KR102674916B1 - 기판 처리 장치, 공조 방법 및 기억 매체 - Google Patents

기판 처리 장치, 공조 방법 및 기억 매체 Download PDF

Info

Publication number
KR102674916B1
KR102674916B1 KR1020207029449A KR20207029449A KR102674916B1 KR 102674916 B1 KR102674916 B1 KR 102674916B1 KR 1020207029449 A KR1020207029449 A KR 1020207029449A KR 20207029449 A KR20207029449 A KR 20207029449A KR 102674916 B1 KR102674916 B1 KR 102674916B1
Authority
KR
South Korea
Prior art keywords
gas
duct
chambers
accommodation
air conditioning
Prior art date
Application number
KR1020207029449A
Other languages
English (en)
Korean (ko)
Other versions
KR20200136940A (ko
Inventor
마사히데 다도코로
Original Assignee
도쿄엘렉트론가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20200136940A publication Critical patent/KR20200136940A/ko
Application granted granted Critical
Publication of KR102674916B1 publication Critical patent/KR102674916B1/ko

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
    • F26B21/06—Controlling, e.g. regulating, parameters of gas supply
    • F26B21/10—Temperature; Pressure
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/67225—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one lithography chamber

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
  • Air Bags (AREA)
  • Drying Of Solid Materials (AREA)
KR1020207029449A 2018-03-26 2019-03-15 기판 처리 장치, 공조 방법 및 기억 매체 KR102674916B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018057924 2018-03-26
JPJP-P-2018-057924 2018-03-26
PCT/JP2019/010977 WO2019188453A1 (ja) 2018-03-26 2019-03-15 基板処理装置、空調方法及び記憶媒体

Publications (2)

Publication Number Publication Date
KR20200136940A KR20200136940A (ko) 2020-12-08
KR102674916B1 true KR102674916B1 (ko) 2024-06-12

Family

ID=68058810

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020207029449A KR102674916B1 (ko) 2018-03-26 2019-03-15 기판 처리 장치, 공조 방법 및 기억 매체

Country Status (5)

Country Link
JP (1) JP6986623B2 (ja)
KR (1) KR102674916B1 (ja)
CN (1) CN111868883A (ja)
TW (1) TWI788540B (ja)
WO (1) WO2019188453A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI739201B (zh) * 2019-11-08 2021-09-11 辛耘企業股份有限公司 基板濕處理裝置及基板清洗方法
CN111076498B (zh) * 2019-12-25 2021-06-11 广东利元亨智能装备股份有限公司 电芯的干燥方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000150335A (ja) * 1998-11-12 2000-05-30 Tokyo Electron Ltd 処理装置
JP2006024638A (ja) * 2004-07-06 2006-01-26 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP2010056545A (ja) * 2008-08-01 2010-03-11 Nikon Corp 露光方法及び装置、並びにデバイス製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3225344B2 (ja) * 1996-01-26 2001-11-05 東京エレクトロン株式会社 処理装置
JPH11135429A (ja) * 1997-08-29 1999-05-21 Nikon Corp 温度制御方法及び該方法を使用する露光装置
JP3552600B2 (ja) * 1998-07-13 2004-08-11 東京エレクトロン株式会社 基板処理装置
JP3888836B2 (ja) * 1999-05-25 2007-03-07 東京エレクトロン株式会社 レジスト塗布現像処理装置
JP5067432B2 (ja) * 2010-02-15 2012-11-07 東京エレクトロン株式会社 塗布、現像装置、現像方法及び記憶媒体
JP6503281B2 (ja) * 2015-11-13 2019-04-17 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000150335A (ja) * 1998-11-12 2000-05-30 Tokyo Electron Ltd 処理装置
JP2006024638A (ja) * 2004-07-06 2006-01-26 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP2010056545A (ja) * 2008-08-01 2010-03-11 Nikon Corp 露光方法及び装置、並びにデバイス製造方法

Also Published As

Publication number Publication date
CN111868883A (zh) 2020-10-30
WO2019188453A1 (ja) 2019-10-03
JP6986623B2 (ja) 2021-12-22
JPWO2019188453A1 (ja) 2021-04-01
TWI788540B (zh) 2023-01-01
KR20200136940A (ko) 2020-12-08
TW201941262A (zh) 2019-10-16

Similar Documents

Publication Publication Date Title
US8372480B2 (en) Coater/developer, method of coating and developing resist film, and computer readable storing medium
KR102674916B1 (ko) 기판 처리 장치, 공조 방법 및 기억 매체
US7379785B2 (en) Substrate processing system, coating/developing apparatus, and substrate processing apparatus
US6507770B2 (en) Substrate processing system and substrate processing method
KR100636009B1 (ko) 기판처리장치
CN100555562C (zh) 基片热处理的方法和装置
US7563043B2 (en) Coating/developing apparatus and substrate transfer method
JP2008166514A (ja) 温度制御方法、調整装置、温度調節器、プログラム、記録媒体および加熱処理装置
JPH0926176A (ja) 処理システムとこれを用いたデバイス生産方法
JP2845400B2 (ja) レジスト処理装置及び処理装置
KR100676545B1 (ko) 기판처리시스템 및 기판처리방법
US6338474B1 (en) Air feeder provided with by-pass bypassing cooling section, substrate processing apparatus including the same, and air supply method
JP2000188253A (ja) パタ―ン形成装置及び塗布、現像装置
KR20200042857A (ko) 기판 처리 장치, 기판 처리 방법, 및 기억 매체
JP2022188287A (ja) 基板処理装置、及び基板処理方法、及び記憶媒体
JP2000100683A (ja) 加熱処理方法及び加熱処理装置
KR20230029507A (ko) 기판 처리 장치 및 반도체 장치 제조 방법
KR101985764B1 (ko) 공조 장치 및 그것을 갖는 기판 처리 장치
JP2007335544A (ja) 基板処理装置
KR20210031615A (ko) 기판 처리 장치용 필터 장치 및 청정 공기 공급 방법
KR101985754B1 (ko) 공조 장치 및 그것을 갖는 기판 처리 장치
CN115719720A (zh) 基底处理设备
WO2023089682A1 (ja) 基板処理システム及び基板処理方法
KR20180118316A (ko) 포토레지스트를 균일하게 도포하는 방법 및 이에 사용되는 장치
TW202321836A (zh) 基板處理系統及基板處理方法

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant