KR102919987B1 - 비경화형 열전도성 실리콘 조성물 - Google Patents

비경화형 열전도성 실리콘 조성물

Info

Publication number
KR102919987B1
KR102919987B1 KR1020217027757A KR20217027757A KR102919987B1 KR 102919987 B1 KR102919987 B1 KR 102919987B1 KR 1020217027757 A KR1020217027757 A KR 1020217027757A KR 20217027757 A KR20217027757 A KR 20217027757A KR 102919987 B1 KR102919987 B1 KR 102919987B1
Authority
KR
South Korea
Prior art keywords
thermally conductive
silicone composition
conductive silicone
component
curing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020217027757A
Other languages
English (en)
Korean (ko)
Other versions
KR20210135235A (ko
Inventor
케이타 키타자와
와타루 토야
Original Assignee
신에쓰 가가꾸 고교 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 신에쓰 가가꾸 고교 가부시끼가이샤 filed Critical 신에쓰 가가꾸 고교 가부시끼가이샤
Publication of KR20210135235A publication Critical patent/KR20210135235A/ko
Application granted granted Critical
Publication of KR102919987B1 publication Critical patent/KR102919987B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/28—Nitrogen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2296—Oxides; Hydroxides of metals of zinc
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/28—Nitrogen-containing compounds
    • C08K2003/282—Binary compounds of nitrogen with aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020217027757A 2019-03-04 2020-02-04 비경화형 열전도성 실리콘 조성물 Active KR102919987B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019038421A JP6959950B2 (ja) 2019-03-04 2019-03-04 非硬化型熱伝導性シリコーン組成物
JPJP-P-2019-038421 2019-03-04
PCT/JP2020/004191 WO2020179325A1 (ja) 2019-03-04 2020-02-04 非硬化型熱伝導性シリコーン組成物

Publications (2)

Publication Number Publication Date
KR20210135235A KR20210135235A (ko) 2021-11-12
KR102919987B1 true KR102919987B1 (ko) 2026-01-29

Family

ID=72337554

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020217027757A Active KR102919987B1 (ko) 2019-03-04 2020-02-04 비경화형 열전도성 실리콘 조성물

Country Status (7)

Country Link
US (1) US11912869B2 (https=)
EP (1) EP3936573B1 (https=)
JP (1) JP6959950B2 (https=)
KR (1) KR102919987B1 (https=)
CN (1) CN113597452B (https=)
TW (1) TWI818154B (https=)
WO (1) WO2020179325A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7325324B2 (ja) * 2019-12-23 2023-08-14 信越化学工業株式会社 熱伝導性シリコーン組成物
JP7632143B2 (ja) * 2021-07-14 2025-02-19 Jnc株式会社 シリコーン樹脂組成物

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010150399A (ja) * 2008-12-25 2010-07-08 Shin-Etsu Chemical Co Ltd 熱伝導性シリコーングリース組成物
JP2015140395A (ja) * 2014-01-29 2015-08-03 信越化学工業株式会社 熱伝導性シリコーングリース組成物
WO2019039468A1 (ja) * 2017-08-22 2019-02-28 大阪ガスケミカル株式会社 硬化性組成物およびその用途

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4933094B1 (https=) 1968-12-31 1974-09-04
JPS4913874B1 (https=) 1969-08-29 1974-04-03
JPS4917380B1 (https=) 1970-07-06 1974-04-30
JPS58366B2 (ja) 1973-10-06 1983-01-06 ソニー株式会社 表面材貼付方法
US4117028A (en) 1977-04-21 1978-09-26 Dow Corning Corporation Non-curing silicone pressure sensitive adhesives
US4268452A (en) * 1980-03-10 1981-05-19 Toray Silicone Company, Ltd. Noncurable sealing materials
JP2623385B2 (ja) * 1991-08-07 1997-06-25 信越化学工業株式会社 シリコーンゴム粘土組成物
JPH08208993A (ja) * 1995-11-27 1996-08-13 Toshiba Silicone Co Ltd 熱伝導性シリコーン組成物
US5902854A (en) * 1996-09-27 1999-05-11 The Dow Chemical Company Polydimethylsiloxane containing polymer blends
JP2938428B1 (ja) 1998-02-27 1999-08-23 信越化学工業株式会社 熱伝導性グリース組成物
JP2938429B1 (ja) 1998-02-27 1999-08-23 信越化学工業株式会社 熱伝導性シリコーン組成物
US6136758A (en) * 1998-08-17 2000-10-24 Shin-Etsu Chemical Co., Ltd. Aluminum nitride powder and thermally conductive grease composition using the same
US6433055B1 (en) * 2000-09-13 2002-08-13 Dow Corning Corporation Electrically conductive hot-melt silicone adhesive composition
US6569914B2 (en) * 2001-04-27 2003-05-27 Wacker Silicones Corporation Additive for modifying the coefficient of friction of silicone release coatings and having low extractable silicone
JP3580366B2 (ja) 2001-05-01 2004-10-20 信越化学工業株式会社 熱伝導性シリコーン組成物及び半導体装置
JP3952184B2 (ja) 2002-10-10 2007-08-01 信越化学工業株式会社 熱伝導性シート
JP4110407B2 (ja) * 2003-05-30 2008-07-02 ライオン株式会社 毛髪化粧料
JP4933094B2 (ja) 2005-12-27 2012-05-16 信越化学工業株式会社 熱伝導性シリコーングリース組成物
JP4917380B2 (ja) 2006-07-31 2012-04-18 信越化学工業株式会社 放熱用シリコーングリース組成物及びその製造方法
JP5283346B2 (ja) 2007-04-10 2013-09-04 信越化学工業株式会社 熱伝導性硬化物及びその製造方法
JP5233325B2 (ja) 2008-02-29 2013-07-10 信越化学工業株式会社 熱伝導性硬化物及びその製造方法
JP4656340B2 (ja) 2008-03-03 2011-03-23 信越化学工業株式会社 熱伝導性シリコーングリース組成物
JP4572243B2 (ja) 2008-03-27 2010-11-04 信越化学工業株式会社 熱伝導性積層体およびその製造方法
JP4993135B2 (ja) 2008-07-08 2012-08-08 信越化学工業株式会社 熱伝導性シリコーン組成物
US8098418B2 (en) * 2009-03-03 2012-01-17 E. Ink Corporation Electro-optic displays, and color filters for use therein
JP5163907B2 (ja) 2009-06-04 2013-03-13 信越化学工業株式会社 熱伝導性シリコーングリース組成物
JP4913874B2 (ja) 2010-01-18 2012-04-11 信越化学工業株式会社 硬化性オルガノポリシロキサン組成物および半導体装置
JP5365572B2 (ja) * 2010-04-13 2013-12-11 信越化学工業株式会社 室温湿気増粘型熱伝導性シリコーングリース組成物
JP2013001670A (ja) 2011-06-15 2013-01-07 Shin-Etsu Chemical Co Ltd 有機ケイ素化合物及び室温硬化性オルガノポリシロキサン組成物
DE202011110267U1 (de) 2011-11-22 2013-03-26 Evonik Degussa Gmbh Zusammensetzung olefinisch funktionalisierter Siloxanoligomere basierend auf Alkoxysilanen
JP2014077278A (ja) * 2012-10-10 2014-05-01 Shin Etsu Chem Co Ltd コンクリート目地用非硬化性シーリング材、高架橋のコンクリート目地部の施工方法、及び高架橋のコンクリート目地
JP5832983B2 (ja) 2012-10-18 2015-12-16 信越化学工業株式会社 シリコーン組成物
JP6468660B2 (ja) 2014-04-09 2019-02-13 東レ・ダウコーニング株式会社 熱伝導性シリコーン組成物および電気・電子機器
JP6372293B2 (ja) 2014-10-10 2018-08-15 信越化学工業株式会社 熱伝導性シリコーングリース組成物
JP6260519B2 (ja) 2014-11-25 2018-01-17 信越化学工業株式会社 一液付加硬化型シリコーン組成物の保存方法及び硬化方法
JP6957864B2 (ja) 2016-11-09 2021-11-02 信越化学工業株式会社 熱伝導性シリコーン組成物及びその硬化物、ならびに電子装置及びその製造方法
JP6866877B2 (ja) * 2018-05-31 2021-04-28 信越化学工業株式会社 低熱抵抗シリコーン組成物

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010150399A (ja) * 2008-12-25 2010-07-08 Shin-Etsu Chemical Co Ltd 熱伝導性シリコーングリース組成物
JP2015140395A (ja) * 2014-01-29 2015-08-03 信越化学工業株式会社 熱伝導性シリコーングリース組成物
WO2019039468A1 (ja) * 2017-08-22 2019-02-28 大阪ガスケミカル株式会社 硬化性組成物およびその用途

Also Published As

Publication number Publication date
US11912869B2 (en) 2024-02-27
TW202043369A (zh) 2020-12-01
WO2020179325A1 (ja) 2020-09-10
US20220135799A1 (en) 2022-05-05
EP3936573A4 (en) 2022-11-30
EP3936573A1 (en) 2022-01-12
JP6959950B2 (ja) 2021-11-05
TWI818154B (zh) 2023-10-11
KR20210135235A (ko) 2021-11-12
EP3936573B1 (en) 2024-04-03
CN113597452B (zh) 2023-03-31
CN113597452A (zh) 2021-11-02
JP2020143178A (ja) 2020-09-10

Similar Documents

Publication Publication Date Title
KR102860043B1 (ko) 열전도성 실리콘 조성물
JP6981914B2 (ja) 熱伝導性シリコーン組成物及びその硬化物
JP5832983B2 (ja) シリコーン組成物
JP5472055B2 (ja) 熱伝導性シリコーングリース組成物
WO2018079309A1 (ja) 熱伝導性シリコーン組成物
JP2015212318A (ja) 熱伝導性シリコーン組成物
TW201940596A (zh) 矽酮組成物
KR102919987B1 (ko) 비경화형 열전도성 실리콘 조성물
KR102268543B1 (ko) 열전도성 실리콘 조성물
WO2018230189A1 (ja) 熱伝導性シリコーン組成物
WO2023132192A1 (ja) 高熱伝導性シリコーン組成物
WO2017064976A1 (ja) 熱伝導性シリコーングリース組成物
US20230124814A1 (en) Thermal conductive silicone composition
JP7562490B2 (ja) 熱伝導性シリコーン組成物
KR20240153987A (ko) 열전도성 실리콘 조성물
JP2025110656A (ja) 熱伝導性付加硬化型シリコーン組成物
JP2025092146A (ja) 熱伝導性付加硬化型シリコーン組成物、及び熱伝導性付加硬化型シリコーン組成物の製造方法
TW202607064A (zh) 熱傳導性聚矽氧封端組成物及其硬化物
KR20250158779A (ko) 실리콘 조성물

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

D13-X000 Search requested

St.27 status event code: A-1-2-D10-D13-srh-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11 Amendment of application requested

Free format text: ST27 STATUS EVENT CODE: A-2-2-P10-P11-NAP-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13 Application amended

Free format text: ST27 STATUS EVENT CODE: A-2-2-P10-P13-NAP-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

D22 Grant of ip right intended

Free format text: ST27 STATUS EVENT CODE: A-1-2-D10-D22-EXM-PE0701 (AS PROVIDED BY THE NATIONAL OFFICE)

PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

F11 Ip right granted following substantive examination

Free format text: ST27 STATUS EVENT CODE: A-2-4-F10-F11-EXM-PR0701 (AS PROVIDED BY THE NATIONAL OFFICE)

PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

U12 Designation fee paid

Free format text: ST27 STATUS EVENT CODE: A-2-2-U10-U12-OTH-PR1002 (AS PROVIDED BY THE NATIONAL OFFICE)

Year of fee payment: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

Q13 Ip right document published

Free format text: ST27 STATUS EVENT CODE: A-4-4-Q10-Q13-NAP-PG1601 (AS PROVIDED BY THE NATIONAL OFFICE)