KR102864012B1 - 척킹 및 아크 발생 성능이 개선된 정전 척 설계 - Google Patents

척킹 및 아크 발생 성능이 개선된 정전 척 설계

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Publication number
KR102864012B1
KR102864012B1 KR1020217019349A KR20217019349A KR102864012B1 KR 102864012 B1 KR102864012 B1 KR 102864012B1 KR 1020217019349 A KR1020217019349 A KR 1020217019349A KR 20217019349 A KR20217019349 A KR 20217019349A KR 102864012 B1 KR102864012 B1 KR 102864012B1
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KR
South Korea
Prior art keywords
esc
electrostatic chuck
inclined wall
radius
support surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020217019349A
Other languages
English (en)
Korean (ko)
Other versions
KR20210088723A (ko
Inventor
압둘 아지즈 카자
벤카타 샤라트 찬드라 파리미
사라 미셸 보벡
프라샨트 쿠마르 쿨쉬레쉬타
비나이 케이. 프라바카르
Original Assignee
어플라이드 머티어리얼스, 인코포레이티드
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Publication of KR20210088723A publication Critical patent/KR20210088723A/ko
Application granted granted Critical
Publication of KR102864012B1 publication Critical patent/KR102864012B1/ko
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Links

Classifications

    • H01L21/6833—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/15—Devices for holding work using magnetic or electric force acting directly on the work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H01J37/32642—Focus rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder
    • H01J37/32724—Temperature
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7611—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7614—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)
KR1020217019349A 2018-12-03 2019-11-07 척킹 및 아크 발생 성능이 개선된 정전 척 설계 Active KR102864012B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201862774644P 2018-12-03 2018-12-03
US62/774,644 2018-12-03
PCT/US2019/060314 WO2020117421A1 (en) 2018-12-03 2019-11-07 Electrostatic chuck design with improved chucking and arcing performance

Publications (2)

Publication Number Publication Date
KR20210088723A KR20210088723A (ko) 2021-07-14
KR102864012B1 true KR102864012B1 (ko) 2025-09-23

Family

ID=70849364

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020217019349A Active KR102864012B1 (ko) 2018-12-03 2019-11-07 척킹 및 아크 발생 성능이 개선된 정전 척 설계

Country Status (6)

Country Link
US (2) US11682574B2 (https=)
JP (1) JP7541005B2 (https=)
KR (1) KR102864012B1 (https=)
CN (4) CN213242483U (https=)
TW (3) TWI902496B (https=)
WO (1) WO2020117421A1 (https=)

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Publication number Priority date Publication date Assignee Title
JP7541005B2 (ja) 2018-12-03 2024-08-27 アプライド マテリアルズ インコーポレイテッド チャックとアーク放電に関する性能が改良された静電チャック設計
WO2020149972A1 (en) 2019-01-15 2020-07-23 Applied Materials, Inc. Pedestal for substrate processing chambers
WO2022235499A1 (en) * 2021-05-03 2022-11-10 Lam Research Corporation Wafer state detection
KR102744850B1 (ko) * 2022-08-10 2024-12-19 솔믹스 주식회사 포커스 링 및 이를 포함하는 플라즈마 식각장치

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JP2003229408A (ja) * 2002-02-05 2003-08-15 Tokyo Electron Ltd プラズマ処理装置
JP2009071210A (ja) * 2007-09-18 2009-04-02 Covalent Materials Tokuyama Corp サセプタおよびエピタキシャル成長装置
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Also Published As

Publication number Publication date
TWI902496B (zh) 2025-10-21
TW202027217A (zh) 2020-07-16
TWI870980B (zh) 2025-01-21
CN213242483U (zh) 2021-05-18
CN111261487A (zh) 2020-06-09
WO2020117421A1 (en) 2020-06-11
TW202507922A (zh) 2025-02-16
KR20210088723A (ko) 2021-07-14
US12211728B2 (en) 2025-01-28
US11682574B2 (en) 2023-06-20
CN210956592U (zh) 2020-07-07
US20200176296A1 (en) 2020-06-04
US20230298922A1 (en) 2023-09-21
TWI838431B (zh) 2024-04-11
CN116525400A (zh) 2023-08-01
TW202414674A (zh) 2024-04-01
CN111261487B (zh) 2023-06-27
JP7541005B2 (ja) 2024-08-27
JP2022509635A (ja) 2022-01-21

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