TWI847108B - 研磨頭、研磨處理方法及研磨處理裝置 - Google Patents

研磨頭、研磨處理方法及研磨處理裝置 Download PDF

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Publication number
TWI847108B
TWI847108B TW111109420A TW111109420A TWI847108B TW I847108 B TWI847108 B TW I847108B TW 111109420 A TW111109420 A TW 111109420A TW 111109420 A TW111109420 A TW 111109420A TW I847108 B TWI847108 B TW I847108B
Authority
TW
Taiwan
Prior art keywords
pressure
aforementioned
elastic body
back side
polishing
Prior art date
Application number
TW111109420A
Other languages
English (en)
Chinese (zh)
Other versions
TW202243804A (zh
Inventor
小村明夫
桑野貴史
冨澤肇
Original Assignee
日商日本超微細工程有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商日本超微細工程有限公司 filed Critical 日商日本超微細工程有限公司
Publication of TW202243804A publication Critical patent/TW202243804A/zh
Application granted granted Critical
Publication of TWI847108B publication Critical patent/TWI847108B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW111109420A 2021-03-17 2022-03-15 研磨頭、研磨處理方法及研磨處理裝置 TWI847108B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021043860 2021-03-17
JP2021-043860 2021-03-17

Publications (2)

Publication Number Publication Date
TW202243804A TW202243804A (zh) 2022-11-16
TWI847108B true TWI847108B (zh) 2024-07-01

Family

ID=83320439

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111109420A TWI847108B (zh) 2021-03-17 2022-03-15 研磨頭、研磨處理方法及研磨處理裝置

Country Status (6)

Country Link
US (1) US12240074B2 (https=)
JP (1) JP7296173B2 (https=)
KR (1) KR102650422B1 (https=)
CN (1) CN117083150B (https=)
TW (1) TWI847108B (https=)
WO (1) WO2022196631A1 (https=)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117103109A (zh) * 2023-09-14 2023-11-24 西安奕斯伟材料科技股份有限公司 一种抛光固定装置及系统
CN120533607B (zh) * 2025-06-18 2025-12-05 上海致领半导体科技发展有限公司 一种晶圆抛光头及抛光设备

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JP2002187060A (ja) * 2000-10-11 2002-07-02 Ebara Corp 基板保持装置、ポリッシング装置、及び研磨方法
JP2003311607A (ja) * 2002-04-16 2003-11-05 Applied Materials Inc キャリヤヘッドでの振動減衰
JP2016165792A (ja) * 2015-03-05 2016-09-15 ミクロ技研株式会社 研磨ヘッド及び研磨処理装置
JP2018171670A (ja) * 2017-03-31 2018-11-08 ミクロ技研株式会社 研磨ヘッド及び研磨処理装置
TWI676525B (zh) * 2017-06-09 2019-11-11 林志菁 用於研磨頭的彈性膜

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SG82058A1 (en) * 1998-12-30 2001-07-24 Applied Materials Inc Carrier head with controllable pressure and loading area for chemical mechanical polishing
CN100433269C (zh) 2000-05-12 2008-11-12 多平面技术公司 抛光装置以及与其一起使用的基片托架
TW579319B (en) * 2000-05-12 2004-03-11 Multi Planar Technologies Inc System and method for CMP head having multi-pressure annular zone subcarrier material removal control
US6769973B2 (en) * 2001-05-31 2004-08-03 Samsung Electronics Co., Ltd. Polishing head of chemical mechanical polishing apparatus and polishing method using the same
US20030124963A1 (en) * 2001-12-27 2003-07-03 Applied Materials, Inc. Carrier head with a non-stick membrane
JP2004034217A (ja) 2002-07-02 2004-02-05 Tamagawa Machinery Co Ltd 研磨機および研磨方法
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US7033252B2 (en) * 2004-03-05 2006-04-25 Strasbaugh Wafer carrier with pressurized membrane and retaining ring actuator
US20080076253A1 (en) 2004-09-30 2008-03-27 Hiroshi Fukada Adhesive Sheet,Semiconductor Device,and Process for Producing Semiconductor Device
US7364496B2 (en) * 2006-03-03 2008-04-29 Inopla Inc. Polishing head for polishing semiconductor wafers
KR20070057867A (ko) * 2007-03-26 2007-06-07 가부시끼가이샤 르네사스 테크놀로지 반도체장치의 제조방법
JP5552401B2 (ja) 2010-09-08 2014-07-16 株式会社荏原製作所 研磨装置および方法
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Publication number Priority date Publication date Assignee Title
JP2002187060A (ja) * 2000-10-11 2002-07-02 Ebara Corp 基板保持装置、ポリッシング装置、及び研磨方法
JP2003311607A (ja) * 2002-04-16 2003-11-05 Applied Materials Inc キャリヤヘッドでの振動減衰
JP2016165792A (ja) * 2015-03-05 2016-09-15 ミクロ技研株式会社 研磨ヘッド及び研磨処理装置
JP2018171670A (ja) * 2017-03-31 2018-11-08 ミクロ技研株式会社 研磨ヘッド及び研磨処理装置
TWI676525B (zh) * 2017-06-09 2019-11-11 林志菁 用於研磨頭的彈性膜

Also Published As

Publication number Publication date
US12240074B2 (en) 2025-03-04
TW202243804A (zh) 2022-11-16
US20240082983A1 (en) 2024-03-14
CN117083150B (zh) 2025-01-07
KR20230133402A (ko) 2023-09-19
JP7296173B2 (ja) 2023-06-22
WO2022196631A1 (ja) 2022-09-22
JPWO2022196631A1 (https=) 2022-09-22
CN117083150A (zh) 2023-11-17
KR102650422B1 (ko) 2024-03-22

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