CN213242483U - 衬底支撑件 - Google Patents

衬底支撑件 Download PDF

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Publication number
CN213242483U
CN213242483U CN202021336306.1U CN202021336306U CN213242483U CN 213242483 U CN213242483 U CN 213242483U CN 202021336306 U CN202021336306 U CN 202021336306U CN 213242483 U CN213242483 U CN 213242483U
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CN
China
Prior art keywords
support
substrate
angled wall
radius
substrate support
Prior art date
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Active
Application number
CN202021336306.1U
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English (en)
Chinese (zh)
Inventor
A·A·哈贾
V·S·C·帕里米
S·M·博贝克
P·K·库尔施拉希萨
V·K·普拉巴卡尔
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Applied Materials Inc
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Applied Materials Inc
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Publication date
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Publication of CN213242483U publication Critical patent/CN213242483U/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H01J37/32642—Focus rings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/15—Devices for holding work using magnetic or electric force acting directly on the work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7611—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7614—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder
    • H01J37/32724—Temperature

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)
CN202021336306.1U 2018-12-03 2019-12-02 衬底支撑件 Active CN213242483U (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201862774644P 2018-12-03 2018-12-03
US62/774,644 2018-12-03
CN201922123241.6U CN210956592U (zh) 2018-12-03 2019-12-02 衬底支撑件

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201922123241.6U Division CN210956592U (zh) 2018-12-03 2019-12-02 衬底支撑件

Publications (1)

Publication Number Publication Date
CN213242483U true CN213242483U (zh) 2021-05-18

Family

ID=70849364

Family Applications (4)

Application Number Title Priority Date Filing Date
CN202021336306.1U Active CN213242483U (zh) 2018-12-03 2019-12-02 衬底支撑件
CN201922123241.6U Active CN210956592U (zh) 2018-12-03 2019-12-02 衬底支撑件
CN202310691393.4A Pending CN116525400A (zh) 2018-12-03 2019-12-02 具有改进的吸紧和电弧放电性能的静电吸盘设计
CN201911214538.1A Active CN111261487B (zh) 2018-12-03 2019-12-02 具有改进的吸紧和电弧放电性能的静电吸盘设计

Family Applications After (3)

Application Number Title Priority Date Filing Date
CN201922123241.6U Active CN210956592U (zh) 2018-12-03 2019-12-02 衬底支撑件
CN202310691393.4A Pending CN116525400A (zh) 2018-12-03 2019-12-02 具有改进的吸紧和电弧放电性能的静电吸盘设计
CN201911214538.1A Active CN111261487B (zh) 2018-12-03 2019-12-02 具有改进的吸紧和电弧放电性能的静电吸盘设计

Country Status (6)

Country Link
US (2) US11682574B2 (https=)
JP (1) JP7541005B2 (https=)
KR (1) KR102864012B1 (https=)
CN (4) CN213242483U (https=)
TW (3) TWI902496B (https=)
WO (1) WO2020117421A1 (https=)

Cited By (1)

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CN111261487A (zh) * 2018-12-03 2020-06-09 应用材料公司 具有改进的吸紧和电弧放电性能的静电吸盘设计

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111261487A (zh) * 2018-12-03 2020-06-09 应用材料公司 具有改进的吸紧和电弧放电性能的静电吸盘设计
US11682574B2 (en) 2018-12-03 2023-06-20 Applied Materials, Inc. Electrostatic chuck design with improved chucking and arcing performance
CN116525400A (zh) * 2018-12-03 2023-08-01 应用材料公司 具有改进的吸紧和电弧放电性能的静电吸盘设计
US12211728B2 (en) 2018-12-03 2025-01-28 Applied Materials, Inc. Electrostatic chuck design with improved chucking and arcing performance

Also Published As

Publication number Publication date
TWI902496B (zh) 2025-10-21
TW202027217A (zh) 2020-07-16
TWI870980B (zh) 2025-01-21
KR102864012B1 (ko) 2025-09-23
CN111261487A (zh) 2020-06-09
WO2020117421A1 (en) 2020-06-11
TW202507922A (zh) 2025-02-16
KR20210088723A (ko) 2021-07-14
US12211728B2 (en) 2025-01-28
US11682574B2 (en) 2023-06-20
CN210956592U (zh) 2020-07-07
US20200176296A1 (en) 2020-06-04
US20230298922A1 (en) 2023-09-21
TWI838431B (zh) 2024-04-11
CN116525400A (zh) 2023-08-01
TW202414674A (zh) 2024-04-01
CN111261487B (zh) 2023-06-27
JP7541005B2 (ja) 2024-08-27
JP2022509635A (ja) 2022-01-21

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