TWI882197B - 靜電夾盤及基板固定裝置 - Google Patents

靜電夾盤及基板固定裝置 Download PDF

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Publication number
TWI882197B
TWI882197B TW110146493A TW110146493A TWI882197B TW I882197 B TWI882197 B TW I882197B TW 110146493 A TW110146493 A TW 110146493A TW 110146493 A TW110146493 A TW 110146493A TW I882197 B TWI882197 B TW I882197B
Authority
TW
Taiwan
Prior art keywords
substrate
resistance region
electrostatic chuck
groove
high resistance
Prior art date
Application number
TW110146493A
Other languages
English (en)
Chinese (zh)
Other versions
TW202240757A (zh
Inventor
大沼崇
竹元啓一
Original Assignee
日商新光電氣工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商新光電氣工業股份有限公司 filed Critical 日商新光電氣工業股份有限公司
Publication of TW202240757A publication Critical patent/TW202240757A/zh
Application granted granted Critical
Publication of TWI882197B publication Critical patent/TWI882197B/zh

Links

Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7616—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating, a hardness or a material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
    • H01J2237/2007—Holding mechanisms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/334—Etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW110146493A 2020-12-16 2021-12-13 靜電夾盤及基板固定裝置 TWI882197B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-208364 2020-12-16
JP2020208364A JP7632812B2 (ja) 2020-12-16 2020-12-16 静電チャック、基板固定装置

Publications (2)

Publication Number Publication Date
TW202240757A TW202240757A (zh) 2022-10-16
TWI882197B true TWI882197B (zh) 2025-05-01

Family

ID=81941912

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110146493A TWI882197B (zh) 2020-12-16 2021-12-13 靜電夾盤及基板固定裝置

Country Status (5)

Country Link
US (1) US11909335B2 (https=)
JP (1) JP7632812B2 (https=)
KR (1) KR102891255B1 (https=)
CN (1) CN114709158A (https=)
TW (1) TWI882197B (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4331103A4 (en) * 2021-04-30 2025-03-19 Estat Actuation, Inc. ELECTROADHESIVE ROTARY COUPLING
JP7759834B2 (ja) * 2022-03-31 2025-10-24 日本碍子株式会社 ウエハ載置台
CN120981907A (zh) * 2023-04-24 2025-11-18 日本碍子株式会社 晶片载放台
US20250119077A1 (en) * 2023-10-09 2025-04-10 Toyota Motor Engineering & Manufacturing North America, Inc. Electrostatic clutches with high strength substrate fabric
JP2026026650A (ja) * 2024-08-05 2026-02-18 Toto株式会社 静電チャック

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6108189A (en) * 1996-04-26 2000-08-22 Applied Materials, Inc. Electrostatic chuck having improved gas conduits
US6522519B1 (en) * 1999-05-07 2003-02-18 Nikon Corporation Electrostatic chucking device and methods for holding microlithographic sample
US20030106647A1 (en) * 2000-07-17 2003-06-12 Akira Koshiishi Apparatus for holding an object to be processed

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3834466B2 (ja) * 2000-10-30 2006-10-18 株式会社日立製作所 半導体製造装置の制御方法
JP4768333B2 (ja) * 2005-06-29 2011-09-07 日本特殊陶業株式会社 静電チャック
JP4942471B2 (ja) * 2005-12-22 2012-05-30 京セラ株式会社 サセプタおよびこれを用いたウェハの処理方法
JP5103049B2 (ja) * 2007-04-04 2012-12-19 株式会社日立ハイテクノロジーズ ウエハ載置用電極
US10622239B2 (en) 2015-03-31 2020-04-14 Sumitomo Osaka Cement Co., Ltd. Electrostatic chuck device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6108189A (en) * 1996-04-26 2000-08-22 Applied Materials, Inc. Electrostatic chuck having improved gas conduits
US6522519B1 (en) * 1999-05-07 2003-02-18 Nikon Corporation Electrostatic chucking device and methods for holding microlithographic sample
US20030106647A1 (en) * 2000-07-17 2003-06-12 Akira Koshiishi Apparatus for holding an object to be processed

Also Published As

Publication number Publication date
JP7632812B2 (ja) 2025-02-19
CN114709158A (zh) 2022-07-05
TW202240757A (zh) 2022-10-16
KR102891255B1 (ko) 2025-11-26
JP2022095187A (ja) 2022-06-28
KR20220086487A (ko) 2022-06-23
US11909335B2 (en) 2024-02-20
US20220190749A1 (en) 2022-06-16

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