KR20070114391A - 도금기재 - Google Patents
도금기재 Download PDFInfo
- Publication number
- KR20070114391A KR20070114391A KR1020077023727A KR20077023727A KR20070114391A KR 20070114391 A KR20070114391 A KR 20070114391A KR 1020077023727 A KR1020077023727 A KR 1020077023727A KR 20077023727 A KR20077023727 A KR 20077023727A KR 20070114391 A KR20070114391 A KR 20070114391A
- Authority
- KR
- South Korea
- Prior art keywords
- plating
- film
- electroless
- less
- plating film
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1651—Two or more layers only obtained by electroless plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/072—Electroless plating, e.g. finish plating or initial plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/073—Displacement plating, substitution plating or immersion plating, e.g. for finish plating
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2005-00105625 | 2005-04-01 | ||
JP2005105625 | 2005-04-01 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20070114391A true KR20070114391A (ko) | 2007-12-03 |
Family
ID=37114947
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020077023727A KR20070114391A (ko) | 2005-04-01 | 2006-03-13 | 도금기재 |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP4926053B2 (ja) |
KR (1) | KR20070114391A (ja) |
CN (2) | CN101151399B (ja) |
HK (1) | HK1116838A1 (ja) |
TW (1) | TWI316095B (ja) |
WO (1) | WO2006112215A1 (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007031740A (ja) * | 2005-07-22 | 2007-02-08 | Shinko Electric Ind Co Ltd | 電子部品及びその製造方法 |
JP5288362B2 (ja) * | 2007-01-17 | 2013-09-11 | 奥野製薬工業株式会社 | 多層めっき皮膜及びプリント配線板 |
JP5013077B2 (ja) | 2007-04-16 | 2012-08-29 | 上村工業株式会社 | 無電解金めっき方法及び電子部品 |
EP2177646B1 (en) * | 2008-10-17 | 2011-03-23 | ATOTECH Deutschland GmbH | Stress-reduced Ni-P/Pd stacks for bondable wafer surfaces |
JP5680342B2 (ja) * | 2009-09-02 | 2015-03-04 | Tdk株式会社 | めっき膜、プリント配線板及びモジュール基板 |
WO2011099597A1 (ja) * | 2010-02-15 | 2011-08-18 | 荏原ユージライト株式会社 | プリント配線板の製造方法 |
CN102802364B (zh) * | 2012-09-11 | 2014-11-05 | 深圳市和美精艺科技有限公司 | 一种在印刷电路板的导电层中设置金属钯层的方法及其层状结构 |
JP6466521B2 (ja) * | 2017-06-28 | 2019-02-06 | 小島化学薬品株式会社 | 無電解めっきプロセス |
EP3730671A4 (en) * | 2017-12-19 | 2021-08-18 | JX Nippon Mining & Metals Corporation | SEMICONDUCTOR WAFER AND METHOD OF MANUFACTURING THEREOF |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04307736A (ja) * | 1991-04-04 | 1992-10-29 | Canon Inc | 微細多層構造半導体素子の配線方法 |
JPH081980B2 (ja) * | 1993-11-25 | 1996-01-10 | 大日工業株式会社 | プリント配線板及びその製造方法 |
JP2785102B2 (ja) * | 1994-03-31 | 1998-08-13 | 株式会社ジャパンエナジー | 無電解金めっき方法 |
JP3345529B2 (ja) * | 1995-06-20 | 2002-11-18 | 日立化成工業株式会社 | ワイヤボンディング用端子とその製造方法並びにそのワイヤボンディング端子を用いた半導体搭載用基板の製造方法 |
JPH09172236A (ja) * | 1995-12-20 | 1997-06-30 | Seiichi Serizawa | プリント配線板 |
JPH10287994A (ja) * | 1997-04-14 | 1998-10-27 | World Metal:Kk | ボンディング部のメッキ構造 |
JP2001358164A (ja) * | 2000-06-13 | 2001-12-26 | Ne Chemcat Corp | 無電解多層めっき皮膜が形成された電極及びその製造方法 |
CN1143656C (zh) * | 2001-01-10 | 2004-03-31 | 中国科学院上海原子核研究所 | 一种32p放射性血管支架及其制作方法 |
JP2003226993A (ja) * | 2002-02-01 | 2003-08-15 | Electroplating Eng Of Japan Co | 金メッキ液及び金メッキ処理方法 |
-
2006
- 2006-03-13 CN CN200680009942XA patent/CN101151399B/zh active Active
- 2006-03-13 JP JP2007521139A patent/JP4926053B2/ja active Active
- 2006-03-13 CN CN2010101334459A patent/CN101942652B/zh active Active
- 2006-03-13 WO PCT/JP2006/304881 patent/WO2006112215A1/ja active Application Filing
- 2006-03-13 KR KR1020077023727A patent/KR20070114391A/ko not_active Application Discontinuation
- 2006-03-31 TW TW095111454A patent/TWI316095B/zh active
-
2008
- 2008-06-18 HK HK08106771.4A patent/HK1116838A1/xx unknown
Also Published As
Publication number | Publication date |
---|---|
WO2006112215A1 (ja) | 2006-10-26 |
HK1116838A1 (en) | 2009-01-02 |
TWI316095B (en) | 2009-10-21 |
JP4926053B2 (ja) | 2012-05-09 |
CN101151399B (zh) | 2010-12-29 |
CN101942652B (zh) | 2012-06-27 |
CN101151399A (zh) | 2008-03-26 |
TW200643215A (en) | 2006-12-16 |
JPWO2006112215A1 (ja) | 2008-12-04 |
CN101942652A (zh) | 2011-01-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR20070114391A (ko) | 도금기재 | |
KR101058635B1 (ko) | 무전해 니켈 도금액 조성물, 연성인쇄회로기판 및 이의 제조 방법 | |
KR101431491B1 (ko) | 무전해 금도금 방법 및 전자 부품 | |
KR100688833B1 (ko) | 인쇄회로기판의 도금층 형성방법 및 이로부터 제조된인쇄회로기판 | |
KR102096117B1 (ko) | 플렉시블 기판 상의 무전해 니켈 인 합금 성막 방법 | |
KR101393478B1 (ko) | 무전해 금도금욕, 무전해 금도금 방법 및 전자 부품 | |
KR101184796B1 (ko) | 기판 구조물 및 그 제조 방법 | |
US6336962B1 (en) | Method and solution for producing gold coating | |
WO2005034597A1 (ja) | 配線基板のパッド構造及び配線基板 | |
JP3482402B2 (ja) | 置換金メッキ液 | |
KR101719180B1 (ko) | 무전해 팔라듐 도금 또는 무전해 팔라듐 합금 도금의 전처리용 활성화액 | |
JP2007177268A (ja) | 無電解ニッケルめっき用貴金属表面活性化液 | |
JP5978587B2 (ja) | 半導体パッケージ及びその製造方法 | |
JPH0828561B2 (ja) | プリント配線板の製造法 | |
US6698648B2 (en) | Method for producing solderable and functional surfaces on circuit carriers | |
CN109457239B (zh) | 还原型非氰镀金液、镀金方法以及镀金产品 | |
JPH05327187A (ja) | プリント配線板及びその製造法 | |
EP0697805A1 (en) | Printed circuit board manufacture utilizing electroless palladium | |
JP2010196121A (ja) | 無電解パラジウムめっき浴及び無電解パラジウムめっき方法 | |
JPH07268640A (ja) | 無電解金めっき方法 | |
JP2005163153A (ja) | 無電解ニッケル置換金めっき処理層、無電解ニッケルめっき液、および無電解ニッケル置換金めっき処理方法 | |
KR20060006536A (ko) | 반도체 패키지용 인쇄회로기판의 도금층 형성방법 및이로부터 제조된 인쇄회로기판 | |
JP2020105543A (ja) | 置換金めっき液および置換金めっき方法 | |
WO2015091232A1 (en) | Silver wire bonding on printed circuit boards and ic-substrates | |
JP2010242194A (ja) | 置換析出型無電解金めっきの前処理用活性化液 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E601 | Decision to refuse application | ||
J201 | Request for trial against refusal decision | ||
J301 | Trial decision |
Free format text: TRIAL DECISION FOR APPEAL AGAINST DECISION TO DECLINE REFUSAL REQUESTED 20091104 Effective date: 20111028 |