KR20020070449A - 열 전도성 시이트 및 이 시이트의 제조 방법 - Google Patents

열 전도성 시이트 및 이 시이트의 제조 방법 Download PDF

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Publication number
KR20020070449A
KR20020070449A KR1020027006856A KR20027006856A KR20020070449A KR 20020070449 A KR20020070449 A KR 20020070449A KR 1020027006856 A KR1020027006856 A KR 1020027006856A KR 20027006856 A KR20027006856 A KR 20027006856A KR 20020070449 A KR20020070449 A KR 20020070449A
Authority
KR
South Korea
Prior art keywords
thermally conductive
substrate
sheet
film
conductive sheet
Prior art date
Application number
KR1020027006856A
Other languages
English (en)
Korean (ko)
Inventor
오카다미츠히코
우시야도모아키
Original Assignee
쓰리엠 이노베이티브 프로퍼티즈 캄파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 쓰리엠 이노베이티브 프로퍼티즈 캄파니 filed Critical 쓰리엠 이노베이티브 프로퍼티즈 캄파니
Publication of KR20020070449A publication Critical patent/KR20020070449A/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Laminated Bodies (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
KR1020027006856A 1999-11-30 2000-11-07 열 전도성 시이트 및 이 시이트의 제조 방법 KR20020070449A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP34013899A JP2001168246A (ja) 1999-11-30 1999-11-30 熱伝導性シート及びその製造方法
JPJP-P-1999-00340138 1999-11-30
PCT/US2000/030614 WO2001041213A1 (fr) 1999-11-30 2000-11-07 Feuille thermoconductrice et procede de fabrication de cette feuille

Publications (1)

Publication Number Publication Date
KR20020070449A true KR20020070449A (ko) 2002-09-09

Family

ID=18334100

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020027006856A KR20020070449A (ko) 1999-11-30 2000-11-07 열 전도성 시이트 및 이 시이트의 제조 방법

Country Status (5)

Country Link
EP (1) EP1238425A1 (fr)
JP (1) JP2001168246A (fr)
KR (1) KR20020070449A (fr)
AU (1) AU1362501A (fr)
WO (1) WO2001041213A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100721487B1 (ko) * 2004-09-22 2007-05-23 주식회사 엘지화학 열전도성이 우수한 점착 방열시트 및 그 제조방법
KR100853711B1 (ko) * 2007-02-14 2008-08-25 최훈석 변형이 유연한 히트 싱크와 이의 제조방법
KR101013702B1 (ko) * 2003-09-24 2011-02-10 엘지전자 주식회사 휴대용단말기

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6610635B2 (en) * 2000-09-14 2003-08-26 Aos Thermal Compounds Dry thermal interface material
KR100450229B1 (ko) * 2001-06-19 2004-09-24 주식회사 엘지화학 열전도성 열가소성 수지 조성물 및 그 제조방법
JP4614593B2 (ja) * 2001-08-06 2011-01-19 電気化学工業株式会社 熱伝導シート
KR100528435B1 (ko) * 2002-07-05 2005-11-15 엘에스전선 주식회사 전도성 테이프
AT412265B (de) * 2002-11-12 2004-12-27 Electrovac Bauteil zur wärmeableitung
JP2007123524A (ja) * 2005-10-27 2007-05-17 Shinko Electric Ind Co Ltd 電子部品内蔵基板
JP4798629B2 (ja) * 2006-11-13 2011-10-19 北川工業株式会社 熱伝導性電磁波シールドシート及び電磁波シールド構造
JP5042899B2 (ja) * 2008-03-31 2012-10-03 ポリマテック株式会社 熱伝導性シート及びその製造方法
JP5442491B2 (ja) * 2010-02-26 2014-03-12 新日鉄住金化学株式会社 熱伝導性金属−絶縁樹脂基板及びその製造方法
JP5912337B2 (ja) 2011-04-09 2016-04-27 日東電工株式会社 難燃性熱伝導性粘着シート
JP5941287B2 (ja) * 2012-01-19 2016-06-29 富士高分子工業株式会社 放熱シート及びその製造方法
JP7129908B2 (ja) * 2016-09-30 2022-09-02 デンカ株式会社 高耐荷重性および高熱伝導性を有する放熱シート
JP2019010773A (ja) * 2017-06-29 2019-01-24 日立化成株式会社 複合熱伝導シート及び放熱システム
US10927228B2 (en) 2017-11-16 2021-02-23 3M Innovative Properties Company Polymer matrix composites comprising intumescent particles and methods of making the same
CN111491991A (zh) 2017-11-16 2020-08-04 3M创新有限公司 制备聚合物基质复合材料的方法
US10913834B2 (en) 2017-11-16 2021-02-09 3M Innovative Properties Company Polymer matrix composites comprising indicator particles and methods of making the same
WO2019097446A1 (fr) 2017-11-16 2019-05-23 3M Innovative Properties Company Composites à matrice polymère comprenant des particules fonctionnelles et procédés de fabrication
WO2019099603A1 (fr) 2017-11-16 2019-05-23 3M Innovative Properties Company Composites à matrice polymère comprenant des particules diélectriques et procédés de fabrication associés
WO2019097445A1 (fr) 2017-11-16 2019-05-23 3M Innovative Properties Company Composites à matrice polymère comprenant des particules thermoconductrices et procédés de fabrication associés
US10836873B2 (en) 2017-11-16 2020-11-17 3M Innovative Properties Company Polymer matrix composites comprising thermally insulating particles and methods of making the same
JP7131142B2 (ja) * 2018-07-09 2022-09-06 日本ゼオン株式会社 熱伝導シート
EP3973571B1 (fr) 2019-05-21 2023-10-18 DDP Specialty Electronic Materials US, LLC Matériaux d'interface en deux parties, systèmes comprenant le matériau d'interface, et procédés associés
JP2022533994A (ja) 2019-05-21 2022-07-27 ディディピー スペシャルティ エレクトロニック マテリアルズ ユーエス，エルエルシー 熱界面材料
CN112778562A (zh) * 2020-12-31 2021-05-11 深圳市奕韬科技有限公司 一种高效导热界面材料及其制备方法、应用
CN113115557B (zh) * 2021-02-05 2022-07-26 中山市鼎兴有机硅科技有限公司 一种内嵌导热组的散热硅胶片
TWI836320B (zh) * 2022-01-13 2024-03-21 宸寰科技有限公司 電子元件內部、中部與外部之散熱界面薄片材料

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5847341B2 (ja) * 1981-04-02 1983-10-21 電気化学工業株式会社 放熱シ−トの製法
JP2536120B2 (ja) * 1989-01-25 1996-09-18 日本電気株式会社 電子部品の冷却構造
TW197458B (fr) * 1991-02-14 1993-01-01 Ciba Geigy Ag
US5213868A (en) * 1991-08-13 1993-05-25 Chomerics, Inc. Thermally conductive interface materials and methods of using the same
JP2728607B2 (ja) * 1992-11-17 1998-03-18 信越化学工業株式会社 熱伝導性複合シートの製造方法
JP2882972B2 (ja) * 1993-06-15 1999-04-19 電気化学工業株式会社 放熱シート
US5741579A (en) * 1995-04-28 1998-04-21 Shin-Etsu Polymer Co., Ltd. Heat-conductive sheet
DE69630278T2 (de) * 1996-01-30 2004-08-26 Parker-Hannifin Corp., Cleveland Kühlung durch Wärmeableitung für einen wärmeerzeugenden elektronischen Teil
JP3434186B2 (ja) * 1996-11-06 2003-08-04 富士高分子工業株式会社 熱伝導性シリコーンゲル成形シート及びその製造方法
US6432497B2 (en) * 1997-07-28 2002-08-13 Parker-Hannifin Corporation Double-side thermally conductive adhesive tape for plastic-packaged electronic components
JP4086946B2 (ja) * 1998-01-05 2008-05-14 日東電工株式会社 熱伝導性感圧接着シ―ト類およびこれを用いた電子部品と放熱部材との固定方法
US6162663A (en) * 1999-04-20 2000-12-19 Schoenstein; Paul G. Dissipation of heat from a circuit board having bare silicon chips mounted thereon

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101013702B1 (ko) * 2003-09-24 2011-02-10 엘지전자 주식회사 휴대용단말기
KR100721487B1 (ko) * 2004-09-22 2007-05-23 주식회사 엘지화학 열전도성이 우수한 점착 방열시트 및 그 제조방법
KR100853711B1 (ko) * 2007-02-14 2008-08-25 최훈석 변형이 유연한 히트 싱크와 이의 제조방법

Also Published As

Publication number Publication date
JP2001168246A (ja) 2001-06-22
WO2001041213A1 (fr) 2001-06-07
EP1238425A1 (fr) 2002-09-11
AU1362501A (en) 2001-06-12

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