja) * 1989-11-02 1998-05-25 日立金属株式会社 タングステンターゲットの製造方法
KR100210525B1 (ko) * 1993-12-14 1999-07-15 니시무로 타이죠 배선형성용 몰리브덴-텅스텐재, 배선형성용 몰리브덴-텅스텐 타깃과 그 제조방법 및 몰리브덴-텅스텐 배선박막
DE19710903A1 (de) * 1997-03-15 1998-09-17 Leybold Materials Gmbh Sputtertarget zur Herstellung von Phase-Change Schichten (optischen Speicherschichten)
DE19735734B4 (de) * 1997-08-18 2008-01-03 W.C. Heraeus Gmbh Pulvermetallurgisches Sputtertarget auf der Basis von Wismut und Verfahren zu seiner Herstellung
US20020014406A1 (en) * 1998-05-21 2002-02-07 Hiroshi Takashima Aluminum target material for sputtering and method for producing same
JP3743740B2 (ja) * 1998-07-27 2006-02-08 日立金属株式会社 Ｍｏ系焼結ターゲット材
US6176944B1 (en) * 1999-11-01 2001-01-23 Praxair S.T. Technology, Inc. Method of making low magnetic permeability cobalt sputter targets
DE19953470A1 (de) * 1999-11-05 2001-05-23 Heraeus Gmbh W C Rohrtarget
DE10017414A1 (de) * 2000-04-07 2001-10-11 Unaxis Materials Deutschland G Sputtertarget auf der Basis eines Metalls oder einer Metalllegierung und Verfahren zu dessen Herstellung
US6759005B2 (en) * 2002-07-23 2004-07-06 Heraeus, Inc. Fabrication of B/C/N/O/Si doped sputtering targets
JP3754011B2 (ja) * 2002-09-04 2006-03-08 デプト株式会社 電子部品用金属材料、電子部品、電子機器、金属材料の加工方法、電子部品の製造方法及び電子光学部品
US20050279630A1 (en) * 2004-06-16 2005-12-22 Dynamic Machine Works, Inc. Tubular sputtering targets and methods of flowforming the same
AT7491U1 (de) * 2004-07-15 2005-04-25 Plansee Ag Werkstoff für leitbahnen aus kupferlegierung

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102206804A (zh) * 2010-03-31 2011-10-05 W.C.贺利氏有限公司 溅射靶及其制备方法
CN104246002A (zh) * 2012-03-27 2014-12-24 三菱综合材料株式会社 银系圆筒靶材及其制造方法
CN104246002B (zh) * 2012-03-27 2015-11-25 三菱综合材料株式会社 银系圆筒靶材及其制造方法
CN109790617A (zh) * 2016-09-29 2019-05-21 普兰西股份有限公司 溅镀靶材
US11569075B2 (en) 2016-09-29 2023-01-31 Plansee Se Sputtering target
CN111590279A (zh) * 2020-06-03 2020-08-28 福建阿石创新材料股份有限公司 一种高纯金属旋转靶材及其制备方法
CN112030119A (zh) * 2020-08-27 2020-12-04 苏州思菲科新材料科技有限公司 一种铟管靶及其制备方法
CN112981335A (zh) * 2021-02-09 2021-06-18 洛阳高新四丰电子材料有限公司 一种高纯铜管靶的制备方法

Also Published As

Publication number Publication date
DE102005050424A1 (de) 2007-04-26
JP2009512779A (ja) 2009-03-26
KR20080056715A (ko) 2008-06-23
DE102005050424B4 (de) 2009-10-22
AT506851A1 (de) 2009-12-15
WO2007045387A1 (de) 2007-04-26
AT506851B1 (de) 2010-02-15
TW200720458A (en) 2007-06-01

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AD01 Patent right deemed abandoned

Effective date of abandoning: 20081008

C20 Patent right or utility model deemed to be abandoned or is abandoned