KR102880664B1 - 경화성 수지, 경화성 수지 조성물, 및, 경화물 - Google Patents

경화성 수지, 경화성 수지 조성물, 및, 경화물

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Publication number
KR102880664B1
KR102880664B1 KR1020227032188A KR20227032188A KR102880664B1 KR 102880664 B1 KR102880664 B1 KR 102880664B1 KR 1020227032188 A KR1020227032188 A KR 1020227032188A KR 20227032188 A KR20227032188 A KR 20227032188A KR 102880664 B1 KR102880664 B1 KR 102880664B1
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South Korea
Prior art keywords
curable resin
group
cured product
resin composition
skeleton
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KR1020227032188A
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Korean (ko)
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KR20220164699A (ko
Inventor
리첸 양
류이치 마츠오카
히로요시 간나리
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디아이씨 가부시끼가이샤
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F22/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides or nitriles thereof
    • C08F22/10—Esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G61/02—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C69/00—Esters of carboxylic acids; Esters of carbonic or haloformic acids
    • C07C69/52—Esters of acyclic unsaturated carboxylic acids having the esterified carboxyl group bound to an acyclic carbon atom
    • C07C69/533—Monocarboxylic acid esters having only one carbon-to-carbon double bond
    • C07C69/54—Acrylic acid esters; Methacrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F12/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
    • C08F12/34—Monomers containing two or more unsaturated aliphatic radicals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F22/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides or nitriles thereof
    • C08F22/10—Esters
    • C08F22/1006—Esters of polyhydric alcohols or polyhydric phenols, e.g. ethylene glycol dimethacrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G61/12—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule
    • C08G61/127—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule derived from carbon dioxide, carbonyl halide, carboxylic acids or their derivatives

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
KR1020227032188A 2020-04-06 2021-03-11 경화성 수지, 경화성 수지 조성물, 및, 경화물 Active KR102880664B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020068475 2020-04-06
JPJP-P-2020-068475 2020-04-06
PCT/JP2021/009703 WO2021205806A1 (ja) 2020-04-06 2021-03-11 硬化性樹脂、硬化性樹脂組成物、及び、硬化物

Publications (2)

Publication Number Publication Date
KR20220164699A KR20220164699A (ko) 2022-12-13
KR102880664B1 true KR102880664B1 (ko) 2025-11-04

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Country Status (6)

Country Link
US (1) US12359020B2 (https=)
JP (1) JP6962507B1 (https=)
KR (1) KR102880664B1 (https=)
CN (1) CN115348977B (https=)
TW (1) TWI874606B (https=)
WO (1) WO2021205806A1 (https=)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20240317916A1 (en) * 2021-07-29 2024-09-26 Dic Corporation Curable resin composition and cured product
JP7786119B2 (ja) * 2021-10-12 2025-12-16 Dic株式会社 硬化性樹脂組成物、硬化物及び物品
JP7786118B2 (ja) * 2021-10-12 2025-12-16 Dic株式会社 硬化性樹脂組成物、硬化物、絶縁材料及びレジスト部材
KR20240076816A (ko) * 2021-11-18 2024-05-30 디아이씨 가부시끼가이샤 경화성 수지, 경화성 수지 조성물 및 경화물
JP7806551B2 (ja) * 2022-03-01 2026-01-27 Dic株式会社 酸基及び重合性不飽和基を有する樹脂、硬化性樹脂組成物、硬化物、絶縁材料及びレジスト部材
JP7806552B2 (ja) * 2022-03-01 2026-01-27 Dic株式会社 重合性不飽和基を有する樹脂、硬化性樹脂組成物、硬化物及び物品
US20250257214A1 (en) 2022-03-14 2025-08-14 Mitsubishi Gas Chemical Company, Inc. Resin composition, cured product, prepreg, metal foil-clad laminate, resin composite sheet, printed wiring board, and semiconductor device
JP7459394B2 (ja) 2022-03-14 2024-04-01 三菱瓦斯化学株式会社 樹脂組成物、硬化物、プリプレグ、金属箔張積層板、樹脂複合シート、プリント配線板、および、半導体装置
JP7643583B2 (ja) 2022-03-14 2025-03-11 三菱瓦斯化学株式会社 樹脂、樹脂組成物、硬化物、プリプレグ、金属箔張積層板、樹脂複合シート、プリント配線板、および、半導体装置
JP7643582B2 (ja) 2022-03-14 2025-03-11 三菱瓦斯化学株式会社 ヒドロキシ樹脂、スチレン樹脂、ヒドロキシ樹脂の製造方法、スチレン樹脂の製造方法、および、その応用
JP2024006094A (ja) * 2022-06-30 2024-01-17 Dic株式会社 樹脂組成物、硬化物、絶縁材料、及びレジスト部材
JP2024006097A (ja) * 2022-06-30 2024-01-17 Dic株式会社 樹脂組成物、硬化物、及び物品
CN120092029A (zh) 2022-10-26 2025-06-03 三菱瓦斯化学株式会社 树脂组合物、固化物、预浸料、覆金属箔层叠板、树脂复合片、以及印刷电路板
CN120112571A (zh) 2022-10-27 2025-06-06 三菱瓦斯化学株式会社 树脂组合物、固化物、预浸料、覆金属箔层叠板、树脂复合片、以及印刷电路板
JP7614243B2 (ja) * 2023-03-14 2025-01-15 日本化薬株式会社 硬化性樹脂、硬化性樹脂組成物、およびその硬化物
JP2025073904A (ja) 2023-10-27 2025-05-13 Dic株式会社 硬化性樹脂組成物、硬化物、ワニス、プリプレグ及び回路基板
JP2025073902A (ja) 2023-10-27 2025-05-13 Dic株式会社 硬化性樹脂組成物、硬化物、ワニス、プリプレグ及び回路基板
JP2025073903A (ja) 2023-10-27 2025-05-13 Dic株式会社 硬化性樹脂組成物、硬化物、ワニス、プリプレグ及び回路基板
US20250188311A1 (en) * 2023-12-11 2025-06-12 Fujifilm Electronic Materials U.S.A., Inc. Poly-o-hydroxyamides comprising novel indane bis-o-aminophenols, photosensitive compositions, dielectric films, and buffer coatings containing the same
WO2026023296A1 (ja) * 2024-07-26 2026-01-29 パナソニックＩｐマネジメント株式会社 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及び配線板

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010014869A (ja) 2008-07-02 2010-01-21 Dic Corp 液晶素子
JP2011168673A (ja) 2010-02-17 2011-09-01 Tokyo Institute Of Technology １−メチレンインダン重合体及びその製造方法、ブロック共重合体及びその製造方法、並びに、光学フィルム。
JP2012036233A (ja) 2010-08-03 2012-02-23 Osaka City Univ マレイミド系重合体
JP2012193362A (ja) 2011-03-03 2012-10-11 Jx Nippon Oil & Energy Corp インダン系重合体及びその製造方法、並びにインデン系重合体及びその製造方法
JP2013080033A (ja) 2011-10-03 2013-05-02 Shin Etsu Chem Co Ltd ポジ型レジスト材料並びにこれを用いたパターン形成方法
JP2019183020A (ja) 2018-04-11 2019-10-24 株式会社Adeka 重合性組成物、ブラックマトリクス用感光性組成物及びカラーフィルタ

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4707558A (en) 1986-09-03 1987-11-17 The Dow Chemical Company Monomers and oligomers containing a plurality of vinylbenzyl ether groups, method for their preparation and cured products therefrom
DE3773398D1 (de) 1986-12-29 1991-10-31 Allied Signal Inc Thermohaertbare polymere von mit styrol endenden tetrakis-phenolen.
US4786700A (en) 1986-12-30 1988-11-22 Allied-Signal, Inc. Homogeneous thermosetting copolymers
JPH0710902B2 (ja) 1987-09-04 1995-02-08 昭和高分子株式会社 硬化性樹脂組成物
EP0577836A4 (en) * 1991-12-27 1994-08-17 Sumitomo Chemical Co Polyamino-oligomer and polymaleimide compound
JP3033327B2 (ja) * 1992-03-06 2000-04-17 住友化学工業株式会社 熱硬化性樹脂組成物およびそれを用いた銅張り積層板
JP2801494B2 (ja) * 1993-04-01 1998-09-21 帝人株式会社 ジアリル化合物および該化合物を用いた架橋重合体の製造方法
US5496910A (en) 1994-07-21 1996-03-05 The Dow Chemical Company Hydroxyfunctional thermoplastic polyesters
JP3414556B2 (ja) 1995-07-24 2003-06-09 昭和高分子株式会社 ポリビニルベンジルエーテル化合物およびその製造方法
JPH10153238A (ja) 1996-11-14 1998-06-09 Patentverwert G Rohs Voigt Mbh 流体式ねじれ振動減衰装置
US6153721A (en) * 1998-02-26 2000-11-28 Honeywell International Inc. Preparation of polyindanebisphenols and polymers derived therefrom
JP4591946B2 (ja) 2004-04-28 2010-12-01 日本化薬株式会社 ポリ（ビニルベンジル）エーテル化合物およびその製造方法
CN101646695B (zh) * 2007-03-30 2012-07-18 Dic株式会社 高分子稳定化液晶组合物、液晶显示元件、液晶显示元件的制造方法
JP5466863B2 (ja) * 2009-03-04 2014-04-09 株式会社Ａｄｅｋａ 重合性化合物、これを含有する重合性組成物及びその重合体
JP6629692B2 (ja) * 2016-07-22 2020-01-15 Ｊｆｅケミカル株式会社 ビスマレイミド化合物およびその製造方法
JP7127938B2 (ja) * 2016-11-03 2022-08-30 フジフイルム エレクトロニック マテリアルズ ユー．エス．エー．， インコーポレイテッド ポリイミド
TWI799550B (zh) * 2018-03-27 2023-04-21 日商富士軟片股份有限公司 壓印用硬化性組成物、脫模劑、硬化物、圖案形成方法和微影方法
EP4086290A1 (en) * 2021-05-04 2022-11-09 SHPP Global Technologies B.V. Capped bisphenol polyindane oligomer and composition, method of manufacture, and articles made therefrom

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010014869A (ja) 2008-07-02 2010-01-21 Dic Corp 液晶素子
JP2011168673A (ja) 2010-02-17 2011-09-01 Tokyo Institute Of Technology １−メチレンインダン重合体及びその製造方法、ブロック共重合体及びその製造方法、並びに、光学フィルム。
JP2012036233A (ja) 2010-08-03 2012-02-23 Osaka City Univ マレイミド系重合体
JP2012193362A (ja) 2011-03-03 2012-10-11 Jx Nippon Oil & Energy Corp インダン系重合体及びその製造方法、並びにインデン系重合体及びその製造方法
JP2013080033A (ja) 2011-10-03 2013-05-02 Shin Etsu Chem Co Ltd ポジ型レジスト材料並びにこれを用いたパターン形成方法
JP2019183020A (ja) 2018-04-11 2019-10-24 株式会社Adeka 重合性組成物、ブラックマトリクス用感光性組成物及びカラーフィルタ

Also Published As

Publication number Publication date
US20230159695A1 (en) 2023-05-25
WO2021205806A1 (ja) 2021-10-14
TWI874606B (zh) 2025-03-01
CN115348977B (zh) 2023-11-21
KR20220164699A (ko) 2022-12-13
CN115348977A (zh) 2022-11-15
JP6962507B1 (ja) 2021-11-05
JPWO2021205806A1 (https=) 2021-10-14
US12359020B2 (en) 2025-07-15
TW202138409A (zh) 2021-10-16

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