JP4831446B2 - マイクロバルブ装置 - Google Patents
マイクロバルブ装置 Download PDFInfo
- Publication number
- JP4831446B2 JP4831446B2 JP2000569132A JP2000569132A JP4831446B2 JP 4831446 B2 JP4831446 B2 JP 4831446B2 JP 2000569132 A JP2000569132 A JP 2000569132A JP 2000569132 A JP2000569132 A JP 2000569132A JP 4831446 B2 JP4831446 B2 JP 4831446B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- displaceable member
- microvalve
- actuator
- patent document
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
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- RZVAJINKPMORJF-UHFFFAOYSA-N Acetaminophen Chemical compound CC(=O)NC1=CC=C(O)C=C1 RZVAJINKPMORJF-UHFFFAOYSA-N 0.000 description 3
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- 229910052782 aluminium Inorganic materials 0.000 description 3
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
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- 150000002739 metals Chemical class 0.000 description 1
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- 238000012421 spiking Methods 0.000 description 1
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K99/00—Subject matter not provided for in other groups of this subclass
- F16K99/0001—Microvalves
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0018—Structures acting upon the moving or flexible element for transforming energy into mechanical movement or vice versa, i.e. actuators, sensors, generators
- B81B3/0024—Transducers for transforming thermal into mechanical energy or vice versa, e.g. thermal or bimorph actuators
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F15—FLUID-PRESSURE ACTUATORS; HYDRAULICS OR PNEUMATICS IN GENERAL
- F15C—FLUID-CIRCUIT ELEMENTS PREDOMINANTLY USED FOR COMPUTING OR CONTROL PURPOSES
- F15C3/00—Circuit elements having moving parts
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F15—FLUID-PRESSURE ACTUATORS; HYDRAULICS OR PNEUMATICS IN GENERAL
- F15C—FLUID-CIRCUIT ELEMENTS PREDOMINANTLY USED FOR COMPUTING OR CONTROL PURPOSES
- F15C4/00—Circuit elements characterised by their special functions
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F15—FLUID-PRESSURE ACTUATORS; HYDRAULICS OR PNEUMATICS IN GENERAL
- F15C—FLUID-CIRCUIT ELEMENTS PREDOMINANTLY USED FOR COMPUTING OR CONTROL PURPOSES
- F15C5/00—Manufacture of fluid circuit elements; Manufacture of assemblages of such elements integrated circuits
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K99/00—Subject matter not provided for in other groups of this subclass
- F16K99/0001—Microvalves
- F16K99/0003—Constructional types of microvalves; Details of the cutting-off member
- F16K99/0011—Gate valves or sliding valves
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K99/00—Subject matter not provided for in other groups of this subclass
- F16K99/0001—Microvalves
- F16K99/0034—Operating means specially adapted for microvalves
- F16K99/0042—Electric operating means therefor
- F16K99/0044—Electric operating means therefor using thermo-electric means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K99/00—Subject matter not provided for in other groups of this subclass
- F16K2099/0073—Fabrication methods specifically adapted for microvalves
- F16K2099/0074—Fabrication methods specifically adapted for microvalves using photolithography, e.g. etching
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K99/00—Subject matter not provided for in other groups of this subclass
- F16K2099/0073—Fabrication methods specifically adapted for microvalves
- F16K2099/008—Multi-layer fabrications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K99/00—Subject matter not provided for in other groups of this subclass
- F16K2099/0082—Microvalves adapted for a particular use
- F16K2099/0098—Refrigeration circuits, e.g. for cooling integrated circuits
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/0318—Processes
- Y10T137/0396—Involving pressure control
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Fluid Mechanics (AREA)
- Analytical Chemistry (AREA)
- Micromachines (AREA)
- Temperature-Responsive Valves (AREA)
- Electrically Driven Valve-Operating Means (AREA)
- Regulating Braking Force (AREA)
- Diaphragms For Electromechanical Transducers (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14802698A | 1998-09-03 | 1998-09-03 | |
| US09/148,026 | 1998-09-03 | ||
| PCT/US1999/019971 WO2000014415A2 (en) | 1998-09-03 | 1999-08-31 | Proportional micromechanical device |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2002524698A JP2002524698A (ja) | 2002-08-06 |
| JP2002524698A5 JP2002524698A5 (enExample) | 2006-11-02 |
| JP4831446B2 true JP4831446B2 (ja) | 2011-12-07 |
Family
ID=22523914
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000569132A Expired - Lifetime JP4831446B2 (ja) | 1998-09-03 | 1999-08-31 | マイクロバルブ装置 |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US6761420B2 (enExample) |
| EP (1) | EP1117937B1 (enExample) |
| JP (1) | JP4831446B2 (enExample) |
| KR (1) | KR20010090720A (enExample) |
| CN (1) | CN1322282A (enExample) |
| AT (1) | ATE393319T1 (enExample) |
| AU (1) | AU5905499A (enExample) |
| DE (1) | DE69938602T2 (enExample) |
| WO (1) | WO2000014415A2 (enExample) |
Families Citing this family (66)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6533366B1 (en) | 1996-05-29 | 2003-03-18 | Kelsey-Hayes Company | Vehicle hydraulic braking systems incorporating micro-machined technology |
| US7011378B2 (en) * | 1998-09-03 | 2006-03-14 | Ge Novasensor, Inc. | Proportional micromechanical valve |
| US6540203B1 (en) | 1999-03-22 | 2003-04-01 | Kelsey-Hayes Company | Pilot operated microvalve device |
| US6694998B1 (en) | 2000-03-22 | 2004-02-24 | Kelsey-Hayes Company | Micromachined structure usable in pressure regulating microvalve and proportional microvalve |
| US6845962B1 (en) * | 2000-03-22 | 2005-01-25 | Kelsey-Hayes Company | Thermally actuated microvalve device |
| US6494804B1 (en) | 2000-06-20 | 2002-12-17 | Kelsey-Hayes Company | Microvalve for electronically controlled transmission |
| US6581640B1 (en) | 2000-08-16 | 2003-06-24 | Kelsey-Hayes Company | Laminated manifold for microvalve |
| US6647164B1 (en) | 2000-10-31 | 2003-11-11 | 3M Innovative Properties Company | Gimbaled micro-mirror positionable by thermal actuators |
| US6711318B2 (en) | 2001-01-29 | 2004-03-23 | 3M Innovative Properties Company | Optical switch based on rotating vertical micro-mirror |
| US7025324B1 (en) * | 2002-01-04 | 2006-04-11 | Massachusetts Institute Of Technology | Gating apparatus and method of manufacture |
| DE10231730B4 (de) * | 2002-07-13 | 2012-08-30 | Robert Bosch Gmbh | Mikrostrukturbauelement |
| US6992422B2 (en) * | 2003-06-11 | 2006-01-31 | Texas Instruments Incorporated | Position sensor for a pivoting platform |
| CN100436900C (zh) * | 2003-11-24 | 2008-11-26 | 铝微有限公司 | 适于控制变容量压缩机的微阀装置 |
| US8011388B2 (en) * | 2003-11-24 | 2011-09-06 | Microstaq, INC | Thermally actuated microvalve with multiple fluid ports |
| US20070251586A1 (en) * | 2003-11-24 | 2007-11-01 | Fuller Edward N | Electro-pneumatic control valve with microvalve pilot |
| CA2546585A1 (en) * | 2003-11-24 | 2005-06-09 | Alumina Micro Llc | Microvalve device suitable for controlling a variable displacement compressor |
| KR20070012375A (ko) * | 2004-02-27 | 2007-01-25 | 알루미나 마이크로 엘엘씨 | 하이브리드 마이크로/매크로 평판 밸브 |
| KR20060128042A (ko) * | 2004-03-05 | 2006-12-13 | 알루미나 마이크로 엘엘씨 | 선택식 마이크로밸브 형성 접합방법 |
| US7156365B2 (en) | 2004-07-27 | 2007-01-02 | Kelsey-Hayes Company | Method of controlling microvalve actuator |
| JP2008527244A (ja) * | 2005-01-14 | 2008-07-24 | アルーマナ、マイクロウ、エルエルシー | 可変容量型コンプレッサを制御するシステムおよび方法 |
| US7913928B2 (en) | 2005-11-04 | 2011-03-29 | Alliant Techsystems Inc. | Adaptive structures, systems incorporating same and related methods |
| US9028467B2 (en) * | 2005-11-09 | 2015-05-12 | The Invention Science Fund I, Llc | Osmotic pump with remotely controlled osmotic pressure generation |
| US7942867B2 (en) * | 2005-11-09 | 2011-05-17 | The Invention Science Fund I, Llc | Remotely controlled substance delivery device |
| US8992511B2 (en) | 2005-11-09 | 2015-03-31 | The Invention Science Fund I, Llc | Acoustically controlled substance delivery device |
| US8273071B2 (en) | 2006-01-18 | 2012-09-25 | The Invention Science Fund I, Llc | Remote controller for substance delivery system |
| US8083710B2 (en) | 2006-03-09 | 2011-12-27 | The Invention Science Fund I, Llc | Acoustically controlled substance delivery device |
| US8936590B2 (en) | 2005-11-09 | 2015-01-20 | The Invention Science Fund I, Llc | Acoustically controlled reaction device |
| US20070106275A1 (en) | 2005-11-09 | 2007-05-10 | Searete Llc, A Limited Liability Corporation Of The State Of Delaware | Reaction device controlled by RF control signal |
| US20070260174A1 (en) * | 2006-05-05 | 2007-11-08 | Searete Llc | Detecting a failure to maintain a regimen |
| JP2008039502A (ja) * | 2006-08-03 | 2008-02-21 | Alps Electric Co Ltd | 接触子およびその製造方法 |
| DE112007003035T5 (de) | 2006-12-15 | 2009-11-05 | Microstaq, Inc., Austin | Mikroventilvorrichtung |
| DE112008000862T5 (de) | 2007-03-30 | 2010-03-11 | Microstaq, Inc., Austin | Vorgesteuertes Mikroschieberventil |
| US8387659B2 (en) | 2007-03-31 | 2013-03-05 | Dunan Microstaq, Inc. | Pilot operated spool valve |
| US8206025B2 (en) | 2007-08-07 | 2012-06-26 | International Business Machines Corporation | Microfluid mixer, methods of use and methods of manufacture thereof |
| FI119895B (fi) * | 2007-10-05 | 2009-04-30 | Vti Technologies Oy | Värähtelevä mikromekaaninen kulmanopeusanturi |
| JP2011530683A (ja) | 2008-08-09 | 2011-12-22 | マイクラスタック、インク | 改良型のマイクロバルブ・デバイス |
| US8113482B2 (en) | 2008-08-12 | 2012-02-14 | DunAn Microstaq | Microvalve device with improved fluid routing |
| WO2010065804A2 (en) | 2008-12-06 | 2010-06-10 | Microstaq, Inc. | Fluid flow control assembly |
| WO2010117874A2 (en) | 2009-04-05 | 2010-10-14 | Microstaq, Inc. | Method and structure for optimizing heat exchanger performance |
| CN102575782B (zh) | 2009-08-17 | 2014-04-09 | 盾安美斯泰克股份有限公司 | 微型机械装置和控制方法 |
| CN102792419B (zh) | 2010-01-28 | 2015-08-05 | 盾安美斯泰克股份有限公司 | 高温选择性融合接合的工艺与构造 |
| WO2011094302A2 (en) | 2010-01-28 | 2011-08-04 | Microstaq, Inc. | Process for reconditioning semiconductor surface to facilitate bonding |
| US20120012299A1 (en) * | 2010-07-16 | 2012-01-19 | Industrial Idea Partners, Inc. | Proportional Micro-Valve With Thermal Feedback |
| US8996141B1 (en) | 2010-08-26 | 2015-03-31 | Dunan Microstaq, Inc. | Adaptive predictive functional controller |
| DE102011115559B4 (de) | 2010-10-15 | 2022-03-31 | GM Global Technology Operations LLC (n. d. Ges. d. Staates Delaware) | Antriebsstrang-drucksteuersystem |
| US8925793B2 (en) | 2012-01-05 | 2015-01-06 | Dunan Microstaq, Inc. | Method for making a solder joint |
| US8851117B2 (en) * | 2012-01-30 | 2014-10-07 | Gm Global Technology Operations, Llc | MEMS valve operating profile |
| US9140613B2 (en) | 2012-03-16 | 2015-09-22 | Zhejiang Dunan Hetian Metal Co., Ltd. | Superheat sensor |
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| CN104884851B (zh) | 2012-12-27 | 2017-04-12 | 浙江盾安人工环境股份有限公司 | 微阀器件与阀体组件 |
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| CN104235497B (zh) * | 2013-06-24 | 2018-11-30 | 浙江盾安禾田金属有限公司 | 具有改进的空气清除能力的微阀 |
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| US9188375B2 (en) | 2013-12-04 | 2015-11-17 | Zhejiang Dunan Hetian Metal Co., Ltd. | Control element and check valve assembly |
| US9551435B2 (en) * | 2014-06-05 | 2017-01-24 | Dunan Microstaq, Inc. | Method of preventing clogging in a microvalve |
| US9494255B2 (en) * | 2014-08-14 | 2016-11-15 | Dunan Microstaq, Inc. | Plate microvalve with improved sealing mechanism |
| US9488293B2 (en) * | 2014-08-14 | 2016-11-08 | Dunan Microstaq, Inc. | On-off microvalve with improved sealing mechanism |
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| US9702426B2 (en) * | 2014-09-08 | 2017-07-11 | Dunan Microstaq, Inc. | Three speed adjustable shock absorber having one or more microvalves |
| CN105570497B (zh) * | 2014-10-17 | 2019-06-11 | 浙江盾安人工环境股份有限公司 | 冰箱制冷系统用电动切换阀及其冰箱制冷系统 |
| US10094490B2 (en) | 2015-06-16 | 2018-10-09 | Dunan Microstaq, Inc. | Microvalve having contamination resistant features |
| IT201600111289A1 (it) * | 2016-11-04 | 2018-05-04 | Blubrake S R L | Sistema per l’assistenza alla frenata da parte di un ciclista su una bicicletta |
| US11096423B2 (en) * | 2017-09-25 | 2021-08-24 | Altria Client Services Llc | E-vapor device with bimetallic actuator for opening and sealing reservoir |
| WO2019167031A1 (en) | 2018-03-02 | 2019-09-06 | National Research Council Of Canada | Polymeric microfluidic valve |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05220680A (ja) * | 1992-02-10 | 1993-08-31 | Fuji Electric Co Ltd | 静電式アクチュエータ |
Family Cites Families (99)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US886045A (en) | 1906-03-06 | 1908-04-28 | Herman J Ehrlich | Valve. |
| US1926031A (en) | 1927-05-17 | 1933-09-12 | Chas A Beatty | Automatic stage lift flowing device |
| US1886205A (en) | 1929-07-01 | 1932-11-01 | Int Harvester Co | Spring pressure contact element |
| US2412205A (en) | 1945-05-12 | 1946-12-10 | John A Cook | Pontoon metering valve and combination |
| US2504055A (en) | 1948-10-08 | 1950-04-11 | Stewart Warner Corp | High-pressure lubricant receiving fitting |
| US2875779A (en) | 1954-02-08 | 1959-03-03 | John F Campbell | Variable area metering valve |
| US2840107A (en) | 1955-01-31 | 1958-06-24 | John F Campbell | Variable area scheduling valve |
| US3031747A (en) | 1957-12-31 | 1962-05-01 | Tung Sol Electric Inc | Method of forming ohmic contact to silicon |
| GB1374626A (en) | 1970-10-30 | 1974-11-20 | Matsushita Electronics Corp | Method of making a semiconductor device |
| NL7102074A (enExample) | 1971-02-17 | 1972-08-21 | ||
| DE2215526C3 (de) | 1972-03-30 | 1979-02-08 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Verfahren zum Herstellen eines sperrfreien Metallanschlußkontaktes an p- oder n-leitende Halbleiterkörper |
| US3860949A (en) | 1973-09-12 | 1975-01-14 | Rca Corp | Semiconductor mounting devices made by soldering flat surfaces to each other |
| GB1457806A (en) | 1974-03-04 | 1976-12-08 | Mullard Ltd | Semiconductor device manufacture |
| DE2514922C2 (de) | 1975-04-05 | 1983-01-27 | SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg | Gegen thermische Wechselbelastung beständiges Halbleiterbauelement |
| US4019388A (en) | 1976-03-11 | 1977-04-26 | Bailey Meter Company | Glass to metal seal |
| US4152540A (en) | 1977-05-03 | 1979-05-01 | American Pacemaker Corporation | Feedthrough connector for implantable cardiac pacer |
| US4181249A (en) | 1977-08-26 | 1980-01-01 | Hughes Aircraft Company | Eutectic die attachment method for integrated circuits |
| DE2930779C2 (de) | 1978-07-28 | 1983-08-04 | Tokyo Shibaura Denki K.K., Kawasaki, Kanagawa | Halbleitervorrichtung |
| DE2933835C2 (de) | 1979-08-21 | 1987-02-19 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zum Befestigen von in Scheiben- oder Plattenform vorliegenden Targetmaterialien auf Kühlteller für Aufstäubanlagen |
| US4298023A (en) | 1980-09-09 | 1981-11-03 | Mcginnis Gerald E | Spring loaded exhalation valve |
| US4434813A (en) | 1981-11-19 | 1984-03-06 | The United States Of America As Represented By The Secretary Of The Army | Laminar proportional amplifier and laminar jet angular rate sensor with rotating splitter for null adjustment |
| DE3401404A1 (de) | 1984-01-17 | 1985-07-25 | Robert Bosch Gmbh, 7000 Stuttgart | Halbleiterbauelement |
| US4581624A (en) | 1984-03-01 | 1986-04-08 | Allied Corporation | Microminiature semiconductor valve |
| US4772935A (en) | 1984-12-19 | 1988-09-20 | Fairchild Semiconductor Corporation | Die bonding process |
| US4647013A (en) | 1985-02-21 | 1987-03-03 | Ford Motor Company | Silicon valve |
| US4628576A (en) | 1985-02-21 | 1986-12-16 | Ford Motor Company | Method for fabricating a silicon valve |
| DE3621331A1 (de) | 1986-06-26 | 1988-01-14 | Fraunhofer Ges Forschung | Mikroventil |
| US4966646A (en) | 1986-09-24 | 1990-10-30 | Board Of Trustees Of Leland Stanford University | Method of making an integrated, microminiature electric-to-fluidic valve |
| US4824073A (en) | 1986-09-24 | 1989-04-25 | Stanford University | Integrated, microminiature electric to fluidic valve |
| US4821997A (en) | 1986-09-24 | 1989-04-18 | The Board Of Trustees Of The Leland Stanford Junior University | Integrated, microminiature electric-to-fluidic valve and pressure/flow regulator |
| US4943032A (en) | 1986-09-24 | 1990-07-24 | Stanford University | Integrated, microminiature electric to fluidic valve and pressure/flow regulator |
| DE3738630C2 (de) | 1987-11-13 | 1995-06-08 | Rexroth Mannesmann Gmbh | Elektrohydraulische Druckwandlervorrichtung |
| US4938742A (en) | 1988-02-04 | 1990-07-03 | Smits Johannes G | Piezoelectric micropump with microvalves |
| DE3814150A1 (de) | 1988-04-27 | 1989-11-09 | Draegerwerk Ag | Ventilanordnung aus mikrostrukturierten komponenten |
| US5065978A (en) * | 1988-04-27 | 1991-11-19 | Dragerwerk Aktiengesellschaft | Valve arrangement of microstructured components |
| US4828184A (en) | 1988-08-12 | 1989-05-09 | Ford Motor Company | Silicon micromachined compound nozzle |
| US4826131A (en) | 1988-08-22 | 1989-05-02 | Ford Motor Company | Electrically controllable valve etched from silicon substrates |
| US5074629A (en) | 1988-10-26 | 1991-12-24 | Stanford University | Integrated variable focal length lens and its applications |
| US4869282A (en) | 1988-12-09 | 1989-09-26 | Rosemount Inc. | Micromachined valve with polyimide film diaphragm |
| US5064165A (en) | 1989-04-07 | 1991-11-12 | Ic Sensors, Inc. | Semiconductor transducer or actuator utilizing corrugated supports |
| US5177579A (en) | 1989-04-07 | 1993-01-05 | Ic Sensors, Inc. | Semiconductor transducer or actuator utilizing corrugated supports |
| US5209118A (en) | 1989-04-07 | 1993-05-11 | Ic Sensors | Semiconductor transducer or actuator utilizing corrugated supports |
| US5116457A (en) | 1989-04-07 | 1992-05-26 | I C Sensors, Inc. | Semiconductor transducer or actuator utilizing corrugated supports |
| US5037778A (en) | 1989-05-12 | 1991-08-06 | Intel Corporation | Die attach using gold ribbon with gold/silicon eutectic alloy cladding |
| DE3917396A1 (de) | 1989-05-29 | 1990-12-06 | Buerkert Gmbh | Mikroventil |
| DE3917423C1 (enExample) | 1989-05-29 | 1990-05-31 | Buerkert Gmbh & Co Werk Ingelfingen, 7118 Ingelfingen, De | |
| DE3919876A1 (de) | 1989-06-19 | 1990-12-20 | Bosch Gmbh Robert | Mikroventil |
| US5069419A (en) | 1989-06-23 | 1991-12-03 | Ic Sensors Inc. | Semiconductor microactuator |
| US5061914A (en) | 1989-06-27 | 1991-10-29 | Tini Alloy Company | Shape-memory alloy micro-actuator |
| US5066533A (en) | 1989-07-11 | 1991-11-19 | The Perkin-Elmer Corporation | Boron nitride membrane in wafer structure and process of forming the same |
| DE3926647A1 (de) | 1989-08-11 | 1991-02-14 | Bosch Gmbh Robert | Verfahren zur herstellung eines mikroventils |
| US5238223A (en) * | 1989-08-11 | 1993-08-24 | Robert Bosch Gmbh | Method of making a microvalve |
| GB2238267A (en) | 1989-11-01 | 1991-05-29 | Stc Plc | Brazing process |
| DE3940427A1 (de) | 1989-12-07 | 1991-06-13 | Bosch Gmbh Robert | Fahrzeugbremsanlage mit blockierschutzvorrichtung |
| US5244537A (en) | 1989-12-27 | 1993-09-14 | Honeywell, Inc. | Fabrication of an electronic microvalve apparatus |
| US5180623A (en) | 1989-12-27 | 1993-01-19 | Honeywell Inc. | Electronic microvalve apparatus and fabrication |
| US5082242A (en) | 1989-12-27 | 1992-01-21 | Ulrich Bonne | Electronic microvalve apparatus and fabrication |
| US5133379A (en) | 1990-01-31 | 1992-07-28 | University Of Utah Research Foundation | Servovalve apparatus for use in fluid systems |
| DE4003619A1 (de) | 1990-02-07 | 1991-08-14 | Bosch Gmbh Robert | Mikroventil |
| DE4006152A1 (de) | 1990-02-27 | 1991-08-29 | Fraunhofer Ges Forschung | Mikrominiaturisierte pumpe |
| DE4009090A1 (de) | 1990-03-21 | 1991-09-26 | Bosch Gmbh Robert | Verfahren zur herstellung von mehrschichtigen siliziumstrukturen |
| US5050838A (en) | 1990-07-31 | 1991-09-24 | Hewlett-Packard Company | Control valve utilizing mechanical beam buckling |
| DE4035852A1 (de) | 1990-11-10 | 1992-05-14 | Bosch Gmbh Robert | Mikroventil in mehrschichtenaufbau |
| DE4041579A1 (de) | 1990-12-22 | 1992-06-25 | Bosch Gmbh Robert | Mikroventil |
| GB2251703B (en) | 1991-01-11 | 1994-08-03 | Marconi Gec Ltd | Valve devices |
| DE4101575A1 (de) * | 1991-01-21 | 1992-07-23 | Bosch Gmbh Robert | Mikroventil |
| US5400824A (en) | 1991-01-21 | 1995-03-28 | Robert Bosch Gmbh | Microvalve |
| DE4107660C2 (de) | 1991-03-09 | 1995-05-04 | Bosch Gmbh Robert | Verfahren zur Montage von Silizium-Plättchen auf metallischen Montageflächen |
| US5058856A (en) | 1991-05-08 | 1991-10-22 | Hewlett-Packard Company | Thermally-actuated microminiature valve |
| US5176358A (en) | 1991-08-08 | 1993-01-05 | Honeywell Inc. | Microstructure gas valve control |
| US5355712A (en) | 1991-09-13 | 1994-10-18 | Lucas Novasensor | Method and apparatus for thermally actuated self testing of silicon structures |
| US5217283A (en) | 1991-09-25 | 1993-06-08 | Ford Motor Company | Integral anti-lock brake/traction control system |
| US5179499A (en) * | 1992-04-14 | 1993-01-12 | Cornell Research Foundation, Inc. | Multi-dimensional precision micro-actuator |
| US5271597A (en) | 1992-05-29 | 1993-12-21 | Ic Sensors, Inc. | Bimetallic diaphragm with split hinge for microactuator |
| JPH0656014A (ja) | 1992-08-07 | 1994-03-01 | Nisshinbo Ind Inc | アンチスキッド制御方法 |
| US5309943A (en) | 1992-12-07 | 1994-05-10 | Ford Motor Company | Micro-valve and method of manufacturing |
| US5333831A (en) | 1993-02-19 | 1994-08-02 | Hewlett-Packard Company | High performance micromachined valve orifice and seat |
| JPH06286600A (ja) | 1993-03-31 | 1994-10-11 | Toyota Motor Corp | 車両用ブレーキ圧制御装置 |
| US5267589A (en) | 1993-04-05 | 1993-12-07 | Ford Motor Company | Piezoelectric pressure control valve |
| US5445185A (en) | 1993-04-05 | 1995-08-29 | Ford Motor Company | Piezoelectric fluid control valve |
| US5325880A (en) | 1993-04-19 | 1994-07-05 | Tini Alloy Company | Shape memory alloy film actuated microvalve |
| US5417235A (en) | 1993-07-28 | 1995-05-23 | Regents Of The University Of Michigan | Integrated microvalve structures with monolithic microflow controller |
| US5368704A (en) | 1993-08-06 | 1994-11-29 | Teknekron Corporation | Micro-electrochemical valves and method |
| DE4331851A1 (de) | 1993-09-20 | 1995-03-23 | Bosch Gmbh Robert | Lochkörper und Ventil mit Lochkörper |
| DE4417251A1 (de) * | 1994-05-17 | 1995-11-23 | Bosch Gmbh Robert | Druckausgeglichenes Mikroventil |
| DE4422942B4 (de) * | 1994-06-30 | 2004-07-08 | Robert Bosch Gmbh | Vorrichtung für den Antrieb eines Mikroventils |
| US5577533A (en) | 1994-09-13 | 1996-11-26 | Cook, Jr.; Joseph S. | Flexured shaft poppet |
| DE19526897A1 (de) | 1995-07-22 | 1997-01-23 | Bosch Gmbh Robert | Mikroventil mit verbundenen Schichten und Verfahren zur Herstellung eines Mikroventils |
| US5838351A (en) | 1995-10-26 | 1998-11-17 | Hewlett-Packard Company | Valve assembly for controlling fluid flow within an ink-jet pen |
| US5941608A (en) | 1996-03-07 | 1999-08-24 | Kelsey-Hayes Company | Electronic brake management system with manual fail safe |
| US6019437A (en) * | 1996-05-29 | 2000-02-01 | Kelsey-Hayes Company | Vehicle hydraulic braking systems incorporating micro-machined technology |
| WO1997046408A1 (en) | 1996-06-05 | 1997-12-11 | Kelsey Hayes Company | Programmable electronic pedal simulator |
| US5810325A (en) | 1996-06-25 | 1998-09-22 | Bcam International, Inc. | Microvalve |
| US5785295A (en) | 1996-08-27 | 1998-07-28 | Industrial Technology Research Institute | Thermally buckling control microvalve |
| US5994816A (en) * | 1996-12-16 | 1999-11-30 | Mcnc | Thermal arched beam microelectromechanical devices and associated fabrication methods |
| US5909078A (en) | 1996-12-16 | 1999-06-01 | Mcnc | Thermal arched beam microelectromechanical actuators |
| US5873385A (en) | 1997-07-21 | 1999-02-23 | Emhart Inc. | Check valve |
| US5848605A (en) | 1997-11-12 | 1998-12-15 | Cybor Corporation | Check valve |
| US6523560B1 (en) | 1998-09-03 | 2003-02-25 | General Electric Corporation | Microvalve with pressure equalization |
-
1999
- 1999-08-31 AT AT99946703T patent/ATE393319T1/de not_active IP Right Cessation
- 1999-08-31 EP EP19990946703 patent/EP1117937B1/en not_active Expired - Lifetime
- 1999-08-31 KR KR1020017002836A patent/KR20010090720A/ko not_active Withdrawn
- 1999-08-31 DE DE1999638602 patent/DE69938602T2/de not_active Expired - Lifetime
- 1999-08-31 WO PCT/US1999/019971 patent/WO2000014415A2/en not_active Ceased
- 1999-08-31 AU AU59054/99A patent/AU5905499A/en not_active Abandoned
- 1999-08-31 CN CN99811871A patent/CN1322282A/zh active Pending
- 1999-08-31 JP JP2000569132A patent/JP4831446B2/ja not_active Expired - Lifetime
-
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Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05220680A (ja) * | 1992-02-10 | 1993-08-31 | Fuji Electric Co Ltd | 静電式アクチュエータ |
Also Published As
| Publication number | Publication date |
|---|---|
| EP1117937B1 (en) | 2008-04-23 |
| US20030098612A1 (en) | 2003-05-29 |
| EP1117937A2 (en) | 2001-07-25 |
| WO2000014415A3 (en) | 2000-07-06 |
| KR20010090720A (ko) | 2001-10-19 |
| WO2000014415A2 (en) | 2000-03-16 |
| AU5905499A (en) | 2000-03-27 |
| JP2002524698A (ja) | 2002-08-06 |
| DE69938602T2 (de) | 2009-07-30 |
| DE69938602D1 (de) | 2008-06-05 |
| US6761420B2 (en) | 2004-07-13 |
| CN1322282A (zh) | 2001-11-14 |
| ATE393319T1 (de) | 2008-05-15 |
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