KR20010090720A - 비례 마이크로기계 장치 - Google Patents
비례 마이크로기계 장치 Download PDFInfo
- Publication number
- KR20010090720A KR20010090720A KR1020017002836A KR20017002836A KR20010090720A KR 20010090720 A KR20010090720 A KR 20010090720A KR 1020017002836 A KR1020017002836 A KR 1020017002836A KR 20017002836 A KR20017002836 A KR 20017002836A KR 20010090720 A KR20010090720 A KR 20010090720A
- Authority
- KR
- South Korea
- Prior art keywords
- layer
- displaceable
- microvalve
- actuator
- end portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000012530 fluid Substances 0.000 claims abstract description 122
- 238000006073 displacement reaction Methods 0.000 claims abstract description 52
- 238000000708 deep reactive-ion etching Methods 0.000 claims abstract description 17
- 238000000034 method Methods 0.000 claims description 26
- 229910021421 monocrystalline silicon Inorganic materials 0.000 claims description 18
- 230000004044 response Effects 0.000 claims description 15
- 239000004065 semiconductor Substances 0.000 claims description 15
- 239000000725 suspension Substances 0.000 claims description 8
- 239000013078 crystal Substances 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 3
- 230000007423 decrease Effects 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 abstract description 13
- 235000012431 wafers Nutrition 0.000 description 43
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 34
- 229910052710 silicon Inorganic materials 0.000 description 33
- 239000010703 silicon Substances 0.000 description 33
- 239000007789 gas Substances 0.000 description 17
- 230000004927 fusion Effects 0.000 description 15
- 230000008569 process Effects 0.000 description 9
- 230000008859 change Effects 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 238000005530 etching Methods 0.000 description 7
- 229920002120 photoresistant polymer Polymers 0.000 description 6
- 239000010409 thin film Substances 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
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- 239000011521 glass Substances 0.000 description 4
- 238000007373 indentation Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- RZVAJINKPMORJF-UHFFFAOYSA-N Acetaminophen Chemical compound CC(=O)NC1=CC=C(O)C=C1 RZVAJINKPMORJF-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 230000004323 axial length Effects 0.000 description 3
- 230000001276 controlling effect Effects 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000033001 locomotion Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 230000001590 oxidative effect Effects 0.000 description 3
- 238000001020 plasma etching Methods 0.000 description 3
- 239000005297 pyrex Substances 0.000 description 3
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 230000003321 amplification Effects 0.000 description 2
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- 239000000919 ceramic Substances 0.000 description 2
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- 238000009616 inductively coupled plasma Methods 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
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- 238000004544 sputter deposition Methods 0.000 description 2
- 240000005020 Acaciella glauca Species 0.000 description 1
- 241000160765 Erebia ligea Species 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
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- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
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- 230000000881 depressing effect Effects 0.000 description 1
- 238000002050 diffraction method Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 230000009969 flowable effect Effects 0.000 description 1
- -1 for example Inorganic materials 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000010849 ion bombardment Methods 0.000 description 1
- 230000005226 mechanical processes and functions Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000005459 micromachining Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000036647 reaction Effects 0.000 description 1
- 235000003499 redwood Nutrition 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 210000003813 thumb Anatomy 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K99/00—Subject matter not provided for in other groups of this subclass
- F16K99/0001—Microvalves
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0018—Structures acting upon the moving or flexible element for transforming energy into mechanical movement or vice versa, i.e. actuators, sensors, generators
- B81B3/0024—Transducers for transforming thermal into mechanical energy or vice versa, e.g. thermal or bimorph actuators
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F15—FLUID-PRESSURE ACTUATORS; HYDRAULICS OR PNEUMATICS IN GENERAL
- F15C—FLUID-CIRCUIT ELEMENTS PREDOMINANTLY USED FOR COMPUTING OR CONTROL PURPOSES
- F15C3/00—Circuit elements having moving parts
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F15—FLUID-PRESSURE ACTUATORS; HYDRAULICS OR PNEUMATICS IN GENERAL
- F15C—FLUID-CIRCUIT ELEMENTS PREDOMINANTLY USED FOR COMPUTING OR CONTROL PURPOSES
- F15C4/00—Circuit elements characterised by their special functions
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F15—FLUID-PRESSURE ACTUATORS; HYDRAULICS OR PNEUMATICS IN GENERAL
- F15C—FLUID-CIRCUIT ELEMENTS PREDOMINANTLY USED FOR COMPUTING OR CONTROL PURPOSES
- F15C5/00—Manufacture of fluid circuit elements; Manufacture of assemblages of such elements integrated circuits
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K99/00—Subject matter not provided for in other groups of this subclass
- F16K99/0001—Microvalves
- F16K99/0003—Constructional types of microvalves; Details of the cutting-off member
- F16K99/0011—Gate valves or sliding valves
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K99/00—Subject matter not provided for in other groups of this subclass
- F16K99/0001—Microvalves
- F16K99/0034—Operating means specially adapted for microvalves
- F16K99/0042—Electric operating means therefor
- F16K99/0044—Electric operating means therefor using thermo-electric means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K99/00—Subject matter not provided for in other groups of this subclass
- F16K2099/0073—Fabrication methods specifically adapted for microvalves
- F16K2099/0074—Fabrication methods specifically adapted for microvalves using photolithography, e.g. etching
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K99/00—Subject matter not provided for in other groups of this subclass
- F16K2099/0073—Fabrication methods specifically adapted for microvalves
- F16K2099/008—Multi-layer fabrications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K99/00—Subject matter not provided for in other groups of this subclass
- F16K2099/0082—Microvalves adapted for a particular use
- F16K2099/0098—Refrigeration circuits, e.g. for cooling integrated circuits
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/0318—Processes
- Y10T137/0396—Involving pressure control
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Theoretical Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Analytical Chemistry (AREA)
- Micromachines (AREA)
- Temperature-Responsive Valves (AREA)
- Electrically Driven Valve-Operating Means (AREA)
- Diaphragms For Electromechanical Transducers (AREA)
- Regulating Braking Force (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14802698A | 1998-09-03 | 1998-09-03 | |
| US09/148,026 | 1998-09-03 | ||
| PCT/US1999/019971 WO2000014415A2 (en) | 1998-09-03 | 1999-08-31 | Proportional micromechanical device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20010090720A true KR20010090720A (ko) | 2001-10-19 |
Family
ID=22523914
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020017002836A Withdrawn KR20010090720A (ko) | 1998-09-03 | 1999-08-31 | 비례 마이크로기계 장치 |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US6761420B2 (enExample) |
| EP (1) | EP1117937B1 (enExample) |
| JP (1) | JP4831446B2 (enExample) |
| KR (1) | KR20010090720A (enExample) |
| CN (1) | CN1322282A (enExample) |
| AT (1) | ATE393319T1 (enExample) |
| AU (1) | AU5905499A (enExample) |
| DE (1) | DE69938602T2 (enExample) |
| WO (1) | WO2000014415A2 (enExample) |
Families Citing this family (66)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6533366B1 (en) | 1996-05-29 | 2003-03-18 | Kelsey-Hayes Company | Vehicle hydraulic braking systems incorporating micro-machined technology |
| US7011378B2 (en) * | 1998-09-03 | 2006-03-14 | Ge Novasensor, Inc. | Proportional micromechanical valve |
| US6540203B1 (en) | 1999-03-22 | 2003-04-01 | Kelsey-Hayes Company | Pilot operated microvalve device |
| US6845962B1 (en) | 2000-03-22 | 2005-01-25 | Kelsey-Hayes Company | Thermally actuated microvalve device |
| US6694998B1 (en) | 2000-03-22 | 2004-02-24 | Kelsey-Hayes Company | Micromachined structure usable in pressure regulating microvalve and proportional microvalve |
| US6494804B1 (en) * | 2000-06-20 | 2002-12-17 | Kelsey-Hayes Company | Microvalve for electronically controlled transmission |
| US6581640B1 (en) | 2000-08-16 | 2003-06-24 | Kelsey-Hayes Company | Laminated manifold for microvalve |
| US6647164B1 (en) | 2000-10-31 | 2003-11-11 | 3M Innovative Properties Company | Gimbaled micro-mirror positionable by thermal actuators |
| US6711318B2 (en) | 2001-01-29 | 2004-03-23 | 3M Innovative Properties Company | Optical switch based on rotating vertical micro-mirror |
| US7025324B1 (en) * | 2002-01-04 | 2006-04-11 | Massachusetts Institute Of Technology | Gating apparatus and method of manufacture |
| DE10231730B4 (de) * | 2002-07-13 | 2012-08-30 | Robert Bosch Gmbh | Mikrostrukturbauelement |
| US6992422B2 (en) * | 2003-06-11 | 2006-01-31 | Texas Instruments Incorporated | Position sensor for a pivoting platform |
| KR20060109959A (ko) * | 2003-11-24 | 2006-10-23 | 알루미나 마이크로 엘엘씨 | 가변형 변위 압축기 제어용 마이크로밸브 장치 |
| US8011388B2 (en) * | 2003-11-24 | 2011-09-06 | Microstaq, INC | Thermally actuated microvalve with multiple fluid ports |
| US20070251586A1 (en) * | 2003-11-24 | 2007-11-01 | Fuller Edward N | Electro-pneumatic control valve with microvalve pilot |
| CN101358589B (zh) * | 2003-11-24 | 2012-08-01 | 麦克罗斯塔克公司 | 适于控制变容量压缩机的微阀装置 |
| CN100501212C (zh) * | 2004-02-27 | 2009-06-17 | 铝微有限公司 | 微阀装置 |
| WO2005091820A2 (en) * | 2004-03-05 | 2005-10-06 | Alumina Micro Llc | Selective bonding for forming a microvalve |
| US7156365B2 (en) | 2004-07-27 | 2007-01-02 | Kelsey-Hayes Company | Method of controlling microvalve actuator |
| WO2006076386A1 (en) * | 2005-01-14 | 2006-07-20 | Alumina Micro Llc. | System and method for controlling a variable displacement compressor |
| US7913928B2 (en) | 2005-11-04 | 2011-03-29 | Alliant Techsystems Inc. | Adaptive structures, systems incorporating same and related methods |
| US20070106271A1 (en) | 2005-11-09 | 2007-05-10 | Searete Llc, A Limited Liability Corporation | Remote control of substance delivery system |
| US8936590B2 (en) | 2005-11-09 | 2015-01-20 | The Invention Science Fund I, Llc | Acoustically controlled reaction device |
| US8083710B2 (en) | 2006-03-09 | 2011-12-27 | The Invention Science Fund I, Llc | Acoustically controlled substance delivery device |
| US8273071B2 (en) | 2006-01-18 | 2012-09-25 | The Invention Science Fund I, Llc | Remote controller for substance delivery system |
| US8992511B2 (en) | 2005-11-09 | 2015-03-31 | The Invention Science Fund I, Llc | Acoustically controlled substance delivery device |
| US20070106275A1 (en) | 2005-11-09 | 2007-05-10 | Searete Llc, A Limited Liability Corporation Of The State Of Delaware | Reaction device controlled by RF control signal |
| US8273075B2 (en) | 2005-12-13 | 2012-09-25 | The Invention Science Fund I, Llc | Osmotic pump with remotely controlled osmotic flow rate |
| US20070260174A1 (en) * | 2006-05-05 | 2007-11-08 | Searete Llc | Detecting a failure to maintain a regimen |
| JP2008039502A (ja) * | 2006-08-03 | 2008-02-21 | Alps Electric Co Ltd | 接触子およびその製造方法 |
| DE112007003035T5 (de) | 2006-12-15 | 2009-11-05 | Microstaq, Inc., Austin | Mikroventilvorrichtung |
| DE112008000862T5 (de) | 2007-03-30 | 2010-03-11 | Microstaq, Inc., Austin | Vorgesteuertes Mikroschieberventil |
| CN101668973B (zh) | 2007-03-31 | 2013-03-13 | 盾安美斯泰克公司(美国) | 先导式滑阀 |
| US8206025B2 (en) * | 2007-08-07 | 2012-06-26 | International Business Machines Corporation | Microfluid mixer, methods of use and methods of manufacture thereof |
| FI119895B (fi) * | 2007-10-05 | 2009-04-30 | Vti Technologies Oy | Värähtelevä mikromekaaninen kulmanopeusanturi |
| WO2010019329A2 (en) | 2008-08-09 | 2010-02-18 | Microstaq, Inc. | Improved microvalve device |
| US8113482B2 (en) | 2008-08-12 | 2012-02-14 | DunAn Microstaq | Microvalve device with improved fluid routing |
| US8540207B2 (en) | 2008-12-06 | 2013-09-24 | Dunan Microstaq, Inc. | Fluid flow control assembly |
| WO2010117874A2 (en) | 2009-04-05 | 2010-10-14 | Microstaq, Inc. | Method and structure for optimizing heat exchanger performance |
| US20120145252A1 (en) | 2009-08-17 | 2012-06-14 | Dunan Microstaq, Inc. | Micromachined Device and Control Method |
| CN102812538B (zh) | 2010-01-28 | 2015-05-13 | 盾安美斯泰克股份有限公司 | 用以促进接合的重调节半导体表面的方法 |
| US9006844B2 (en) | 2010-01-28 | 2015-04-14 | Dunan Microstaq, Inc. | Process and structure for high temperature selective fusion bonding |
| US20120012299A1 (en) * | 2010-07-16 | 2012-01-19 | Industrial Idea Partners, Inc. | Proportional Micro-Valve With Thermal Feedback |
| US8996141B1 (en) | 2010-08-26 | 2015-03-31 | Dunan Microstaq, Inc. | Adaptive predictive functional controller |
| DE102011115559B4 (de) | 2010-10-15 | 2022-03-31 | GM Global Technology Operations LLC (n. d. Ges. d. Staates Delaware) | Antriebsstrang-drucksteuersystem |
| US8925793B2 (en) | 2012-01-05 | 2015-01-06 | Dunan Microstaq, Inc. | Method for making a solder joint |
| US8851117B2 (en) | 2012-01-30 | 2014-10-07 | Gm Global Technology Operations, Llc | MEMS valve operating profile |
| US9140613B2 (en) | 2012-03-16 | 2015-09-22 | Zhejiang Dunan Hetian Metal Co., Ltd. | Superheat sensor |
| CN102734494A (zh) * | 2012-06-05 | 2012-10-17 | 浙江盾安人工环境股份有限公司 | 一种电磁阀 |
| US9235219B2 (en) * | 2012-12-27 | 2016-01-12 | Zhejiang Dunan Hetian Metal Co., Ltd. | Microvalve with integrated flow sensing capability |
| US9897233B2 (en) * | 2012-12-27 | 2018-02-20 | Zhejiang Dunan Artificial Environment Co., Ltd. | Micro valve device and valve body assembly |
| WO2014107892A1 (zh) * | 2013-01-11 | 2014-07-17 | 浙江盾安人工环境股份有限公司 | 微阀装置和微阀装置的制造方法 |
| CN104329484B (zh) * | 2013-06-24 | 2018-11-30 | 浙江盾安禾田金属有限公司 | 具有增强的抗污性的微型阀 |
| US9328850B2 (en) * | 2013-06-24 | 2016-05-03 | Zhejiang Dunan Hetian Metal Co., Ltd. | Microvalve having improved air purging capability |
| DE102013224453A1 (de) * | 2013-11-28 | 2015-05-28 | Marco Systemanalyse Und Entwicklung Gmbh | Ventil zur Dosierung von Medien im Kleinstmengenbereich |
| US9188375B2 (en) | 2013-12-04 | 2015-11-17 | Zhejiang Dunan Hetian Metal Co., Ltd. | Control element and check valve assembly |
| US9551435B2 (en) * | 2014-06-05 | 2017-01-24 | Dunan Microstaq, Inc. | Method of preventing clogging in a microvalve |
| US9488293B2 (en) * | 2014-08-14 | 2016-11-08 | Dunan Microstaq, Inc. | On-off microvalve with improved sealing mechanism |
| US9494255B2 (en) * | 2014-08-14 | 2016-11-15 | Dunan Microstaq, Inc. | Plate microvalve with improved sealing mechanism |
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-
1999
- 1999-08-31 WO PCT/US1999/019971 patent/WO2000014415A2/en not_active Ceased
- 1999-08-31 JP JP2000569132A patent/JP4831446B2/ja not_active Expired - Lifetime
- 1999-08-31 EP EP19990946703 patent/EP1117937B1/en not_active Expired - Lifetime
- 1999-08-31 KR KR1020017002836A patent/KR20010090720A/ko not_active Withdrawn
- 1999-08-31 AU AU59054/99A patent/AU5905499A/en not_active Abandoned
- 1999-08-31 DE DE1999638602 patent/DE69938602T2/de not_active Expired - Lifetime
- 1999-08-31 CN CN99811871A patent/CN1322282A/zh active Pending
- 1999-08-31 AT AT99946703T patent/ATE393319T1/de not_active IP Right Cessation
-
2001
- 2001-12-18 US US10/024,963 patent/US6761420B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| CN1322282A (zh) | 2001-11-14 |
| JP4831446B2 (ja) | 2011-12-07 |
| DE69938602T2 (de) | 2009-07-30 |
| EP1117937A2 (en) | 2001-07-25 |
| AU5905499A (en) | 2000-03-27 |
| WO2000014415A3 (en) | 2000-07-06 |
| JP2002524698A (ja) | 2002-08-06 |
| DE69938602D1 (de) | 2008-06-05 |
| EP1117937B1 (en) | 2008-04-23 |
| WO2000014415A2 (en) | 2000-03-16 |
| US20030098612A1 (en) | 2003-05-29 |
| ATE393319T1 (de) | 2008-05-15 |
| US6761420B2 (en) | 2004-07-13 |
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