KR102891255B1 - 정전 척 및 기판 고정 장치 - Google Patents

정전 척 및 기판 고정 장치

Info

Publication number
KR102891255B1
KR102891255B1 KR1020210172709A KR20210172709A KR102891255B1 KR 102891255 B1 KR102891255 B1 KR 102891255B1 KR 1020210172709 A KR1020210172709 A KR 1020210172709A KR 20210172709 A KR20210172709 A KR 20210172709A KR 102891255 B1 KR102891255 B1 KR 102891255B1
Authority
KR
South Korea
Prior art keywords
resistance region
groove
electrostatic chuck
base body
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020210172709A
Other languages
English (en)
Korean (ko)
Other versions
KR20220086487A (ko
Inventor
다카시 오누마
게이이치 다케모토
Original Assignee
신꼬오덴기 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 신꼬오덴기 고교 가부시키가이샤 filed Critical 신꼬오덴기 고교 가부시키가이샤
Publication of KR20220086487A publication Critical patent/KR20220086487A/ko
Application granted granted Critical
Publication of KR102891255B1 publication Critical patent/KR102891255B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H01L21/6833—
    • H01L21/68757—
    • H01L21/68785—
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7616—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating, a hardness or a material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
    • H01J2237/2007—Holding mechanisms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/334—Etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020210172709A 2020-12-16 2021-12-06 정전 척 및 기판 고정 장치 Active KR102891255B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2020-208364 2020-12-16
JP2020208364A JP7632812B2 (ja) 2020-12-16 2020-12-16 静電チャック、基板固定装置

Publications (2)

Publication Number Publication Date
KR20220086487A KR20220086487A (ko) 2022-06-23
KR102891255B1 true KR102891255B1 (ko) 2025-11-26

Family

ID=81941912

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020210172709A Active KR102891255B1 (ko) 2020-12-16 2021-12-06 정전 척 및 기판 고정 장치

Country Status (5)

Country Link
US (1) US11909335B2 (https=)
JP (1) JP7632812B2 (https=)
KR (1) KR102891255B1 (https=)
CN (1) CN114709158A (https=)
TW (1) TWI882197B (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4331103A4 (en) * 2021-04-30 2025-03-19 Estat Actuation, Inc. ELECTROADHESIVE ROTARY COUPLING
JP7759834B2 (ja) * 2022-03-31 2025-10-24 日本碍子株式会社 ウエハ載置台
CN120981907A (zh) * 2023-04-24 2025-11-18 日本碍子株式会社 晶片载放台
US20250119077A1 (en) * 2023-10-09 2025-04-10 Toyota Motor Engineering & Manufacturing North America, Inc. Electrostatic clutches with high strength substrate fabric
JP2026026650A (ja) * 2024-08-05 2026-02-18 Toto株式会社 静電チャック

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002141332A (ja) 2000-10-30 2002-05-17 Hitachi Ltd 半導体製造装置
JP2007012795A (ja) * 2005-06-29 2007-01-18 Ngk Spark Plug Co Ltd 静電チャック及びその製造方法
JP2007194616A (ja) 2005-12-22 2007-08-02 Kyocera Corp サセプタおよびこれを用いたウェハの処理方法
JP2008258374A (ja) * 2007-04-04 2008-10-23 Hitachi High-Technologies Corp ウエハ載置用電極

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6108189A (en) * 1996-04-26 2000-08-22 Applied Materials, Inc. Electrostatic chuck having improved gas conduits
JP2000323558A (ja) * 1999-05-07 2000-11-24 Nikon Corp 静電吸着装置
JP4559595B2 (ja) * 2000-07-17 2010-10-06 東京エレクトロン株式会社 被処理体の載置装置及びプラズマ処理装置
US10622239B2 (en) 2015-03-31 2020-04-14 Sumitomo Osaka Cement Co., Ltd. Electrostatic chuck device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002141332A (ja) 2000-10-30 2002-05-17 Hitachi Ltd 半導体製造装置
JP2007012795A (ja) * 2005-06-29 2007-01-18 Ngk Spark Plug Co Ltd 静電チャック及びその製造方法
JP2007194616A (ja) 2005-12-22 2007-08-02 Kyocera Corp サセプタおよびこれを用いたウェハの処理方法
JP2008258374A (ja) * 2007-04-04 2008-10-23 Hitachi High-Technologies Corp ウエハ載置用電極

Also Published As

Publication number Publication date
JP7632812B2 (ja) 2025-02-19
CN114709158A (zh) 2022-07-05
TW202240757A (zh) 2022-10-16
JP2022095187A (ja) 2022-06-28
TWI882197B (zh) 2025-05-01
KR20220086487A (ko) 2022-06-23
US11909335B2 (en) 2024-02-20
US20220190749A1 (en) 2022-06-16

Similar Documents

Publication Publication Date Title
KR102891255B1 (ko) 정전 척 및 기판 고정 장치
TWI871393B (zh) 靜電夾盤及基板固定裝置
JP7291046B2 (ja) 基板固定装置
KR101905158B1 (ko) 국부적으로 가열되는 다-구역 기판 지지부
JP5633766B2 (ja) 静電チャック
JP7449768B2 (ja) セラミックス基板及びその製造方法、静電チャック、基板固定装置、半導体装置用パッケージ
KR102880665B1 (ko) 정전 척 및 기판 고정 장치
JP2008305968A (ja) ウェハ保持体の電極接続構造
JP4033508B2 (ja) 静電チャック
JP6901547B2 (ja) 半導体製造用部品
TWI604560B (zh) 利用膜印刷技術形成靜電夾盤的方法
JP4879771B2 (ja) 静電チャック
JP6670189B2 (ja) ベースプレート構造体及びその製造方法、基板固定装置
KR20230161892A (ko) 세라믹 기판, 세라믹 기판의 제조 방법, 정전 척, 기판 고정 디바이스, 및 반도체 디바이스용 패키지
KR102852232B1 (ko) 정전 척 및 기판 고정 장치
US11862501B2 (en) Electrostatic chuck and substrate fixing device
US20250022738A1 (en) Electrostatic chuck and substrate fixing device
US20230307282A1 (en) Ceramic substrate, electrostatic chuck, substrate fixing device, and package for semiconductor device
JP2010177698A (ja) 静電チャックの製造方法
KR20240173618A (ko) 세라믹 기판, 그 제조 방법, 정전 척, 기판 고정 장치, 및 반도체 장치용 패키지
CN120854365A (zh) 静电吸盘及其制造方法以及基板固定装置

Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

D22 Grant of ip right intended

Free format text: ST27 STATUS EVENT CODE: A-1-2-D10-D22-EXM-PE0701 (AS PROVIDED BY THE NATIONAL OFFICE)

PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

U11 Full renewal or maintenance fee paid

Free format text: ST27 STATUS EVENT CODE: A-2-2-U10-U11-OTH-PR1002 (AS PROVIDED BY THE NATIONAL OFFICE)

Year of fee payment: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

Q13 Ip right document published

Free format text: ST27 STATUS EVENT CODE: A-4-4-Q10-Q13-NAP-PG1601 (AS PROVIDED BY THE NATIONAL OFFICE)

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000