KR102887437B1 - 접합 방법 및 접합체 - Google Patents

접합 방법 및 접합체

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Publication number
KR102887437B1
KR102887437B1 KR1020247017491A KR20247017491A KR102887437B1 KR 102887437 B1 KR102887437 B1 KR 102887437B1 KR 1020247017491 A KR1020247017491 A KR 1020247017491A KR 20247017491 A KR20247017491 A KR 20247017491A KR 102887437 B1 KR102887437 B1 KR 102887437B1
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KR
South Korea
Prior art keywords
bonding
main body
cover
flow path
diffusion
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Active
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KR1020247017491A
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English (en)
Korean (ko)
Other versions
KR20240091000A (ko
Inventor
도시히코 하나마치
다이스케 후지노
마사루 다키모토
요시히토 아라키
마사히로 후지이
Original Assignee
닛폰 하츠죠 가부시키가이샤
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Application filed by 닛폰 하츠죠 가부시키가이샤 filed Critical 닛폰 하츠죠 가부시키가이샤
Priority to KR1020257038020A priority Critical patent/KR20250163426A/ko
Publication of KR20240091000A publication Critical patent/KR20240091000A/ko
Application granted granted Critical
Publication of KR102887437B1 publication Critical patent/KR102887437B1/ko
Active legal-status Critical Current
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
    • B23K20/023—Thermo-compression bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/22—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded
    • B23K20/233—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded without ferrous layer
    • B23K20/2336—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded without ferrous layer both layers being aluminium
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/04—Tubular or hollow articles
    • B23K2101/14—Heat exchangers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/10—Aluminium or alloys thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
KR1020247017491A 2018-12-21 2019-12-13 접합 방법 및 접합체 Active KR102887437B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020257038020A KR20250163426A (ko) 2018-12-21 2019-12-13 접합 방법 및 접합체

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JPJP-P-2018-240266 2018-12-21
JP2018240266 2018-12-21
KR1020217017680A KR102670607B1 (ko) 2018-12-21 2019-12-13 접합 방법 및 접합체
PCT/JP2019/049049 WO2020129863A1 (ja) 2018-12-21 2019-12-13 接合方法および接合体

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020217017680A Division KR102670607B1 (ko) 2018-12-21 2019-12-13 접합 방법 및 접합체

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020257038020A Division KR20250163426A (ko) 2018-12-21 2019-12-13 접합 방법 및 접합체

Publications (2)

Publication Number Publication Date
KR20240091000A KR20240091000A (ko) 2024-06-21
KR102887437B1 true KR102887437B1 (ko) 2025-11-17

Family

ID=71101298

Family Applications (3)

Application Number Title Priority Date Filing Date
KR1020247017491A Active KR102887437B1 (ko) 2018-12-21 2019-12-13 접합 방법 및 접합체
KR1020217017680A Active KR102670607B1 (ko) 2018-12-21 2019-12-13 접합 방법 및 접합체
KR1020257038020A Pending KR20250163426A (ko) 2018-12-21 2019-12-13 접합 방법 및 접합체

Family Applications After (2)

Application Number Title Priority Date Filing Date
KR1020217017680A Active KR102670607B1 (ko) 2018-12-21 2019-12-13 접합 방법 및 접합체
KR1020257038020A Pending KR20250163426A (ko) 2018-12-21 2019-12-13 접합 방법 및 접합체

Country Status (7)

Country Link
US (1) US20220009022A1 (https=)
EP (1) EP3900867A4 (https=)
JP (2) JP7641120B2 (https=)
KR (3) KR102887437B1 (https=)
CN (1) CN113195146A (https=)
TW (1) TWI830840B (https=)
WO (1) WO2020129863A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20230234160A1 (en) * 2022-01-24 2023-07-27 Applied Materials, Inc. Diffusion bonding of pure metal bodies

Family Cites Families (63)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5461015A (en) * 1977-10-25 1979-05-17 Kobe Steel Ltd Manufacture of aluminum-soldered fin heat exchanger
GB8429979D0 (en) * 1984-11-28 1985-02-13 British Aerospace Diffusion banding of metals
JPS62254989A (ja) 1986-04-24 1987-11-06 セジユデユ−ル・ソシエテ・ドウ・トランスフオルマシオン・ドウ・ラリユミニウム・ペシネ アルミニウム又はアルミニウム合金部材の固体状態拡散による接合方法
JPH0292631A (ja) * 1988-09-30 1990-04-03 Nisshin Steel Co Ltd 流体流路を内蔵した複合金属板
GB9114258D0 (en) * 1991-07-02 1991-08-21 Secr Defence Superplastic deformation of diffusion bonded aluminium structures
US5433835B1 (en) * 1993-11-24 1997-05-20 Applied Materials Inc Sputtering device and target with cover to hold cooling fluid
JPH07320898A (ja) 1994-05-27 1995-12-08 Mitsubishi Heavy Ind Ltd 加速管の組立方法
JP3775946B2 (ja) 1999-06-01 2006-05-17 独立行政法人科学技術振興機構 微弱接合圧力で固相拡散接合した製品とその製造方法
JP2001050682A (ja) 1999-08-05 2001-02-23 Showa Alum Corp パネル型熱交換器およびその製造方法
JP2003300391A (ja) 2002-04-08 2003-10-21 Sumitomo Electric Ind Ltd 加熱圧着用接合体およびそれを用いた加熱圧着装置
JP2004090082A (ja) * 2002-09-04 2004-03-25 Masao Hondo 細穴及び／又はスリットを有する金属体の製造方法
DE10251658B4 (de) * 2002-11-01 2005-08-25 Atotech Deutschland Gmbh Verfahren zum Verbinden von zur Herstellung von Mikrostrukturbauteilen geeigneten, mikrostrukturierten Bauteillagen sowie Mikrostrukturbauteil
CN1234496C (zh) * 2002-12-27 2006-01-04 北京青云航空仪表有限公司 铝铜双金属片的低温低压反应扩散焊
JP4173376B2 (ja) * 2003-01-14 2008-10-29 新日鉄マテリアルズ株式会社 拡散接合性の良好な排気ガス浄化用メタル担体用耐熱ステンレス鋼箔およびメタル担体
JP2005021946A (ja) 2003-07-03 2005-01-27 Masao Hondo 異種金属部材の接合方法
JP4838992B2 (ja) * 2004-10-08 2011-12-14 古河スカイ株式会社 ヒータプレート及びヒータプレートの製造方法
JP4393362B2 (ja) * 2004-12-03 2010-01-06 株式会社コベルコ科研 ＡｌまたはＡｌ合金接合体の製法
JPWO2007052743A1 (ja) * 2005-11-07 2009-04-30 株式会社東芝 スパッタリングターゲットおよびその製造方法
JP2007285682A (ja) * 2006-04-20 2007-11-01 Xenesys Inc 熱交換器製造方法
KR100780749B1 (ko) * 2006-12-28 2007-11-30 주식회사 단성일렉트론 써셉터 제조방법 및 이를 이용한 써셉터
JP2009535801A (ja) 2006-04-28 2009-10-01 ダンスン エレクトロン カンパニー リミテッド サセプタの製造方法、及び、この方法によって製造されたサセプタ
US7798388B2 (en) * 2007-05-31 2010-09-21 Applied Materials, Inc. Method of diffusion bonding a fluid flow apparatus
US20080296354A1 (en) * 2007-05-31 2008-12-04 Mark Crockett Stainless steel or stainless steel alloy for diffusion bonding
JP2009231611A (ja) 2008-03-24 2009-10-08 Tokyo Electron Ltd シャワープレート及びシャワープレートの製造方法
JP5411136B2 (ja) * 2008-07-15 2014-02-12 東京エレクトロン株式会社 マイクロ波プラズマ処理装置、及び冷却ジャケットの製造方法
JP2010094683A (ja) * 2008-10-14 2010-04-30 Panasonic Corp アルミニウム合金の拡散接合法
US8159821B2 (en) * 2009-07-28 2012-04-17 Dsem Holdings Sdn. Bhd. Diffusion bonding circuit submount directly to vapor chamber
CN104551382B (zh) 2010-06-04 2016-09-14 株式会社Uacj 铝合金材料的接合方法
KR20120021770A (ko) * 2010-08-17 2012-03-09 명화공업주식회사 초경량 듀얼 드럼 브레이크 및 그 제조방법
KR101682845B1 (ko) * 2011-05-24 2016-12-05 미츠비시 히타치 파워 시스템즈 가부시키가이샤 중공 만곡판 및 그 제조 방법 및 가스 터빈의 연소기
JP5901251B2 (ja) * 2011-11-28 2016-04-06 株式会社Uacj 構造体の製造方法
JP2014091125A (ja) * 2012-10-31 2014-05-19 Nitto Seiko Co Ltd 炭素含有量の異なる鋼材部品およびその製造方法
CN103551793B (zh) * 2013-10-29 2016-05-11 西南石油大学 一种防炸裂增强度的金刚石复合片和碳化钨胎体焊接方法
CN103722304B (zh) * 2014-01-09 2016-12-07 北京航空航天大学 一种用于界面强化传热的铝合金界面低温扩散连接用材料
JP6384112B2 (ja) * 2014-04-25 2018-09-05 三菱マテリアル株式会社 パワーモジュール用基板及びヒートシンク付パワーモジュール用基板
JP6488917B2 (ja) * 2014-07-04 2019-03-27 三菱マテリアル株式会社 放熱板付パワーモジュール用基板及びパワーモジュール
CN104084691A (zh) * 2014-07-10 2014-10-08 西北工业大学 铝合金等强度扩散连接方法
JP6287681B2 (ja) * 2014-08-18 2018-03-07 三菱マテリアル株式会社 接合体の製造方法、パワーモジュール用基板の製造方法、及び、ヒートシンク付パワーモジュール用基板の製造方法
FR3026974B1 (fr) * 2014-10-10 2016-12-09 Commissariat Energie Atomique Procede de realisation d'un module d'echangeur de chaleur a au moins deux circuits de circulation de fluide, echangeur thermique et reacteur-echangeur associes
WO2016138987A1 (de) * 2015-03-02 2016-09-09 Linde Aktiengesellschaft Verfahren zur herstellung eines plattenwärmeübertragers
JP6575386B2 (ja) * 2015-03-11 2019-09-18 三菱マテリアル株式会社 接合体の製造方法、ヒートシンク付パワーモジュール用基板の製造方法、及び、ヒートシンクの製造方法
JP6332108B2 (ja) * 2015-03-30 2018-05-30 三菱マテリアル株式会社 ヒートシンク付パワーモジュール用基板の製造方法
JP6468028B2 (ja) * 2015-03-30 2019-02-13 三菱マテリアル株式会社 放熱板付パワーモジュール用基板
JP6696214B2 (ja) * 2015-04-16 2020-05-20 三菱マテリアル株式会社 接合体、ヒートシンク付パワーモジュール用基板、ヒートシンク、及び、接合体の製造方法、ヒートシンク付パワーモジュール用基板の製造方法、ヒートシンクの製造方法
US10497585B2 (en) * 2015-04-16 2019-12-03 Mitsubishi Materials Corporation Bonded body, substrate for power module with heat sink, heat sink, method for producing bonded body, method for producing substrate for power module with heat sink, and method for producing heat sink
JP6696215B2 (ja) * 2015-04-16 2020-05-20 三菱マテリアル株式会社 接合体、ヒートシンク付パワーモジュール用基板、ヒートシンク、及び、接合体の製造方法、ヒートシンク付パワーモジュール用基板の製造方法、ヒートシンクの製造方法
JP6808503B2 (ja) * 2016-02-05 2021-01-06 株式会社アルバック 部材接合方法
JP6572810B2 (ja) 2016-03-15 2019-09-11 三菱マテリアル株式会社 接合体の製造方法、及び、パワーモジュール用基板の製造方法
JP6321067B2 (ja) * 2016-03-31 2018-05-09 住友精密工業株式会社 拡散接合型熱交換器
CN106475679B (zh) * 2016-11-30 2018-07-27 山东大学 一种铜与铝合金的无中间层非连续加压真空扩散连接工艺
JP6717238B2 (ja) * 2017-03-07 2020-07-01 三菱マテリアル株式会社 ヒートシンク付パワーモジュール用基板
CN106956072B (zh) * 2017-04-06 2019-11-26 哈尔滨工大华策科技有限公司 一种扩散焊多层铝箔的连接方法
CN107175398A (zh) * 2017-06-28 2017-09-19 合肥工业大学 一种钼合金与钨合金的sps扩散焊接方法
CN107486619A (zh) * 2017-08-30 2017-12-19 合肥工业大学 一种TZM与WRe异种难熔合金的SPS扩散焊接方法
CN111819682B (zh) * 2018-03-26 2025-04-29 三菱综合材料株式会社 绝缘电路基板用接合体的制造方法及绝缘电路基板用接合体
CN108161324A (zh) * 2018-03-30 2018-06-15 吉林大学 铝合金散热冷板扩散焊夹具
CN208005081U (zh) * 2018-03-30 2018-10-26 吉林大学 铝合金散热冷板扩散焊夹具
GB2573546B (en) * 2018-05-09 2021-03-31 Twi Ltd A method of diffusion bonding
DE102019204131A1 (de) * 2019-03-26 2019-06-06 Carl Zeiss Smt Gmbh Vorrichtung zur Führung eines flüssigen oder gasförmigen Mediums, Verfahren zur Herstellung einer entsprechenden Vorrichtung, Feldfacettenmodul und Projektionsbelichtungsanlage
CN110328443A (zh) * 2019-06-24 2019-10-15 北京航星机器制造有限公司 一种脉冲电流辅助铝合金大面积扩散连接装置及方法
CN110253131B (zh) * 2019-07-01 2020-12-04 中国科学院工程热物理研究所 毛细通道换热器及其制备方法
CN110375567A (zh) * 2019-07-20 2019-10-25 中国船舶重工集团公司第七二四研究所 一种基于层压扩散焊工艺的多层通道冷板及其成形方法
CN110579123A (zh) * 2019-09-19 2019-12-17 中国核动力研究设计院 双侧异型流道的高压紧凑换热器结构及其组装方法

Also Published As

Publication number Publication date
WO2020129863A1 (ja) 2020-06-25
KR20210089732A (ko) 2021-07-16
EP3900867A1 (en) 2021-10-27
TW202023722A (zh) 2020-07-01
JP2025065475A (ja) 2025-04-17
JP7641120B2 (ja) 2025-03-06
KR102670607B1 (ko) 2024-05-29
TWI830840B (zh) 2024-02-01
KR20240091000A (ko) 2024-06-21
KR20250163426A (ko) 2025-11-20
EP3900867A4 (en) 2022-09-28
CN113195146A (zh) 2021-07-30
JPWO2020129863A1 (ja) 2021-11-25
US20220009022A1 (en) 2022-01-13

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