JP7632812B2 - 静電チャック、基板固定装置 - Google Patents

静電チャック、基板固定装置 Download PDF

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Publication number
JP7632812B2
JP7632812B2 JP2020208364A JP2020208364A JP7632812B2 JP 7632812 B2 JP7632812 B2 JP 7632812B2 JP 2020208364 A JP2020208364 A JP 2020208364A JP 2020208364 A JP2020208364 A JP 2020208364A JP 7632812 B2 JP7632812 B2 JP 7632812B2
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JP
Japan
Prior art keywords
groove
resistance region
high resistance
electrostatic chuck
base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2020208364A
Other languages
English (en)
Japanese (ja)
Other versions
JP2022095187A5 (https=
JP2022095187A (ja
Inventor
崇 大沼
啓一 竹元
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2020208364A priority Critical patent/JP7632812B2/ja
Priority to KR1020210172709A priority patent/KR102891255B1/ko
Priority to TW110146493A priority patent/TWI882197B/zh
Priority to US17/550,502 priority patent/US11909335B2/en
Priority to CN202111535843.8A priority patent/CN114709158A/zh
Publication of JP2022095187A publication Critical patent/JP2022095187A/ja
Publication of JP2022095187A5 publication Critical patent/JP2022095187A5/ja
Application granted granted Critical
Publication of JP7632812B2 publication Critical patent/JP7632812B2/ja
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Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7616—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating, a hardness or a material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
    • H01J2237/2007—Holding mechanisms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/334—Etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2020208364A 2020-12-16 2020-12-16 静電チャック、基板固定装置 Active JP7632812B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2020208364A JP7632812B2 (ja) 2020-12-16 2020-12-16 静電チャック、基板固定装置
KR1020210172709A KR102891255B1 (ko) 2020-12-16 2021-12-06 정전 척 및 기판 고정 장치
TW110146493A TWI882197B (zh) 2020-12-16 2021-12-13 靜電夾盤及基板固定裝置
US17/550,502 US11909335B2 (en) 2020-12-16 2021-12-14 Electrostatic chuck and substrate fixing device
CN202111535843.8A CN114709158A (zh) 2020-12-16 2021-12-15 静电吸盘和基板固定装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020208364A JP7632812B2 (ja) 2020-12-16 2020-12-16 静電チャック、基板固定装置

Publications (3)

Publication Number Publication Date
JP2022095187A JP2022095187A (ja) 2022-06-28
JP2022095187A5 JP2022095187A5 (https=) 2023-09-26
JP7632812B2 true JP7632812B2 (ja) 2025-02-19

Family

ID=81941912

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020208364A Active JP7632812B2 (ja) 2020-12-16 2020-12-16 静電チャック、基板固定装置

Country Status (5)

Country Link
US (1) US11909335B2 (https=)
JP (1) JP7632812B2 (https=)
KR (1) KR102891255B1 (https=)
CN (1) CN114709158A (https=)
TW (1) TWI882197B (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4331103A4 (en) * 2021-04-30 2025-03-19 Estat Actuation, Inc. ELECTROADHESIVE ROTARY COUPLING
JP7759834B2 (ja) * 2022-03-31 2025-10-24 日本碍子株式会社 ウエハ載置台
CN120981907A (zh) * 2023-04-24 2025-11-18 日本碍子株式会社 晶片载放台
US20250119077A1 (en) * 2023-10-09 2025-04-10 Toyota Motor Engineering & Manufacturing North America, Inc. Electrostatic clutches with high strength substrate fabric
JP2026026650A (ja) * 2024-08-05 2026-02-18 Toto株式会社 静電チャック

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002141332A (ja) 2000-10-30 2002-05-17 Hitachi Ltd 半導体製造装置
JP2007012795A (ja) 2005-06-29 2007-01-18 Ngk Spark Plug Co Ltd 静電チャック及びその製造方法
JP2007194616A (ja) 2005-12-22 2007-08-02 Kyocera Corp サセプタおよびこれを用いたウェハの処理方法
JP2008258374A (ja) 2007-04-04 2008-10-23 Hitachi High-Technologies Corp ウエハ載置用電極

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6108189A (en) * 1996-04-26 2000-08-22 Applied Materials, Inc. Electrostatic chuck having improved gas conduits
JP2000323558A (ja) * 1999-05-07 2000-11-24 Nikon Corp 静電吸着装置
JP4559595B2 (ja) * 2000-07-17 2010-10-06 東京エレクトロン株式会社 被処理体の載置装置及びプラズマ処理装置
US10622239B2 (en) 2015-03-31 2020-04-14 Sumitomo Osaka Cement Co., Ltd. Electrostatic chuck device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002141332A (ja) 2000-10-30 2002-05-17 Hitachi Ltd 半導体製造装置
JP2007012795A (ja) 2005-06-29 2007-01-18 Ngk Spark Plug Co Ltd 静電チャック及びその製造方法
JP2007194616A (ja) 2005-12-22 2007-08-02 Kyocera Corp サセプタおよびこれを用いたウェハの処理方法
JP2008258374A (ja) 2007-04-04 2008-10-23 Hitachi High-Technologies Corp ウエハ載置用電極

Also Published As

Publication number Publication date
CN114709158A (zh) 2022-07-05
TW202240757A (zh) 2022-10-16
KR102891255B1 (ko) 2025-11-26
JP2022095187A (ja) 2022-06-28
TWI882197B (zh) 2025-05-01
KR20220086487A (ko) 2022-06-23
US11909335B2 (en) 2024-02-20
US20220190749A1 (en) 2022-06-16

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