KR102688828B1 - 스템 - Google Patents

스템 Download PDF

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Publication number
KR102688828B1
KR102688828B1 KR1020190158791A KR20190158791A KR102688828B1 KR 102688828 B1 KR102688828 B1 KR 102688828B1 KR 1020190158791 A KR1020190158791 A KR 1020190158791A KR 20190158791 A KR20190158791 A KR 20190158791A KR 102688828 B1 KR102688828 B1 KR 102688828B1
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KR
South Korea
Prior art keywords
stem
fpc
cylindrical body
lead
frequency signal
Prior art date
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Active
Application number
KR1020190158791A
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English (en)
Korean (ko)
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KR20200071668A (ko
Inventor
다쿠미 이케다
야스유키 기무라
김한수
안해룡
Original Assignee
신꼬오덴기 고교 가부시키가이샤
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Publication of KR20200071668A publication Critical patent/KR20200071668A/ko
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Publication of KR102688828B1 publication Critical patent/KR102688828B1/ko
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H01L23/32—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W78/00—Detachable holders for supporting packaged chips in operation
    • H01L23/13—
    • H01L23/4985—
    • H01L23/50—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0243—Printed circuits associated with mounted high frequency components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/184—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components inserted in holes through the PCBs and wherein terminals of the components are connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistors by means of a mounting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/688—Flexible insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/10863—Adaptations of leads or holes for facilitating insertion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10962—Component not directly connected to the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Semiconductor Lasers (AREA)
KR1020190158791A 2018-12-11 2019-12-03 스템 Active KR102688828B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018231675A JP7240160B2 (ja) 2018-12-11 2018-12-11 ステム
JPJP-P-2018-231675 2018-12-11

Publications (2)

Publication Number Publication Date
KR20200071668A KR20200071668A (ko) 2020-06-19
KR102688828B1 true KR102688828B1 (ko) 2024-07-29

Family

ID=70972622

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020190158791A Active KR102688828B1 (ko) 2018-12-11 2019-12-03 스템

Country Status (5)

Country Link
US (1) US10945337B2 (https=)
JP (1) JP7240160B2 (https=)
KR (1) KR102688828B1 (https=)
CN (1) CN111312663B (https=)
TW (1) TWI845572B (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11894322B2 (en) 2018-05-29 2024-02-06 Analog Devices, Inc. Launch structures for radio frequency integrated device packages
US11424196B2 (en) 2018-06-01 2022-08-23 Analog Devices, Inc. Matching circuit for integrated circuit die
US11417615B2 (en) 2018-11-27 2022-08-16 Analog Devices, Inc. Transition circuitry for integrated circuit die
US11350537B2 (en) * 2019-05-21 2022-05-31 Analog Devices, Inc. Electrical feedthrough assembly
CN112234043B (zh) * 2020-09-02 2024-06-25 江苏盐芯微电子有限公司 集成电路封装结构及集成电路封装方法
JP7204065B2 (ja) 2020-11-24 2023-01-13 三菱電機株式会社 光モジュール
JP7552967B2 (ja) * 2020-12-08 2024-09-18 新光電気工業株式会社 半導体パッケージ用ステム
US11744021B2 (en) 2022-01-21 2023-08-29 Analog Devices, Inc. Electronic assembly

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070190847A1 (en) 2006-01-20 2007-08-16 Moriyasu Ichino Optical Module With a Flexible Printed Circuit Board to Be Electrically Connected with a Host Board
JP2009239113A (ja) * 2008-03-27 2009-10-15 Shinko Electric Ind Co Ltd 光半導体素子用パッケージ
WO2017090651A1 (ja) * 2015-11-27 2017-06-01 京セラ株式会社 電子部品搭載用パッケージおよび電子装置

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL181963C (nl) * 1979-06-26 1987-12-01 Philips Nv Halfgeleiderlaserinrichting.
US5223672A (en) * 1990-06-11 1993-06-29 Trw Inc. Hermetically sealed aluminum package for hybrid microcircuits
US6476464B1 (en) * 1999-02-16 2002-11-05 Ixion, Llc Low resistance hermetic lead structure
TW449948B (en) * 1999-06-29 2001-08-11 Rohm Co Ltd Semiconductor device
JP2005286305A (ja) * 2004-03-02 2005-10-13 Mitsubishi Electric Corp 光半導体装置
JP4756840B2 (ja) 2004-09-13 2011-08-24 三菱電機株式会社 キャンパッケージ型光半導体装置および光モジュール
CN100481442C (zh) * 2005-08-04 2009-04-22 恩益禧电子股份有限公司 带柔性基板的光组件
JP4772557B2 (ja) * 2006-03-30 2011-09-14 住友電工デバイス・イノベーション株式会社 電子部品、および電子部品用モジュール
US8723283B2 (en) * 2011-02-10 2014-05-13 Electronics And Telecommunications Research Institute Optical module
JP2012256692A (ja) * 2011-06-08 2012-12-27 Mitsubishi Electric Corp 光モジュール
CN103907249B (zh) * 2011-11-30 2015-02-25 松下电器产业株式会社 氮化物半导体发光装置
DE102013114547B4 (de) * 2013-01-18 2020-01-16 Schott Ag TO-Gehäuse
JP6614811B2 (ja) * 2015-05-29 2019-12-04 新光電気工業株式会社 半導体装置用ステム及び半導体装置
JP6654364B2 (ja) * 2015-06-12 2020-02-26 日本ルメンタム株式会社 光モジュール
WO2017077756A1 (ja) * 2015-11-05 2017-05-11 株式会社村田製作所 圧電発振器及び圧電発振デバイス

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070190847A1 (en) 2006-01-20 2007-08-16 Moriyasu Ichino Optical Module With a Flexible Printed Circuit Board to Be Electrically Connected with a Host Board
JP2009239113A (ja) * 2008-03-27 2009-10-15 Shinko Electric Ind Co Ltd 光半導体素子用パッケージ
WO2017090651A1 (ja) * 2015-11-27 2017-06-01 京セラ株式会社 電子部品搭載用パッケージおよび電子装置

Also Published As

Publication number Publication date
KR20200071668A (ko) 2020-06-19
CN111312663B (zh) 2025-01-10
JP2020096039A (ja) 2020-06-18
TWI845572B (zh) 2024-06-21
US20200187361A1 (en) 2020-06-11
TW202025418A (zh) 2020-07-01
CN111312663A (zh) 2020-06-19
US10945337B2 (en) 2021-03-09
JP7240160B2 (ja) 2023-03-15

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