CN118973755A - 激光加工装置、激光加工方法、激光加工程序、记录介质、半导体芯片制造方法和半导体芯片 - Google Patents

激光加工装置、激光加工方法、激光加工程序、记录介质、半导体芯片制造方法和半导体芯片 Download PDF

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Publication number
CN118973755A
CN118973755A CN202280094487.7A CN202280094487A CN118973755A CN 118973755 A CN118973755 A CN 118973755A CN 202280094487 A CN202280094487 A CN 202280094487A CN 118973755 A CN118973755 A CN 118973755A
Authority
CN
China
Prior art keywords
processing
line
irradiation position
laser irradiation
laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280094487.7A
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English (en)
Chinese (zh)
Inventor
铃木芳邦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yamaha Motor Co Ltd
Original Assignee
Yamaha Motor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamaha Motor Co Ltd filed Critical Yamaha Motor Co Ltd
Publication of CN118973755A publication Critical patent/CN118973755A/zh
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Dicing (AREA)
CN202280094487.7A 2022-04-18 2022-04-18 激光加工装置、激光加工方法、激光加工程序、记录介质、半导体芯片制造方法和半导体芯片 Pending CN118973755A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/018062 WO2023203612A1 (ja) 2022-04-18 2022-04-18 レーザ加工装置、レーザ加工方法、レーザ加工プログラム、記録媒体、半導体チップ製造方法および半導体チップ

Publications (1)

Publication Number Publication Date
CN118973755A true CN118973755A (zh) 2024-11-15

Family

ID=88419414

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280094487.7A Pending CN118973755A (zh) 2022-04-18 2022-04-18 激光加工装置、激光加工方法、激光加工程序、记录介质、半导体芯片制造方法和半导体芯片

Country Status (7)

Country Link
US (1) US20250256352A1 (https=)
JP (1) JP7571344B2 (https=)
KR (1) KR102948780B1 (https=)
CN (1) CN118973755A (https=)
DE (1) DE112022006865T5 (https=)
TW (1) TWI856333B (https=)
WO (1) WO2023203612A1 (https=)

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5037082B1 (https=) 1970-12-31 1975-11-29
JPS5554593U (https=) 1978-10-06 1980-04-12
JPS584716U (ja) 1981-07-02 1983-01-12 本田技研工業株式会社 内燃機関用消音器
IL135139A0 (en) 1997-09-19 2001-05-20 Nikon Corp Stage apparatus, scanning type exposure apparatus, and device produced with the same
JP2000106340A (ja) 1997-09-26 2000-04-11 Nikon Corp 露光装置及び走査露光方法、並びにステージ装置
JP2008042032A (ja) * 2006-08-08 2008-02-21 Sumitomo Heavy Ind Ltd ステージ駆動方法及び該方法を用いたレーザ加工装置
JP5777415B2 (ja) 2011-06-10 2015-09-09 株式会社ディスコ 分割予定ライン検出方法
JP6430836B2 (ja) * 2015-01-16 2018-11-28 株式会社ディスコ ウエーハの加工方法
TW201636233A (zh) * 2015-04-14 2016-10-16 鴻海精密工業股份有限公司 車輛控制系統及其操作方法
JP2017056489A (ja) * 2015-08-31 2017-03-23 株式会社リコー 光加工装置及び光加工物の生産方法
JP7032050B2 (ja) * 2017-03-14 2022-03-08 株式会社ディスコ レーザー加工装置
JP2021163914A (ja) * 2020-04-02 2021-10-11 浜松ホトニクス株式会社 レーザ加工装置、レーザ加工方法及びウェハ
JP7599777B2 (ja) * 2020-10-02 2024-12-16 株式会社ディスコ 加工装置及び加工装置の使用方法

Also Published As

Publication number Publication date
KR102948780B1 (ko) 2026-04-06
WO2023203612A1 (ja) 2023-10-26
TW202342219A (zh) 2023-11-01
TWI856333B (zh) 2024-09-21
KR20240148878A (ko) 2024-10-11
JP7571344B2 (ja) 2024-10-22
US20250256352A1 (en) 2025-08-14
DE112022006865T5 (de) 2025-02-20
JPWO2023203612A1 (https=) 2023-10-26

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