JPWO2023203612A1 - - Google Patents

Info

Publication number
JPWO2023203612A1
JPWO2023203612A1 JP2024515754A JP2024515754A JPWO2023203612A1 JP WO2023203612 A1 JPWO2023203612 A1 JP WO2023203612A1 JP 2024515754 A JP2024515754 A JP 2024515754A JP 2024515754 A JP2024515754 A JP 2024515754A JP WO2023203612 A1 JPWO2023203612 A1 JP WO2023203612A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2024515754A
Other languages
Japanese (ja)
Other versions
JP7571344B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023203612A1 publication Critical patent/JPWO2023203612A1/ja
Application granted granted Critical
Publication of JP7571344B2 publication Critical patent/JP7571344B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Dicing (AREA)
JP2024515754A 2022-04-18 2022-04-18 レーザ加工装置、レーザ加工方法、レーザ加工プログラム、記録媒体、半導体チップ製造方法および半導体チップ Active JP7571344B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/018062 WO2023203612A1 (ja) 2022-04-18 2022-04-18 レーザ加工装置、レーザ加工方法、レーザ加工プログラム、記録媒体、半導体チップ製造方法および半導体チップ

Publications (2)

Publication Number Publication Date
JPWO2023203612A1 true JPWO2023203612A1 (https=) 2023-10-26
JP7571344B2 JP7571344B2 (ja) 2024-10-22

Family

ID=88419414

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024515754A Active JP7571344B2 (ja) 2022-04-18 2022-04-18 レーザ加工装置、レーザ加工方法、レーザ加工プログラム、記録媒体、半導体チップ製造方法および半導体チップ

Country Status (7)

Country Link
US (1) US20250256352A1 (https=)
JP (1) JP7571344B2 (https=)
KR (1) KR102948780B1 (https=)
CN (1) CN118973755A (https=)
DE (1) DE112022006865T5 (https=)
TW (1) TWI856333B (https=)
WO (1) WO2023203612A1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000106340A (ja) * 1997-09-26 2000-04-11 Nikon Corp 露光装置及び走査露光方法、並びにステージ装置
JP2008042032A (ja) * 2006-08-08 2008-02-21 Sumitomo Heavy Ind Ltd ステージ駆動方法及び該方法を用いたレーザ加工装置
JP2012256796A (ja) * 2011-06-10 2012-12-27 Disco Abrasive Syst Ltd 分割予定ライン検出方法
JP2018152494A (ja) * 2017-03-14 2018-09-27 株式会社ディスコ レーザー加工装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5037082B1 (https=) 1970-12-31 1975-11-29
JPS5554593U (https=) 1978-10-06 1980-04-12
JPS584716U (ja) 1981-07-02 1983-01-12 本田技研工業株式会社 内燃機関用消音器
IL135139A0 (en) 1997-09-19 2001-05-20 Nikon Corp Stage apparatus, scanning type exposure apparatus, and device produced with the same
JP6430836B2 (ja) * 2015-01-16 2018-11-28 株式会社ディスコ ウエーハの加工方法
TW201636233A (zh) * 2015-04-14 2016-10-16 鴻海精密工業股份有限公司 車輛控制系統及其操作方法
JP2017056489A (ja) * 2015-08-31 2017-03-23 株式会社リコー 光加工装置及び光加工物の生産方法
JP2021163914A (ja) * 2020-04-02 2021-10-11 浜松ホトニクス株式会社 レーザ加工装置、レーザ加工方法及びウェハ
JP7599777B2 (ja) * 2020-10-02 2024-12-16 株式会社ディスコ 加工装置及び加工装置の使用方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000106340A (ja) * 1997-09-26 2000-04-11 Nikon Corp 露光装置及び走査露光方法、並びにステージ装置
JP2008042032A (ja) * 2006-08-08 2008-02-21 Sumitomo Heavy Ind Ltd ステージ駆動方法及び該方法を用いたレーザ加工装置
JP2012256796A (ja) * 2011-06-10 2012-12-27 Disco Abrasive Syst Ltd 分割予定ライン検出方法
JP2018152494A (ja) * 2017-03-14 2018-09-27 株式会社ディスコ レーザー加工装置

Also Published As

Publication number Publication date
KR102948780B1 (ko) 2026-04-06
WO2023203612A1 (ja) 2023-10-26
TW202342219A (zh) 2023-11-01
TWI856333B (zh) 2024-09-21
KR20240148878A (ko) 2024-10-11
JP7571344B2 (ja) 2024-10-22
US20250256352A1 (en) 2025-08-14
CN118973755A (zh) 2024-11-15
DE112022006865T5 (de) 2025-02-20

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