TW200738387A - Laser machining method - Google Patents

Laser machining method

Info

Publication number
TW200738387A
TW200738387A TW096103987A TW96103987A TW200738387A TW 200738387 A TW200738387 A TW 200738387A TW 096103987 A TW096103987 A TW 096103987A TW 96103987 A TW96103987 A TW 96103987A TW 200738387 A TW200738387 A TW 200738387A
Authority
TW
Taiwan
Prior art keywords
hole
track
center portion
laser machining
machining method
Prior art date
Application number
TW096103987A
Other languages
English (en)
Chinese (zh)
Inventor
Daisuke Kitamura
Souichi Toyama
Yaichi Okubo
Hiroyuki Sugawara
Haruaki Otsuki
Original Assignee
Hitachi Via Mechanics Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Via Mechanics Ltd filed Critical Hitachi Via Mechanics Ltd
Publication of TW200738387A publication Critical patent/TW200738387A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/10—Scanning systems
    • G02B26/105—Scanning systems with one or more pivoting mirrors or galvano-mirrors
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Human Computer Interaction (AREA)
  • Manufacturing & Machinery (AREA)
  • Automation & Control Theory (AREA)
  • Laser Beam Processing (AREA)
TW096103987A 2006-03-31 2007-02-05 Laser machining method TW200738387A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006098649A JP2007268576A (ja) 2006-03-31 2006-03-31 レーザ加工方法

Publications (1)

Publication Number Publication Date
TW200738387A true TW200738387A (en) 2007-10-16

Family

ID=38671913

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096103987A TW200738387A (en) 2006-03-31 2007-02-05 Laser machining method

Country Status (4)

Country Link
JP (1) JP2007268576A (ja)
KR (1) KR20070098466A (ja)
CN (1) CN101045271A (ja)
TW (1) TW200738387A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102489884A (zh) * 2011-12-02 2012-06-13 深圳光韵达光电科技股份有限公司 一种激光切割圆孔或椭圆孔的方法

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009252892A (ja) * 2008-04-03 2009-10-29 Mitsubishi Electric Corp レーザ加工方法、プリント基板製造方法およびレーザ加工装置
KR101179983B1 (ko) * 2009-02-23 2012-09-07 한미반도체 주식회사 반도체 패키지의 가공을 위한 레이저 빔 조사 궤적 생성방법
CN102473632A (zh) * 2009-10-13 2012-05-23 三菱综合材料株式会社 电极板的通气孔形成方法
CN101829850A (zh) * 2010-04-01 2010-09-15 深圳市大族激光科技股份有限公司 盲孔加工方法
US9289858B2 (en) * 2011-12-20 2016-03-22 Electro Scientific Industries, Inc. Drilling holes with minimal taper in cured silicone
CN103212857B (zh) * 2012-01-19 2015-09-30 昆山思拓机器有限公司 一种fpc盲孔加工方法
WO2014002620A1 (ja) * 2012-06-27 2014-01-03 三菱電機株式会社 レーザー加工方法
DE102012111771B4 (de) * 2012-12-04 2020-12-03 Ewag Ag Verfahren zur Bearbeitung eines Werkstücks unter Verwendung einer Laserbearbeitungsvorrichtung zur Herstellung eines Schneidwerkzeugs
CN104703398B (zh) * 2015-03-27 2018-01-09 大族激光科技产业集团股份有限公司 一种fpc盲孔的螺旋加工轨迹的优化方法
JP6203297B2 (ja) * 2016-01-12 2017-09-27 株式会社エイチワン レーザ重ね溶接方法
JP6769146B2 (ja) 2016-07-13 2020-10-14 オムロン株式会社 レーザ加工方法およびレーザ加工装置
CN108971775B (zh) * 2017-06-02 2021-05-18 大族激光科技产业集团股份有限公司 一种用于金属的激光打孔方法及设备
CN108188585B (zh) * 2017-12-25 2020-04-17 大族激光科技产业集团股份有限公司 一种在陶瓷上加工cd纹的方法
CN108406141B (zh) * 2018-04-18 2024-05-03 西安中科微精光子科技股份有限公司 基于光学相干层析扫描的超快激光微孔加工方法及装置
CN111151898A (zh) * 2020-01-07 2020-05-15 深圳市吉祥云科技有限公司 一种呈螺旋方向上升且振幅盘绕的打孔方法及打孔系统
CN113441852B (zh) * 2021-06-24 2022-07-19 中国科学院西安光学精密机械研究所 一种激光螺旋扫描盲孔制造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10207288B4 (de) * 2002-02-21 2005-05-04 Newson Engineering Nv Verfahren zum Bohren von Löchern mittels eines Laserstrahls in einem Substrat, insbesondere in einem elektrischen Schaltungsubstrat
US7259354B2 (en) * 2004-08-04 2007-08-21 Electro Scientific Industries, Inc. Methods for processing holes by moving precisely timed laser pulses in circular and spiral trajectories
JP4614844B2 (ja) * 2005-08-05 2011-01-19 住友重機械工業株式会社 レーザ加工方法及びレーザ加工装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102489884A (zh) * 2011-12-02 2012-06-13 深圳光韵达光电科技股份有限公司 一种激光切割圆孔或椭圆孔的方法

Also Published As

Publication number Publication date
JP2007268576A (ja) 2007-10-18
KR20070098466A (ko) 2007-10-05
CN101045271A (zh) 2007-10-03

Similar Documents

Publication Publication Date Title
TW200738387A (en) Laser machining method
MY149660A (en) Laser processing method and semiconductor chip
MY141077A (en) Laser processing method
WO2008114470A1 (ja) プラスチック基板の切断方法、及びプラスチック基板の切断装置
WO2006070009A3 (de) Verfahren und rotationslaser zum ermitteln einer lageinformation mindestens eines objekts
EP1777031A4 (en) LASER TREATMENT METHOD
WO2007115221A3 (en) Identifying a result responsive to a current location of a client device
WO2009061766A3 (en) Methods and apparatuses for forming cutting elements having a chamfered edge for earth-boring tools
WO2007059063A8 (en) Cutting tool having variable movement in a z-direction laterally along a work piece for making microstructures
TW200709877A (en) Drill head for deep hole machining
WO2007021592A8 (en) Model for process and workflows
PL1995013T3 (pl) Sposób i system zapewniające wyeliminowanie zewnętrznego przebijania otworów podczas sterowanego numerycznie wycinania zgrupowanych elementów
ATE407759T1 (de) Schneidwerkzeug und schneideinsatz dafür
WO2007097854A3 (en) Arthroplasty jigs and related methods
SE0800265L (sv) Verktyg för spånavskiljande bearbetning, samt grundkropp och skär härför
ATE535356T1 (de) Einteiliger schneidkopf für einen bohrer
WO2011051435A3 (en) Downhole system
DK1882080T3 (da) Brøndboringsrenseredskab og -fremgangsmåde
ATE452719T1 (de) Werkzeug zur spanenden bearbeitung von bohrungen
IL205243A0 (en) Cutting tool with protrusions, and methods of use thereof
ATE519220T1 (de) System und verfahren zum elektronenstrahlschreiben
DK2067552T3 (da) Skæreværktøj til spåntagende bearbejdning af arbejdsemner
SE0700860L (sv) Skär, skärverktyg och bearbetningsmetod
BRPI0402812A (pt) Eletrocerâmica metalizada irradiada por laser
WO2007124178A3 (en) Methods for processing formatted data