KR20020092831A - 어드레싱 회로와, 메모리 회로와, 집적 회로와, 데이터판정 방법 및 기록 방법 - Google Patents
어드레싱 회로와, 메모리 회로와, 집적 회로와, 데이터판정 방법 및 기록 방법 Download PDFInfo
- Publication number
- KR20020092831A KR20020092831A KR1020020031325A KR20020031325A KR20020092831A KR 20020092831 A KR20020092831 A KR 20020092831A KR 1020020031325 A KR1020020031325 A KR 1020020031325A KR 20020031325 A KR20020031325 A KR 20020031325A KR 20020092831 A KR20020092831 A KR 20020092831A
- Authority
- KR
- South Korea
- Prior art keywords
- memory
- diode
- circuit
- array
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 230000015654 memory Effects 0.000 title claims abstract description 278
- 238000000034 method Methods 0.000 claims abstract description 47
- 239000000758 substrate Substances 0.000 claims description 19
- 238000004519 manufacturing process Methods 0.000 claims description 16
- 230000008859 change Effects 0.000 claims description 10
- 230000008569 process Effects 0.000 claims description 9
- ORQBXQOJMQIAOY-UHFFFAOYSA-N nobelium Chemical compound [No] ORQBXQOJMQIAOY-UHFFFAOYSA-N 0.000 claims description 4
- 238000013500 data storage Methods 0.000 abstract description 9
- 230000006870 function Effects 0.000 abstract description 6
- 238000001514 detection method Methods 0.000 abstract description 4
- 238000004891 communication Methods 0.000 abstract description 2
- 238000012937 correction Methods 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 45
- 238000003860 storage Methods 0.000 description 18
- 239000004065 semiconductor Substances 0.000 description 14
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- 238000012545 processing Methods 0.000 description 9
- 238000003491 array Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 239000004020 conductor Substances 0.000 description 6
- 230000007774 longterm Effects 0.000 description 6
- 239000004033 plastic Substances 0.000 description 6
- 238000005520 cutting process Methods 0.000 description 4
- 239000011159 matrix material Substances 0.000 description 4
- 238000013459 approach Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000002441 reversible effect Effects 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000002427 irreversible effect Effects 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 230000005055 memory storage Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000005459 micromachining Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920001690 polydopamine Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000002174 soft lithography Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C17/00—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards
- G11C17/06—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards using diode elements
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C8/00—Arrangements for selecting an address in a digital store
- G11C8/10—Decoders
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C17/00—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards
- G11C17/14—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards in which contents are determined by selectively establishing, breaking or modifying connecting links by permanently altering the state of coupling elements, e.g. PROM
- G11C17/18—Auxiliary circuits, e.g. for writing into memory
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Semiconductor Memories (AREA)
- Read Only Memory (AREA)
- Static Random-Access Memory (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/875,496 | 2001-06-05 | ||
| US09/875,496 US6567295B2 (en) | 2001-06-05 | 2001-06-05 | Addressing and sensing a cross-point diode memory array |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20020092831A true KR20020092831A (ko) | 2002-12-12 |
Family
ID=25365914
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020020031325A Ceased KR20020092831A (ko) | 2001-06-05 | 2002-06-04 | 어드레싱 회로와, 메모리 회로와, 집적 회로와, 데이터판정 방법 및 기록 방법 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US6567295B2 (enExample) |
| EP (1) | EP1265248A3 (enExample) |
| JP (1) | JP3895640B2 (enExample) |
| KR (1) | KR20020092831A (enExample) |
| CN (1) | CN100378863C (enExample) |
| TW (1) | TW571439B (enExample) |
Families Citing this family (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5673218A (en) | 1996-03-05 | 1997-09-30 | Shepard; Daniel R. | Dual-addressed rectifier storage device |
| US7064879B1 (en) * | 2000-04-07 | 2006-06-20 | Microsoft Corporation | Magnetically actuated microelectrochemical systems actuator |
| US6956757B2 (en) * | 2000-06-22 | 2005-10-18 | Contour Semiconductor, Inc. | Low cost high density rectifier matrix memory |
| WO2002027768A2 (en) * | 2000-09-27 | 2002-04-04 | Nüp2 Incorporated | Fabrication of semiconductor devices |
| US6775048B1 (en) * | 2000-10-31 | 2004-08-10 | Microsoft Corporation | Microelectrical mechanical structure (MEMS) optical modulator and optical display system |
| JP2002343562A (ja) * | 2001-05-11 | 2002-11-29 | Pioneer Electronic Corp | 発光ディスプレイ装置及びその製造方法 |
| US6804959B2 (en) * | 2001-12-31 | 2004-10-19 | Microsoft Corporation | Unilateral thermal buckle-beam actuator |
| US6797163B2 (en) * | 2002-03-28 | 2004-09-28 | Tetra Holding (Us), Inc. | Filtration devices |
| US7053519B2 (en) * | 2002-03-29 | 2006-05-30 | Microsoft Corporation | Electrostatic bimorph actuator |
| US6813182B2 (en) * | 2002-05-31 | 2004-11-02 | Hewlett-Packard Development Company, L.P. | Diode-and-fuse memory elements for a write-once memory comprising an anisotropic semiconductor sheet |
| US6876594B2 (en) * | 2002-12-26 | 2005-04-05 | Texas Instruments Incorporated | Integrated circuit with programmable fuse array |
| US7179534B2 (en) * | 2003-01-31 | 2007-02-20 | Princeton University | Conductive-polymer electronic switch |
| US6980465B2 (en) * | 2003-12-19 | 2005-12-27 | Hewlett-Packard Development Company, L.P. | Addressing circuit for a cross-point memory array including cross-point resistive elements |
| US7106639B2 (en) * | 2004-09-01 | 2006-09-12 | Hewlett-Packard Development Company, L.P. | Defect management enabled PIRM and method |
| US7462513B2 (en) * | 2005-08-22 | 2008-12-09 | Lexmark International, Inc. | Methods for making printed fuse devices |
| US7486534B2 (en) * | 2005-12-08 | 2009-02-03 | Macronix International Co., Ltd. | Diode-less array for one-time programmable memory |
| KR101048199B1 (ko) | 2006-11-20 | 2011-07-08 | 파나소닉 주식회사 | 비휘발성 반도체 기억 장치 및 그 제조 방법 |
| US7583554B2 (en) * | 2007-03-02 | 2009-09-01 | Freescale Semiconductor, Inc. | Integrated circuit fuse array |
| US7813157B2 (en) * | 2007-10-29 | 2010-10-12 | Contour Semiconductor, Inc. | Non-linear conductor memory |
| US20090225621A1 (en) * | 2008-03-05 | 2009-09-10 | Shepard Daniel R | Split decoder storage array and methods of forming the same |
| WO2009149061A2 (en) * | 2008-06-02 | 2009-12-10 | Contour Semiconductor, Inc. | Diode decoder array with non-sequential layout and methods of forming the same |
| US8325556B2 (en) * | 2008-10-07 | 2012-12-04 | Contour Semiconductor, Inc. | Sequencing decoder circuit |
| US8461566B2 (en) * | 2009-11-02 | 2013-06-11 | Micron Technology, Inc. | Methods, structures and devices for increasing memory density |
| WO2013046217A2 (en) * | 2011-06-13 | 2013-04-04 | Indian Institute Of Technology Bombay | Selector device for bipolar rram |
| JP2013069928A (ja) * | 2011-09-22 | 2013-04-18 | Toshiba Corp | 不揮発性半導体記憶装置 |
| US10978007B2 (en) * | 2018-12-03 | 2021-04-13 | Sharp Life Science (Eu) Limited | AM-EWOD circuit configuration with sensing column detection circuit |
| CN116413678A (zh) * | 2021-12-29 | 2023-07-11 | 深圳市速腾聚创科技有限公司 | 阴极选址驱动电路、可寻址驱动电路及激光发射电路 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BE757114A (fr) * | 1969-10-08 | 1971-03-16 | Western Electric Co | Memoire a matrice de points de croisement |
| US4385368A (en) * | 1980-11-24 | 1983-05-24 | Raytheon Company | Programmable read only memory |
| US4795657A (en) * | 1984-04-13 | 1989-01-03 | Energy Conversion Devices, Inc. | Method of fabricating a programmable array |
| US4782340A (en) * | 1986-08-22 | 1988-11-01 | Energy Conversion Devices, Inc. | Electronic arrays having thin film line drivers |
| JPH04348068A (ja) * | 1991-03-18 | 1992-12-03 | Toshiba Corp | 半導体記憶装置 |
| US5889694A (en) * | 1996-03-05 | 1999-03-30 | Shepard; Daniel R. | Dual-addressed rectifier storage device |
| US6285582B1 (en) * | 2000-03-20 | 2001-09-04 | Epitaxial Technologies, Llc | Two-dimensional resonant tunneling diode memory system |
| US6385075B1 (en) * | 2001-06-05 | 2002-05-07 | Hewlett-Packard Company | Parallel access of cross-point diode memory arrays |
-
2001
- 2001-06-05 US US09/875,496 patent/US6567295B2/en not_active Expired - Lifetime
-
2002
- 2002-04-25 TW TW091108561A patent/TW571439B/zh not_active IP Right Cessation
- 2002-06-04 KR KR1020020031325A patent/KR20020092831A/ko not_active Ceased
- 2002-06-05 EP EP02253898A patent/EP1265248A3/en not_active Withdrawn
- 2002-06-05 CN CNB021224471A patent/CN100378863C/zh not_active Expired - Lifetime
- 2002-06-05 JP JP2002164627A patent/JP3895640B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN1397952A (zh) | 2003-02-19 |
| TW571439B (en) | 2004-01-11 |
| US20020191434A1 (en) | 2002-12-19 |
| CN100378863C (zh) | 2008-04-02 |
| JP3895640B2 (ja) | 2007-03-22 |
| JP2003059281A (ja) | 2003-02-28 |
| EP1265248A3 (en) | 2003-09-17 |
| US6567295B2 (en) | 2003-05-20 |
| EP1265248A2 (en) | 2002-12-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0109 | Patent application |
Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 20020604 |
|
| PG1501 | Laying open of application | ||
| A201 | Request for examination | ||
| PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 20070604 Comment text: Request for Examination of Application Patent event code: PA02011R01I Patent event date: 20020604 Comment text: Patent Application |
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| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20080530 Patent event code: PE09021S01D |
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| E601 | Decision to refuse application | ||
| PE0601 | Decision on rejection of patent |
Patent event date: 20080922 Comment text: Decision to Refuse Application Patent event code: PE06012S01D Patent event date: 20080530 Comment text: Notification of reason for refusal Patent event code: PE06011S01I |