CN117083150B - 抛光头和抛光处理装置 - Google Patents

抛光头和抛光处理装置 Download PDF

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Publication number
CN117083150B
CN117083150B CN202280021212.0A CN202280021212A CN117083150B CN 117083150 B CN117083150 B CN 117083150B CN 202280021212 A CN202280021212 A CN 202280021212A CN 117083150 B CN117083150 B CN 117083150B
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CN
China
Prior art keywords
pressure
polishing
regulating device
pressure regulating
annular
Prior art date
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Active
Application number
CN202280021212.0A
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English (en)
Chinese (zh)
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CN117083150A (zh
Inventor
小村明夫
桑野贵史
冨泽肇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ultra Micro Technology Research Co ltd
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Ultra Micro Technology Research Co ltd
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Publication of CN117083150A publication Critical patent/CN117083150A/zh
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
CN202280021212.0A 2021-03-17 2022-03-14 抛光头和抛光处理装置 Active CN117083150B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021043860 2021-03-17
JP2021-043860 2021-03-17
PCT/JP2022/011298 WO2022196631A1 (ja) 2021-03-17 2022-03-14 研磨ヘッド及び研磨処理装置

Publications (2)

Publication Number Publication Date
CN117083150A CN117083150A (zh) 2023-11-17
CN117083150B true CN117083150B (zh) 2025-01-07

Family

ID=83320439

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280021212.0A Active CN117083150B (zh) 2021-03-17 2022-03-14 抛光头和抛光处理装置

Country Status (6)

Country Link
US (1) US12240074B2 (https=)
JP (1) JP7296173B2 (https=)
KR (1) KR102650422B1 (https=)
CN (1) CN117083150B (https=)
TW (1) TWI847108B (https=)
WO (1) WO2022196631A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117103109A (zh) * 2023-09-14 2023-11-24 西安奕斯伟材料科技股份有限公司 一种抛光固定装置及系统
CN120533607B (zh) * 2025-06-18 2025-12-05 上海致领半导体科技发展有限公司 一种晶圆抛光头及抛光设备

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107953242A (zh) * 2017-12-22 2018-04-24 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） 抛光修整装置及抛光系统
CN108369903A (zh) * 2015-10-30 2018-08-03 胜高股份有限公司 晶圆抛光装置及用于该装置的抛光头

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US5795215A (en) * 1995-06-09 1998-08-18 Applied Materials, Inc. Method and apparatus for using a retaining ring to control the edge effect
SG82058A1 (en) * 1998-12-30 2001-07-24 Applied Materials Inc Carrier head with controllable pressure and loading area for chemical mechanical polishing
CN100433269C (zh) 2000-05-12 2008-11-12 多平面技术公司 抛光装置以及与其一起使用的基片托架
TW579319B (en) * 2000-05-12 2004-03-11 Multi Planar Technologies Inc System and method for CMP head having multi-pressure annular zone subcarrier material removal control
JP2002187060A (ja) * 2000-10-11 2002-07-02 Ebara Corp 基板保持装置、ポリッシング装置、及び研磨方法
US6769973B2 (en) * 2001-05-31 2004-08-03 Samsung Electronics Co., Ltd. Polishing head of chemical mechanical polishing apparatus and polishing method using the same
US20030124963A1 (en) * 2001-12-27 2003-07-03 Applied Materials, Inc. Carrier head with a non-stick membrane
TWI301642B (en) 2002-04-16 2008-10-01 Applied Materials Inc Vibration damping in a carrier head
JP2004034217A (ja) 2002-07-02 2004-02-05 Tamagawa Machinery Co Ltd 研磨機および研磨方法
CN100400236C (zh) * 2002-09-27 2008-07-09 小松电子金属股份有限公司 一种研磨装置和晶片制造方法
US7033252B2 (en) * 2004-03-05 2006-04-25 Strasbaugh Wafer carrier with pressurized membrane and retaining ring actuator
US20080076253A1 (en) 2004-09-30 2008-03-27 Hiroshi Fukada Adhesive Sheet,Semiconductor Device,and Process for Producing Semiconductor Device
US7364496B2 (en) * 2006-03-03 2008-04-29 Inopla Inc. Polishing head for polishing semiconductor wafers
KR20070057867A (ko) * 2007-03-26 2007-06-07 가부시끼가이샤 르네사스 테크놀로지 반도체장치의 제조방법
JP5552401B2 (ja) 2010-09-08 2014-07-16 株式会社荏原製作所 研磨装置および方法
WO2013136656A1 (ja) 2012-03-15 2013-09-19 東京エレクトロン株式会社 成膜装置
JP5210444B1 (ja) 2012-07-20 2013-06-12 ミクロ技研株式会社 研磨ヘッド及び研磨処理装置
CN203092329U (zh) * 2013-02-07 2013-07-31 中芯国际集成电路制造(北京)有限公司 一种用于化学机械抛光的抛光头
JP2016078159A (ja) * 2014-10-15 2016-05-16 ミクロ技研株式会社 研磨ヘッド及び研磨処理装置
JP2016165792A (ja) 2015-03-05 2016-09-15 ミクロ技研株式会社 研磨ヘッド及び研磨処理装置
JP2017064894A (ja) * 2015-10-02 2017-04-06 ミクロ技研株式会社 研磨ヘッド及び研磨処理装置
JP6329662B1 (ja) 2017-03-29 2018-05-23 三菱ロジスネクスト株式会社 荷役作業割当システム
JP2018171670A (ja) 2017-03-31 2018-11-08 ミクロ技研株式会社 研磨ヘッド及び研磨処理装置
TWI676525B (zh) 2017-06-09 2019-11-11 林志菁 用於研磨頭的彈性膜
KR102052878B1 (ko) * 2017-12-01 2019-12-10 주식회사 케이씨텍 화학 기계적 연마 장치의 캐리어 헤드 및 이에 사용되는 멤브레인
JP7125839B2 (ja) 2017-12-28 2022-08-25 株式会社東京精密 Ｃｍｐ装置
JP7003838B2 (ja) * 2018-05-17 2022-01-21 株式会社Sumco 研磨ヘッド及びこれを用いたウェーハ研磨装置及び研磨方法
WO2022187249A1 (en) * 2021-03-04 2022-09-09 Applied Materials, Inc. Polishing carrier head with floating edge control

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CN108369903A (zh) * 2015-10-30 2018-08-03 胜高股份有限公司 晶圆抛光装置及用于该装置的抛光头
CN107953242A (zh) * 2017-12-22 2018-04-24 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） 抛光修整装置及抛光系统

Also Published As

Publication number Publication date
US12240074B2 (en) 2025-03-04
TW202243804A (zh) 2022-11-16
TWI847108B (zh) 2024-07-01
US20240082983A1 (en) 2024-03-14
KR20230133402A (ko) 2023-09-19
JP7296173B2 (ja) 2023-06-22
WO2022196631A1 (ja) 2022-09-22
JPWO2022196631A1 (https=) 2022-09-22
CN117083150A (zh) 2023-11-17
KR102650422B1 (ko) 2024-03-22

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