TWI856333B - 雷射加工裝置、雷射加工方法、雷射加工程式、記錄媒體、半導體晶片製造方法及半導體晶片 - Google Patents

雷射加工裝置、雷射加工方法、雷射加工程式、記錄媒體、半導體晶片製造方法及半導體晶片 Download PDF

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Publication number
TWI856333B
TWI856333B TW111122834A TW111122834A TWI856333B TW I856333 B TWI856333 B TW I856333B TW 111122834 A TW111122834 A TW 111122834A TW 111122834 A TW111122834 A TW 111122834A TW I856333 B TWI856333 B TW I856333B
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TW
Taiwan
Prior art keywords
processing
irradiation position
laser irradiation
line
laser
Prior art date
Application number
TW111122834A
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English (en)
Chinese (zh)
Other versions
TW202342219A (zh
Inventor
鈴木芳邦
Original Assignee
日商山葉發動機股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商山葉發動機股份有限公司 filed Critical 日商山葉發動機股份有限公司
Publication of TW202342219A publication Critical patent/TW202342219A/zh
Application granted granted Critical
Publication of TWI856333B publication Critical patent/TWI856333B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Dicing (AREA)
TW111122834A 2022-04-18 2022-06-20 雷射加工裝置、雷射加工方法、雷射加工程式、記錄媒體、半導體晶片製造方法及半導體晶片 TWI856333B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
PCT/JP2022/018062 WO2023203612A1 (ja) 2022-04-18 2022-04-18 レーザ加工装置、レーザ加工方法、レーザ加工プログラム、記録媒体、半導体チップ製造方法および半導体チップ
WOPCT/JP2022/018062 2022-04-18

Publications (2)

Publication Number Publication Date
TW202342219A TW202342219A (zh) 2023-11-01
TWI856333B true TWI856333B (zh) 2024-09-21

Family

ID=88419414

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111122834A TWI856333B (zh) 2022-04-18 2022-06-20 雷射加工裝置、雷射加工方法、雷射加工程式、記錄媒體、半導體晶片製造方法及半導體晶片

Country Status (7)

Country Link
US (1) US20250256352A1 (https=)
JP (1) JP7571344B2 (https=)
KR (1) KR102948780B1 (https=)
CN (1) CN118973755A (https=)
DE (1) DE112022006865T5 (https=)
TW (1) TWI856333B (https=)
WO (1) WO2023203612A1 (https=)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008042032A (ja) * 2006-08-08 2008-02-21 Sumitomo Heavy Ind Ltd ステージ駆動方法及び該方法を用いたレーザ加工装置
CN105810633A (zh) * 2015-01-16 2016-07-27 株式会社迪思科 晶片的加工方法
TW201636233A (zh) * 2015-04-14 2016-10-16 鴻海精密工業股份有限公司 車輛控制系統及其操作方法
TW201707825A (zh) * 2015-08-31 2017-03-01 理光股份有限公司 光學加工裝置及光學加工物的製造方法
TW202138097A (zh) * 2020-04-02 2021-10-16 日商濱松赫德尼古斯股份有限公司 雷射加工裝置、雷射加工方法及晶圓
TW202215572A (zh) * 2020-10-02 2022-04-16 日商迪思科股份有限公司 加工裝置及加工裝置之使用方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5037082B1 (https=) 1970-12-31 1975-11-29
JPS5554593U (https=) 1978-10-06 1980-04-12
JPS584716U (ja) 1981-07-02 1983-01-12 本田技研工業株式会社 内燃機関用消音器
IL135139A0 (en) 1997-09-19 2001-05-20 Nikon Corp Stage apparatus, scanning type exposure apparatus, and device produced with the same
JP2000106340A (ja) 1997-09-26 2000-04-11 Nikon Corp 露光装置及び走査露光方法、並びにステージ装置
JP5777415B2 (ja) 2011-06-10 2015-09-09 株式会社ディスコ 分割予定ライン検出方法
JP7032050B2 (ja) * 2017-03-14 2022-03-08 株式会社ディスコ レーザー加工装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008042032A (ja) * 2006-08-08 2008-02-21 Sumitomo Heavy Ind Ltd ステージ駆動方法及び該方法を用いたレーザ加工装置
CN105810633A (zh) * 2015-01-16 2016-07-27 株式会社迪思科 晶片的加工方法
TW201636233A (zh) * 2015-04-14 2016-10-16 鴻海精密工業股份有限公司 車輛控制系統及其操作方法
TW201707825A (zh) * 2015-08-31 2017-03-01 理光股份有限公司 光學加工裝置及光學加工物的製造方法
TW202138097A (zh) * 2020-04-02 2021-10-16 日商濱松赫德尼古斯股份有限公司 雷射加工裝置、雷射加工方法及晶圓
TW202215572A (zh) * 2020-10-02 2022-04-16 日商迪思科股份有限公司 加工裝置及加工裝置之使用方法

Also Published As

Publication number Publication date
KR102948780B1 (ko) 2026-04-06
WO2023203612A1 (ja) 2023-10-26
TW202342219A (zh) 2023-11-01
KR20240148878A (ko) 2024-10-11
JP7571344B2 (ja) 2024-10-22
US20250256352A1 (en) 2025-08-14
CN118973755A (zh) 2024-11-15
DE112022006865T5 (de) 2025-02-20
JPWO2023203612A1 (https=) 2023-10-26

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