JP7541005B2 - チャックとアーク放電に関する性能が改良された静電チャック設計 - Google Patents

チャックとアーク放電に関する性能が改良された静電チャック設計 Download PDF

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JP7541005B2
JP7541005B2 JP2021529277A JP2021529277A JP7541005B2 JP 7541005 B2 JP7541005 B2 JP 7541005B2 JP 2021529277 A JP2021529277 A JP 2021529277A JP 2021529277 A JP2021529277 A JP 2021529277A JP 7541005 B2 JP7541005 B2 JP 7541005B2
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support
substrate support
radius
substrate
distance
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Japanese (ja)
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JP2022509635A5 (https=
JP2022509635A (ja
Inventor
アブドゥル アジズ カジャ，
ベンカタ シャラット チャンドラ パリミ，
サラ ミシェル ボベック，
パラシャント クマール クルシュレシャータ，
ビネイ ケー． プラバカール，
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Applied Materials Inc
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Applied Materials Inc
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/15—Devices for holding work using magnetic or electric force acting directly on the work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H01J37/32642—Focus rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder
    • H01J37/32724—Temperature
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7611—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7614—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)
JP2021529277A 2018-12-03 2019-11-07 チャックとアーク放電に関する性能が改良された静電チャック設計 Active JP7541005B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201862774644P 2018-12-03 2018-12-03
US62/774,644 2018-12-03
PCT/US2019/060314 WO2020117421A1 (en) 2018-12-03 2019-11-07 Electrostatic chuck design with improved chucking and arcing performance

Publications (3)

Publication Number Publication Date
JP2022509635A JP2022509635A (ja) 2022-01-21
JP2022509635A5 JP2022509635A5 (https=) 2022-11-16
JP7541005B2 true JP7541005B2 (ja) 2024-08-27

Family

ID=70849364

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021529277A Active JP7541005B2 (ja) 2018-12-03 2019-11-07 チャックとアーク放電に関する性能が改良された静電チャック設計

Country Status (6)

Country Link
US (2) US11682574B2 (https=)
JP (1) JP7541005B2 (https=)
KR (1) KR102864012B1 (https=)
CN (4) CN213242483U (https=)
TW (3) TWI902496B (https=)
WO (1) WO2020117421A1 (https=)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7541005B2 (ja) 2018-12-03 2024-08-27 アプライド マテリアルズ インコーポレイテッド チャックとアーク放電に関する性能が改良された静電チャック設計
WO2020149972A1 (en) 2019-01-15 2020-07-23 Applied Materials, Inc. Pedestal for substrate processing chambers
WO2022235499A1 (en) * 2021-05-03 2022-11-10 Lam Research Corporation Wafer state detection
KR102744850B1 (ko) * 2022-08-10 2024-12-19 솔믹스 주식회사 포커스 링 및 이를 포함하는 플라즈마 식각장치

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JP2003243366A (ja) 2001-12-13 2003-08-29 Tokyo Electron Ltd プラズマ処理装置
JP2003229408A (ja) 2002-02-05 2003-08-15 Tokyo Electron Ltd プラズマ処理装置
JP2004296553A (ja) 2003-03-25 2004-10-21 Ngk Insulators Ltd 半導体製造装置用部材
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Also Published As

Publication number Publication date
TWI902496B (zh) 2025-10-21
TW202027217A (zh) 2020-07-16
TWI870980B (zh) 2025-01-21
CN213242483U (zh) 2021-05-18
KR102864012B1 (ko) 2025-09-23
CN111261487A (zh) 2020-06-09
WO2020117421A1 (en) 2020-06-11
TW202507922A (zh) 2025-02-16
KR20210088723A (ko) 2021-07-14
US12211728B2 (en) 2025-01-28
US11682574B2 (en) 2023-06-20
CN210956592U (zh) 2020-07-07
US20200176296A1 (en) 2020-06-04
US20230298922A1 (en) 2023-09-21
TWI838431B (zh) 2024-04-11
CN116525400A (zh) 2023-08-01
TW202414674A (zh) 2024-04-01
CN111261487B (zh) 2023-06-27
JP2022509635A (ja) 2022-01-21

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