KR20040038710A - 반도체 장치 및 반도체 장치의 제조 방법 - Google Patents
반도체 장치 및 반도체 장치의 제조 방법 Download PDFInfo
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- KR20040038710A KR20040038710A KR1020030075139A KR20030075139A KR20040038710A KR 20040038710 A KR20040038710 A KR 20040038710A KR 1020030075139 A KR1020030075139 A KR 1020030075139A KR 20030075139 A KR20030075139 A KR 20030075139A KR 20040038710 A KR20040038710 A KR 20040038710A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 186
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 99
- 239000000758 substrate Substances 0.000 claims abstract description 76
- 239000012212 insulator Substances 0.000 claims abstract description 59
- 239000004020 conductor Substances 0.000 claims abstract description 44
- 229910052751 metal Inorganic materials 0.000 claims abstract description 32
- 239000002184 metal Substances 0.000 claims abstract description 32
- 238000002955 isolation Methods 0.000 claims abstract description 30
- 239000012535 impurity Substances 0.000 claims description 59
- 238000009792 diffusion process Methods 0.000 claims description 52
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 48
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 48
- 238000000034 method Methods 0.000 claims description 38
- 229910021332 silicide Inorganic materials 0.000 claims description 34
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 claims description 33
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 29
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical class N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 29
- 238000005530 etching Methods 0.000 claims description 11
- 229910000577 Silicon-germanium Inorganic materials 0.000 claims description 6
- LEVVHYCKPQWKOP-UHFFFAOYSA-N [Si].[Ge] Chemical group [Si].[Ge] LEVVHYCKPQWKOP-UHFFFAOYSA-N 0.000 claims description 4
- 230000001590 oxidative effect Effects 0.000 claims description 2
- 238000000926 separation method Methods 0.000 claims description 2
- 150000004767 nitrides Chemical class 0.000 claims 1
- 239000010410 layer Substances 0.000 description 87
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 31
- 229910052710 silicon Inorganic materials 0.000 description 31
- 239000010703 silicon Substances 0.000 description 31
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 23
- 125000001475 halogen functional group Chemical group 0.000 description 11
- 238000005468 ion implantation Methods 0.000 description 10
- 230000004048 modification Effects 0.000 description 9
- 238000012986 modification Methods 0.000 description 9
- 238000000137 annealing Methods 0.000 description 6
- 239000010941 cobalt Substances 0.000 description 6
- 229910017052 cobalt Inorganic materials 0.000 description 6
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 5
- 238000005229 chemical vapour deposition Methods 0.000 description 5
- 150000002739 metals Chemical class 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 239000011229 interlayer Substances 0.000 description 3
- 239000010955 niobium Substances 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- 239000002356 single layer Substances 0.000 description 3
- 229910052715 tantalum Inorganic materials 0.000 description 3
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 230000004913 activation Effects 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 239000007772 electrode material Substances 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910021334 nickel silicide Inorganic materials 0.000 description 2
- RUFLMLWJRZAWLJ-UHFFFAOYSA-N nickel silicide Chemical compound [Ni]=[Si]=[Ni] RUFLMLWJRZAWLJ-UHFFFAOYSA-N 0.000 description 2
- 229910052758 niobium Inorganic materials 0.000 description 2
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 238000011084 recovery Methods 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 1
- IVHJCRXBQPGLOV-UHFFFAOYSA-N azanylidynetungsten Chemical compound [W]#N IVHJCRXBQPGLOV-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 description 1
- -1 halo ions Chemical class 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- PEUPIGGLJVUNEU-UHFFFAOYSA-N nickel silicon Chemical compound [Si].[Ni] PEUPIGGLJVUNEU-UHFFFAOYSA-N 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- VSZWPYCFIRKVQL-UHFFFAOYSA-N selanylidenegallium;selenium Chemical compound [Se].[Se]=[Ga].[Se]=[Ga] VSZWPYCFIRKVQL-UHFFFAOYSA-N 0.000 description 1
- 238000000992 sputter etching Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7833—Field effect transistors with field effect produced by an insulated gate with lightly doped drain or source extension, e.g. LDD MOSFET's; DDD MOSFET's
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- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
- H01L29/495—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET the conductor material next to the insulator being a simple metal, e.g. W, Mo
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- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
- H01L29/4966—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET the conductor material next to the insulator being a composite material, e.g. organic material, TiN, MoSi2
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- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
- H01L29/4966—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET the conductor material next to the insulator being a composite material, e.g. organic material, TiN, MoSi2
- H01L29/4975—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET the conductor material next to the insulator being a composite material, e.g. organic material, TiN, MoSi2 being a silicide layer, e.g. TiSi2
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66545—Unipolar field-effect transistors with an insulated gate, i.e. MISFET using a dummy, i.e. replacement gate in a process wherein at least a part of the final gate is self aligned to the dummy gate
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- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66568—Lateral single gate silicon transistors
- H01L29/66575—Lateral single gate silicon transistors where the source and drain or source and drain extensions are self-aligned to the sides of the gate
- H01L29/6659—Lateral single gate silicon transistors where the source and drain or source and drain extensions are self-aligned to the sides of the gate with both lightly doped source and drain extensions and source and drain self-aligned to the sides of the gate, e.g. lightly doped drain [LDD] MOSFET, double diffused drain [DDD] MOSFET
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- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66568—Lateral single gate silicon transistors
- H01L29/66606—Lateral single gate silicon transistors with final source and drain contacts formation strictly before final or dummy gate formation, e.g. contact first technology
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/28008—Making conductor-insulator-semiconductor electrodes
- H01L21/28017—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon
- H01L21/28158—Making the insulator
- H01L21/28167—Making the insulator on single crystalline silicon, e.g. using a liquid, i.e. chemical oxidation
- H01L21/28194—Making the insulator on single crystalline silicon, e.g. using a liquid, i.e. chemical oxidation by deposition, e.g. evaporation, ALD, CVD, sputtering, laser deposition
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- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
- H01L29/51—Insulating materials associated therewith
- H01L29/517—Insulating materials associated therewith the insulating material comprising a metallic compound, e.g. metal oxide, metal silicate
Abstract
Description
Claims (20)
- 제1 상면을 갖는 소자 영역과, 상기 제1 상면보다 낮은 제2 상면을 갖고 상기 소자 영역을 둘러싼 분리 영역을 갖는 반도체 기판과,상기 제2 상면 위에 형성되며 상기 소자 영역에 접하여 상기 제1 상면보다 높은 제3 상면을 갖는 제1 절연체와, 상기 제2 상면 위에 형성되며 상기 소자 영역과 상기 제1 절연체에 접하여 상기 제3 상면보다 높은 제4 상면을 갖는 제2 절연체를 갖는 소자 분리 절연체와,상기 제1 상면 위에 형성되며 상기 제2 절연체의 측면에 접하는 제1 측벽과, 상기 제1 상면 위에 형성되며 양 단부가 상기 제1 측벽의 양 단부에 각각 접속되는 제2 측벽을 갖는 소스 측벽 절연체와,상기 제1 상면 위에 형성되며 상기 제2 절연체의 측면에 접하는 제3 측벽과, 상기 제1 상면 위에 상기 제2 측벽에 평행하게 형성되어 양 단부가 상기 제3 측벽의 양 단부에 각각 접속되는 제4 측벽을 갖는 드레인 측벽 절연체와,상기 제1 상면 위와 상기 제3 상면 위에 형성되고, 상기 제2 절연체, 상기 제2 측벽과 상기 제4 측벽의 측면에 접하는 게이트 절연막과,상기 게이트 절연막 위에 형성되고, 측면이 상기 게이트 절연막에 접하는 게이트 도전체와,상기 제1 상면 상방에 형성되고, 상기 제1 상면과 전기적으로 접속되어, 측면이 상기 제1 측벽과 제2 측벽에 접하는 소스 도전체와,상기 제1 상면 상방에 형성되고, 상기 제1 상면과 전기적으로 접속되고, 측면이 상기 제3 측벽과 제4 측벽에 접하는 드레인 도전체를 갖는 것을 특징으로 하는 반도체 장치.
- 제1항에 있어서,상기 제1 측벽과 상기 제3 측벽의 최상부의 높이가 상기 제4 상면의 높이와 동일하거나 더 낮은 것을 특징으로 하는 반도체 장치.
- 제1항에 있어서,상기 제2 측벽과 상기 제4 측벽의 최상부의 높이가 상기 제4 상면의 높이와 동일한 것을 특징으로 하는 반도체 장치.
- 제1항에 있어서,상기 게이트 절연막과 상기 게이트 도전체의 최상부의 높이가 상기 제4 상면의 높이와 동일한 것을 특징으로 하는 반도체 장치.
- 제1항에 있어서,상기 소스 도전체와 상기 드레인 도전체의 최상부의 높이가 상기 제4 상면의 높이와 동일한 것을 특징으로 하는 반도체 장치.
- 제1항에 있어서,상기 게이트 도전체가 메탈인 것을 특징으로 하는 반도체 장치.
- 제1항에 있어서,상기 소스 도전체와 상기 드레인 도전체가 메탈인 것을 특징으로 하는 반도체 장치.
- 제1항에 있어서,상기 소스 도전체와 상기 드레인 도전체가 실리사이드인 것을 특징으로 하는 반도체 장치.
- 제1항에 있어서,상기 게이트 절연막이 고유전체를 갖는 것을 특징으로 하는 반도체 장치.
- 제1항에 있어서,상기 반도체 기판이 제1 도전형이고,상기 반도체 기판이, 상기 소스 도전체의 하방에 형성되어 상기 제1 상면을 포함한 제2 도전형의 소스 불순물 확산층과, 상기 드레인 도전체의 하방에 형성되어 상기 제1 상면을 포함한 제2 도전형의 드레인 불순물 확산층을 더 갖는 것을 특징으로 하는 반도체 장치.
- 제1항에 있어서,상기 제1 상면과 상기 소스 도전체 사이에 형성된 소스 실리사이드층과, 상기 제1 상면과 상기 드레인 도전체 사이에 형성된 드레인 실리사이드층을 더 갖는 것을 특징으로 하는 반도체 장치.
- 제1항에 있어서,상기 제1 측벽, 상기 제2 측벽, 상기 제3 측벽과 상기 제4 측벽은, 하층이 실리콘 산화막이고, 상층이 실리콘 질화막의 2층 구조인 것을 특징으로 하는 반도체 장치.
- 제1항에 있어서,상기 제1 측벽, 상기 제2 측벽, 상기 제3 측벽과 상기 제4 측벽은, 측면에 대한 수선 방향으로 실리콘 산화막과 실리콘 질화막의 2층 구조인 것을 특징으로 하는 반도체 장치.
- 반도체 기판 위에 섬 형상의 소자 영역을 형성하는 단계와,상기 소자 영역의 외주부에 소자 분리 영역을 형성하는 단계와,상기 소자 영역을 횡단하며, 단부가 상기 소자 분리 영역에 접한 더미 게이트를 형성하는 단계와,상기 소자 분리 영역에 상기 더미 게이트보다 낮은 제1 영역을 형성하는 단계와,상기 더미 게이트를 제외한 상기 소자 영역에 소스·드레인 영역을 형성하는 단계와,상기 소스·드레인 영역의 주변부에 측벽을 형성하는 단계와,상기 소스·드레인 영역의 하방의 반도체 기판에 소스·드레인 불순물 확산층을 형성하는 단계와,더미 게이트를 포함하는 게이트 배선 이외의 영역에 상기 더미 게이트와 동일한 높이의 반도체막을 형성하는 단계와,상기 반도체막의 상면을 산화하여, 실리콘 산화막을 형성하는 단계와,상기 실리콘 산화막을 마스크로 하여, 상기 소자 영역에 형성된 더미 게이트를 제거하는 단계와,상기 반도체막을 에칭 스토퍼로 하여, 상기 소자 분리 영역에 형성된 게이트 배선 영역을 후퇴시켜, 상기 실리콘 산화막을 제거하는 단계와,상기 더미 게이트 대신에 게이트 절연막과 게이트 전극을 형성하는 단계와,상기 반도체막을 제거하고, 상기 소스·드레인 불순물 확산층을 노출시키는 단계와,상기 소스·드레인 불순물 확산층 위에 소스·드레인 전극을 형성하는 단계를 포함하는 것을 특징으로 하는 반도체 장치의 제조 방법.
- 제14항에 있어서,상기 소스·드레인 전극이 실리사이드를 갖는 것을 특징으로 하는 반도체 장치의 제조 방법.
- 제14항에 있어서,상기 소스·드레인 전극을 형성하는 단계는,반도체 기판을 화학 반응시켜 실리사이드를 형성하는 단계와,상기 실리사이드 위에 도전체를 형성하는 단계를 포함하는 것을 특징으로 하는 반도체 장치의 제조 방법.
- 제14항에 있어서,상기 게이트 절연막은 고유전체를 갖는 것을 특징으로 하는 반도체 장치의 제조 방법.
- 제14항에 있어서,상기 소스·드레인 영역의 표면이, 반도체 기판의 표면과 일치하는 것을 특징으로 하는 반도체 장치의 제조 방법.
- 제14항에 있어서,상기 더미 게이트는, 상층이 실리콘 질화층이고, 상기 상층의 아래의 층이반도체층의 2층 구조를 갖는 것을 특징으로 하는 반도체 장치의 제조 방법.
- 제14항에 있어서,상기 반도체막이 실리콘 게르마늄인 것을 특징으로 하는 반도체 장치의 제조 방법.
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JP2002312994A JP2004152790A (ja) | 2002-10-28 | 2002-10-28 | 半導体装置、及び、半導体装置の製造方法 |
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US11101386B2 (en) | 2017-08-04 | 2021-08-24 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
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KR100731096B1 (ko) * | 2005-12-28 | 2007-06-22 | 동부일렉트로닉스 주식회사 | 반도체 소자 및 이의 제조방법 |
TWI418036B (zh) * | 2006-12-05 | 2013-12-01 | Semiconductor Energy Lab | 半導體裝置及其製造方法 |
US7968884B2 (en) * | 2006-12-05 | 2011-06-28 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
DE102008006960B4 (de) * | 2008-01-31 | 2009-11-26 | Advanced Micro Devices, Inc., Sunnyvale | Halbleiterbauelement mit selbstjustierter Kontaktstruktur und Verfahren zur Herstellung |
US8367508B2 (en) * | 2010-04-09 | 2013-02-05 | International Business Machines Corporation | Self-aligned contacts for field effect transistor devices |
CN102468174B (zh) * | 2010-11-18 | 2014-01-01 | 中国科学院微电子研究所 | 一种半导体器件及其形成方法 |
CN102683190A (zh) * | 2011-03-07 | 2012-09-19 | 中芯国际集成电路制造(上海)有限公司 | 一种金属栅极及mos晶体管的形成方法 |
US8610280B2 (en) | 2011-09-16 | 2013-12-17 | Micron Technology, Inc. | Platinum-containing constructions, and methods of forming platinum-containing constructions |
US8846513B2 (en) * | 2011-09-23 | 2014-09-30 | Globalfoundries Inc. | Semiconductor device comprising replacement gate electrode structures and self-aligned contact elements formed by a late contact fill |
US8927406B2 (en) * | 2013-01-10 | 2015-01-06 | Taiwan Semiconductor Manufacturing Company, Ltd. | Dual damascene metal gate |
JP2014241386A (ja) * | 2013-06-12 | 2014-12-25 | 富士通セミコンダクター株式会社 | 半導体装置の製造方法及び半導体装置 |
CN104752215B (zh) * | 2013-12-30 | 2017-12-29 | 中芯国际集成电路制造(上海)有限公司 | 晶体管的形成方法 |
CN105742230B (zh) * | 2014-12-10 | 2019-01-22 | 中芯国际集成电路制造(上海)有限公司 | 半导体结构的形成方法 |
US9954112B2 (en) * | 2015-01-26 | 2018-04-24 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
US10186599B1 (en) * | 2017-07-20 | 2019-01-22 | International Business Machines Corporation | Forming self-aligned contact with spacer first |
TW202345410A (zh) | 2017-12-07 | 2023-11-16 | 日商半導體能源研究所股份有限公司 | 半導體裝置以及半導體裝置的製造方法 |
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US11038029B2 (en) * | 2018-11-08 | 2021-06-15 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor device structure and method for forming the same |
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US6054355A (en) | 1997-06-30 | 2000-04-25 | Kabushiki Kaisha Toshiba | Method of manufacturing a semiconductor device which includes forming a dummy gate |
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JP2002198368A (ja) * | 2000-12-26 | 2002-07-12 | Nec Corp | 半導体装置の製造方法 |
KR100448911B1 (ko) * | 2002-09-04 | 2004-09-16 | 삼성전자주식회사 | 더미 패턴을 갖는 비휘발성 기억소자 |
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