KR102948780B1 - 레이저 가공 장치, 레이저 가공 방법, 레이저 가공 프로그램, 기록 매체, 반도체 칩 제조 방법, 및 반도체 칩 - Google Patents

레이저 가공 장치, 레이저 가공 방법, 레이저 가공 프로그램, 기록 매체, 반도체 칩 제조 방법, 및 반도체 칩

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Publication number
KR102948780B1
KR102948780B1 KR1020247030034A KR20247030034A KR102948780B1 KR 102948780 B1 KR102948780 B1 KR 102948780B1 KR 1020247030034 A KR1020247030034 A KR 1020247030034A KR 20247030034 A KR20247030034 A KR 20247030034A KR 102948780 B1 KR102948780 B1 KR 102948780B1
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KR
South Korea
Prior art keywords
processing
line
irradiation position
laser irradiation
laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020247030034A
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English (en)
Korean (ko)
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KR20240148878A (ko
Inventor
요시쿠니 스즈키
Original Assignee
야마하하쓰도키 가부시키가이샤
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Publication of KR20240148878A publication Critical patent/KR20240148878A/ko
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H10P72/742—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Dicing (AREA)
KR1020247030034A 2022-04-18 2022-04-18 레이저 가공 장치, 레이저 가공 방법, 레이저 가공 프로그램, 기록 매체, 반도체 칩 제조 방법, 및 반도체 칩 Active KR102948780B1 (ko)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/018062 WO2023203612A1 (ja) 2022-04-18 2022-04-18 レーザ加工装置、レーザ加工方法、レーザ加工プログラム、記録媒体、半導体チップ製造方法および半導体チップ

Publications (2)

Publication Number Publication Date
KR20240148878A KR20240148878A (ko) 2024-10-11
KR102948780B1 true KR102948780B1 (ko) 2026-04-06

Family

ID=88419414

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020247030034A Active KR102948780B1 (ko) 2022-04-18 2022-04-18 레이저 가공 장치, 레이저 가공 방법, 레이저 가공 프로그램, 기록 매체, 반도체 칩 제조 방법, 및 반도체 칩

Country Status (7)

Country Link
US (1) US20250256352A1 (https=)
JP (1) JP7571344B2 (https=)
KR (1) KR102948780B1 (https=)
CN (1) CN118973755A (https=)
DE (1) DE112022006865T5 (https=)
TW (1) TWI856333B (https=)
WO (1) WO2023203612A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100521704B1 (ko) 1997-09-19 2005-10-14 가부시키가이샤 니콘 스테이지장치, 주사형 노광장치 및 방법, 그리고 이것으로제조된 디바이스
JP2008042032A (ja) 2006-08-08 2008-02-21 Sumitomo Heavy Ind Ltd ステージ駆動方法及び該方法を用いたレーザ加工装置
JP2012256796A (ja) 2011-06-10 2012-12-27 Disco Abrasive Syst Ltd 分割予定ライン検出方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5037082B1 (https=) 1970-12-31 1975-11-29
JPS5554593U (https=) 1978-10-06 1980-04-12
JPS584716U (ja) 1981-07-02 1983-01-12 本田技研工業株式会社 内燃機関用消音器
JP2000106340A (ja) 1997-09-26 2000-04-11 Nikon Corp 露光装置及び走査露光方法、並びにステージ装置
JP6430836B2 (ja) * 2015-01-16 2018-11-28 株式会社ディスコ ウエーハの加工方法
TW201636233A (zh) * 2015-04-14 2016-10-16 鴻海精密工業股份有限公司 車輛控制系統及其操作方法
JP2017056489A (ja) * 2015-08-31 2017-03-23 株式会社リコー 光加工装置及び光加工物の生産方法
JP7032050B2 (ja) * 2017-03-14 2022-03-08 株式会社ディスコ レーザー加工装置
JP2021163914A (ja) * 2020-04-02 2021-10-11 浜松ホトニクス株式会社 レーザ加工装置、レーザ加工方法及びウェハ
JP7599777B2 (ja) * 2020-10-02 2024-12-16 株式会社ディスコ 加工装置及び加工装置の使用方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100521704B1 (ko) 1997-09-19 2005-10-14 가부시키가이샤 니콘 스테이지장치, 주사형 노광장치 및 방법, 그리고 이것으로제조된 디바이스
JP2008042032A (ja) 2006-08-08 2008-02-21 Sumitomo Heavy Ind Ltd ステージ駆動方法及び該方法を用いたレーザ加工装置
JP2012256796A (ja) 2011-06-10 2012-12-27 Disco Abrasive Syst Ltd 分割予定ライン検出方法

Also Published As

Publication number Publication date
WO2023203612A1 (ja) 2023-10-26
TW202342219A (zh) 2023-11-01
TWI856333B (zh) 2024-09-21
KR20240148878A (ko) 2024-10-11
JP7571344B2 (ja) 2024-10-22
US20250256352A1 (en) 2025-08-14
CN118973755A (zh) 2024-11-15
DE112022006865T5 (de) 2025-02-20
JPWO2023203612A1 (https=) 2023-10-26

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