KR102650422B1 - 연마 헤드 및 연마 처리 장치 - Google Patents

연마 헤드 및 연마 처리 장치 Download PDF

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Publication number
KR102650422B1
KR102650422B1 KR1020237030519A KR20237030519A KR102650422B1 KR 102650422 B1 KR102650422 B1 KR 102650422B1 KR 1020237030519 A KR1020237030519 A KR 1020237030519A KR 20237030519 A KR20237030519 A KR 20237030519A KR 102650422 B1 KR102650422 B1 KR 102650422B1
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KR
South Korea
Prior art keywords
pressure
polishing
adjustment means
polished
elastic body
Prior art date
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KR1020237030519A
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English (en)
Korean (ko)
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KR20230133402A (ko
Inventor
아키오 고무라
다카후미 구와노
하지메 도미자와
Original Assignee
미크로 기켄 가부시키가이샤
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Publication of KR20230133402A publication Critical patent/KR20230133402A/ko
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Publication of KR102650422B1 publication Critical patent/KR102650422B1/ko
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
    • H01L21/67092—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
KR1020237030519A 2021-03-17 2022-03-14 연마 헤드 및 연마 처리 장치 Active KR102650422B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2021-043860 2021-03-17
JP2021043860 2021-03-17
PCT/JP2022/011298 WO2022196631A1 (ja) 2021-03-17 2022-03-14 研磨ヘッド及び研磨処理装置

Publications (2)

Publication Number Publication Date
KR20230133402A KR20230133402A (ko) 2023-09-19
KR102650422B1 true KR102650422B1 (ko) 2024-03-22

Family

ID=83320439

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020237030519A Active KR102650422B1 (ko) 2021-03-17 2022-03-14 연마 헤드 및 연마 처리 장치

Country Status (6)

Country Link
US (1) US12240074B2 (https=)
JP (1) JP7296173B2 (https=)
KR (1) KR102650422B1 (https=)
CN (1) CN117083150B (https=)
TW (1) TWI847108B (https=)
WO (1) WO2022196631A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117103109A (zh) * 2023-09-14 2023-11-24 西安奕斯伟材料科技股份有限公司 一种抛光固定装置及系统
CN120533607B (zh) * 2025-06-18 2025-12-05 上海致领半导体科技发展有限公司 一种晶圆抛光头及抛光设备

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JP2003311607A (ja) 2002-04-16 2003-11-05 Applied Materials Inc キャリヤヘッドでの振動減衰
JP2003533359A (ja) 2000-05-12 2003-11-11 マルチプレーナーテクノロジーズ インコーポレーテッド 独立のリテーナリングと多領域圧力制御とを備えた空気圧ダイアフラムヘッドおよび該空気圧ダイアフラムヘッドを用いた方法
WO2006038259A1 (ja) 2004-09-30 2006-04-13 Renesas Technology Corp. 半導体装置の製造方法
JP2012056011A (ja) 2010-09-08 2012-03-22 Ebara Corp 研磨装置および方法
JP2016165792A (ja) 2015-03-05 2016-09-15 ミクロ技研株式会社 研磨ヘッド及び研磨処理装置
JP2018171670A (ja) 2017-03-31 2018-11-08 ミクロ技研株式会社 研磨ヘッド及び研磨処理装置

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US5795215A (en) * 1995-06-09 1998-08-18 Applied Materials, Inc. Method and apparatus for using a retaining ring to control the edge effect
SG82058A1 (en) * 1998-12-30 2001-07-24 Applied Materials Inc Carrier head with controllable pressure and loading area for chemical mechanical polishing
TW579319B (en) * 2000-05-12 2004-03-11 Multi Planar Technologies Inc System and method for CMP head having multi-pressure annular zone subcarrier material removal control
JP2002187060A (ja) * 2000-10-11 2002-07-02 Ebara Corp 基板保持装置、ポリッシング装置、及び研磨方法
US6769973B2 (en) * 2001-05-31 2004-08-03 Samsung Electronics Co., Ltd. Polishing head of chemical mechanical polishing apparatus and polishing method using the same
US20030124963A1 (en) * 2001-12-27 2003-07-03 Applied Materials, Inc. Carrier head with a non-stick membrane
JP2004034217A (ja) 2002-07-02 2004-02-05 Tamagawa Machinery Co Ltd 研磨機および研磨方法
CN100400236C (zh) * 2002-09-27 2008-07-09 小松电子金属股份有限公司 一种研磨装置和晶片制造方法
US7033252B2 (en) * 2004-03-05 2006-04-25 Strasbaugh Wafer carrier with pressurized membrane and retaining ring actuator
US7364496B2 (en) * 2006-03-03 2008-04-29 Inopla Inc. Polishing head for polishing semiconductor wafers
KR20070057867A (ko) * 2007-03-26 2007-06-07 가부시끼가이샤 르네사스 테크놀로지 반도체장치의 제조방법
WO2013136656A1 (ja) 2012-03-15 2013-09-19 東京エレクトロン株式会社 成膜装置
JP5210444B1 (ja) 2012-07-20 2013-06-12 ミクロ技研株式会社 研磨ヘッド及び研磨処理装置
CN203092329U (zh) * 2013-02-07 2013-07-31 中芯国际集成电路制造(北京)有限公司 一种用于化学机械抛光的抛光头
JP2016078159A (ja) * 2014-10-15 2016-05-16 ミクロ技研株式会社 研磨ヘッド及び研磨処理装置
JP2017064894A (ja) * 2015-10-02 2017-04-06 ミクロ技研株式会社 研磨ヘッド及び研磨処理装置
JP6380333B2 (ja) * 2015-10-30 2018-08-29 株式会社Sumco ウェーハ研磨装置およびこれに用いる研磨ヘッド
JP6329662B1 (ja) 2017-03-29 2018-05-23 三菱ロジスネクスト株式会社 荷役作業割当システム
TWI676525B (zh) 2017-06-09 2019-11-11 林志菁 用於研磨頭的彈性膜
KR102052878B1 (ko) * 2017-12-01 2019-12-10 주식회사 케이씨텍 화학 기계적 연마 장치의 캐리어 헤드 및 이에 사용되는 멤브레인
CN107953242A (zh) * 2017-12-22 2018-04-24 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） 抛光修整装置及抛光系统
JP7125839B2 (ja) 2017-12-28 2022-08-25 株式会社東京精密 Ｃｍｐ装置
JP7003838B2 (ja) * 2018-05-17 2022-01-21 株式会社Sumco 研磨ヘッド及びこれを用いたウェーハ研磨装置及び研磨方法
WO2022187249A1 (en) * 2021-03-04 2022-09-09 Applied Materials, Inc. Polishing carrier head with floating edge control

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003533359A (ja) 2000-05-12 2003-11-11 マルチプレーナーテクノロジーズ インコーポレーテッド 独立のリテーナリングと多領域圧力制御とを備えた空気圧ダイアフラムヘッドおよび該空気圧ダイアフラムヘッドを用いた方法
JP2003311607A (ja) 2002-04-16 2003-11-05 Applied Materials Inc キャリヤヘッドでの振動減衰
WO2006038259A1 (ja) 2004-09-30 2006-04-13 Renesas Technology Corp. 半導体装置の製造方法
JP2012056011A (ja) 2010-09-08 2012-03-22 Ebara Corp 研磨装置および方法
JP2016165792A (ja) 2015-03-05 2016-09-15 ミクロ技研株式会社 研磨ヘッド及び研磨処理装置
JP2018171670A (ja) 2017-03-31 2018-11-08 ミクロ技研株式会社 研磨ヘッド及び研磨処理装置

Also Published As

Publication number Publication date
US12240074B2 (en) 2025-03-04
TW202243804A (zh) 2022-11-16
TWI847108B (zh) 2024-07-01
US20240082983A1 (en) 2024-03-14
CN117083150B (zh) 2025-01-07
KR20230133402A (ko) 2023-09-19
JP7296173B2 (ja) 2023-06-22
WO2022196631A1 (ja) 2022-09-22
JPWO2022196631A1 (https=) 2022-09-22
CN117083150A (zh) 2023-11-17

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