CN114709158A - 静电吸盘和基板固定装置 - Google Patents

静电吸盘和基板固定装置 Download PDF

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Publication number
CN114709158A
CN114709158A CN202111535843.8A CN202111535843A CN114709158A CN 114709158 A CN114709158 A CN 114709158A CN 202111535843 A CN202111535843 A CN 202111535843A CN 114709158 A CN114709158 A CN 114709158A
Authority
CN
China
Prior art keywords
electrostatic chuck
resistance region
groove
base
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202111535843.8A
Other languages
English (en)
Chinese (zh)
Inventor
大沼崇
竹元启一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Publication of CN114709158A publication Critical patent/CN114709158A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7616—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating, a hardness or a material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
    • H01J2237/2007—Holding mechanisms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/334—Etching

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN202111535843.8A 2020-12-16 2021-12-15 静电吸盘和基板固定装置 Pending CN114709158A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-208364 2020-12-16
JP2020208364A JP7632812B2 (ja) 2020-12-16 2020-12-16 静電チャック、基板固定装置

Publications (1)

Publication Number Publication Date
CN114709158A true CN114709158A (zh) 2022-07-05

Family

ID=81941912

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202111535843.8A Pending CN114709158A (zh) 2020-12-16 2021-12-15 静电吸盘和基板固定装置

Country Status (5)

Country Link
US (1) US11909335B2 (https=)
JP (1) JP7632812B2 (https=)
KR (1) KR102891255B1 (https=)
CN (1) CN114709158A (https=)
TW (1) TWI882197B (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4331103A4 (en) * 2021-04-30 2025-03-19 Estat Actuation, Inc. ELECTROADHESIVE ROTARY COUPLING
JP7759834B2 (ja) * 2022-03-31 2025-10-24 日本碍子株式会社 ウエハ載置台
CN120981907A (zh) * 2023-04-24 2025-11-18 日本碍子株式会社 晶片载放台
US20250119077A1 (en) * 2023-10-09 2025-04-10 Toyota Motor Engineering & Manufacturing North America, Inc. Electrostatic clutches with high strength substrate fabric
JP2026026650A (ja) * 2024-08-05 2026-02-18 Toto株式会社 静電チャック

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6108189A (en) * 1996-04-26 2000-08-22 Applied Materials, Inc. Electrostatic chuck having improved gas conduits
JP2000323558A (ja) * 1999-05-07 2000-11-24 Nikon Corp 静電吸着装置
JP4559595B2 (ja) * 2000-07-17 2010-10-06 東京エレクトロン株式会社 被処理体の載置装置及びプラズマ処理装置
JP3834466B2 (ja) * 2000-10-30 2006-10-18 株式会社日立製作所 半導体製造装置の制御方法
JP4768333B2 (ja) * 2005-06-29 2011-09-07 日本特殊陶業株式会社 静電チャック
JP4942471B2 (ja) * 2005-12-22 2012-05-30 京セラ株式会社 サセプタおよびこれを用いたウェハの処理方法
JP5103049B2 (ja) * 2007-04-04 2012-12-19 株式会社日立ハイテクノロジーズ ウエハ載置用電極
US10622239B2 (en) 2015-03-31 2020-04-14 Sumitomo Osaka Cement Co., Ltd. Electrostatic chuck device

Also Published As

Publication number Publication date
JP7632812B2 (ja) 2025-02-19
TW202240757A (zh) 2022-10-16
KR102891255B1 (ko) 2025-11-26
JP2022095187A (ja) 2022-06-28
TWI882197B (zh) 2025-05-01
KR20220086487A (ko) 2022-06-23
US11909335B2 (en) 2024-02-20
US20220190749A1 (en) 2022-06-16

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