KR20070098466A - 레이저 가공 방법 - Google Patents

레이저 가공 방법 Download PDF

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Publication number
KR20070098466A
KR20070098466A KR1020070007542A KR20070007542A KR20070098466A KR 20070098466 A KR20070098466 A KR 20070098466A KR 1020070007542 A KR1020070007542 A KR 1020070007542A KR 20070007542 A KR20070007542 A KR 20070007542A KR 20070098466 A KR20070098466 A KR 20070098466A
Authority
KR
South Korea
Prior art keywords
hole
laser beam
laser
processing
diameter
Prior art date
Application number
KR1020070007542A
Other languages
English (en)
Korean (ko)
Inventor
다이스케 기타무라
소우이치 도야마
야이치 오쿠보
히로유키 스가와라
하루아키 오쓰키
Original Assignee
히다치 비아 메카닉스 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 히다치 비아 메카닉스 가부시키가이샤 filed Critical 히다치 비아 메카닉스 가부시키가이샤
Publication of KR20070098466A publication Critical patent/KR20070098466A/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/10—Scanning systems
    • G02B26/105—Scanning systems with one or more pivoting mirrors or galvano-mirrors
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Human Computer Interaction (AREA)
  • Manufacturing & Machinery (AREA)
  • Automation & Control Theory (AREA)
  • Laser Beam Processing (AREA)
KR1020070007542A 2006-03-31 2007-01-24 레이저 가공 방법 KR20070098466A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2006-00098649 2006-03-31
JP2006098649A JP2007268576A (ja) 2006-03-31 2006-03-31 レーザ加工方法

Publications (1)

Publication Number Publication Date
KR20070098466A true KR20070098466A (ko) 2007-10-05

Family

ID=38671913

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020070007542A KR20070098466A (ko) 2006-03-31 2007-01-24 레이저 가공 방법

Country Status (4)

Country Link
JP (1) JP2007268576A (ja)
KR (1) KR20070098466A (ja)
CN (1) CN101045271A (ja)
TW (1) TW200738387A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200065097A (ko) * 2011-12-20 2020-06-08 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 경화된 실리콘에 테이퍼를 최소화한 구멍을 천공하는 방법

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009252892A (ja) * 2008-04-03 2009-10-29 Mitsubishi Electric Corp レーザ加工方法、プリント基板製造方法およびレーザ加工装置
KR101179983B1 (ko) * 2009-02-23 2012-09-07 한미반도체 주식회사 반도체 패키지의 가공을 위한 레이저 빔 조사 궤적 생성방법
CN102473632A (zh) * 2009-10-13 2012-05-23 三菱综合材料株式会社 电极板的通气孔形成方法
CN101829850A (zh) * 2010-04-01 2010-09-15 深圳市大族激光科技股份有限公司 盲孔加工方法
CN102489884A (zh) * 2011-12-02 2012-06-13 深圳光韵达光电科技股份有限公司 一种激光切割圆孔或椭圆孔的方法
CN103212857B (zh) * 2012-01-19 2015-09-30 昆山思拓机器有限公司 一种fpc盲孔加工方法
WO2014002620A1 (ja) * 2012-06-27 2014-01-03 三菱電機株式会社 レーザー加工方法
DE102012111771B4 (de) * 2012-12-04 2020-12-03 Ewag Ag Verfahren zur Bearbeitung eines Werkstücks unter Verwendung einer Laserbearbeitungsvorrichtung zur Herstellung eines Schneidwerkzeugs
CN104703398B (zh) * 2015-03-27 2018-01-09 大族激光科技产业集团股份有限公司 一种fpc盲孔的螺旋加工轨迹的优化方法
JP6203297B2 (ja) * 2016-01-12 2017-09-27 株式会社エイチワン レーザ重ね溶接方法
JP6769146B2 (ja) 2016-07-13 2020-10-14 オムロン株式会社 レーザ加工方法およびレーザ加工装置
CN108971775B (zh) * 2017-06-02 2021-05-18 大族激光科技产业集团股份有限公司 一种用于金属的激光打孔方法及设备
CN108188585B (zh) * 2017-12-25 2020-04-17 大族激光科技产业集团股份有限公司 一种在陶瓷上加工cd纹的方法
CN108406141B (zh) * 2018-04-18 2024-05-03 西安中科微精光子科技股份有限公司 基于光学相干层析扫描的超快激光微孔加工方法及装置
CN111151898A (zh) * 2020-01-07 2020-05-15 深圳市吉祥云科技有限公司 一种呈螺旋方向上升且振幅盘绕的打孔方法及打孔系统
CN113441852B (zh) * 2021-06-24 2022-07-19 中国科学院西安光学精密机械研究所 一种激光螺旋扫描盲孔制造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10207288B4 (de) * 2002-02-21 2005-05-04 Newson Engineering Nv Verfahren zum Bohren von Löchern mittels eines Laserstrahls in einem Substrat, insbesondere in einem elektrischen Schaltungsubstrat
US7259354B2 (en) * 2004-08-04 2007-08-21 Electro Scientific Industries, Inc. Methods for processing holes by moving precisely timed laser pulses in circular and spiral trajectories
JP4614844B2 (ja) * 2005-08-05 2011-01-19 住友重機械工業株式会社 レーザ加工方法及びレーザ加工装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200065097A (ko) * 2011-12-20 2020-06-08 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 경화된 실리콘에 테이퍼를 최소화한 구멍을 천공하는 방법

Also Published As

Publication number Publication date
JP2007268576A (ja) 2007-10-18
CN101045271A (zh) 2007-10-03
TW200738387A (en) 2007-10-16

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E902 Notification of reason for refusal
E601 Decision to refuse application