KR102638814B1 - 기판 처리 방법 및 기판 처리 장치 - Google Patents

기판 처리 방법 및 기판 처리 장치 Download PDF

Info

Publication number
KR102638814B1
KR102638814B1 KR1020217033017A KR20217033017A KR102638814B1 KR 102638814 B1 KR102638814 B1 KR 102638814B1 KR 1020217033017 A KR1020217033017 A KR 1020217033017A KR 20217033017 A KR20217033017 A KR 20217033017A KR 102638814 B1 KR102638814 B1 KR 102638814B1
Authority
KR
South Korea
Prior art keywords
liquid
substrate
film
rinse
nozzle
Prior art date
Application number
KR1020217033017A
Other languages
English (en)
Korean (ko)
Other versions
KR20210137182A (ko
Inventor
세이 네고로
겐지 고바야시
마나부 오쿠타니
히로시 아베
Original Assignee
가부시키가이샤 스크린 홀딩스
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 스크린 홀딩스 filed Critical 가부시키가이샤 스크린 홀딩스
Publication of KR20210137182A publication Critical patent/KR20210137182A/ko
Application granted granted Critical
Publication of KR102638814B1 publication Critical patent/KR102638814B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
KR1020217033017A 2019-04-18 2020-04-07 기판 처리 방법 및 기판 처리 장치 KR102638814B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2019-079465 2019-04-18
JP2019079465A JP7208091B2 (ja) 2019-04-18 2019-04-18 基板処理方法および基板処理装置
PCT/JP2020/015689 WO2020213481A1 (ja) 2019-04-18 2020-04-07 基板処理方法および基板処理装置

Publications (2)

Publication Number Publication Date
KR20210137182A KR20210137182A (ko) 2021-11-17
KR102638814B1 true KR102638814B1 (ko) 2024-02-20

Family

ID=72837785

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020217033017A KR102638814B1 (ko) 2019-04-18 2020-04-07 기판 처리 방법 및 기판 처리 장치

Country Status (5)

Country Link
JP (1) JP7208091B2 (ja)
KR (1) KR102638814B1 (ja)
CN (1) CN113728416A (ja)
TW (1) TWI799695B (ja)
WO (1) WO2020213481A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7301662B2 (ja) 2019-07-29 2023-07-03 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP2022178469A (ja) * 2021-05-20 2022-12-02 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010050143A (ja) * 2008-08-19 2010-03-04 Dainippon Screen Mfg Co Ltd 基板処理方法および基板処理装置
JP2017117954A (ja) 2015-12-24 2017-06-29 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP2018026402A (ja) * 2016-08-08 2018-02-15 東京エレクトロン株式会社 液処理方法、基板処理装置及び記憶媒体
JP2018164058A (ja) 2017-03-27 2018-10-18 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4767767B2 (ja) * 2006-06-19 2011-09-07 大日本スクリーン製造株式会社 基板処理方法および基板処理装置
JP4763563B2 (ja) * 2006-09-20 2011-08-31 大日本スクリーン製造株式会社 基板処理方法
JP5043406B2 (ja) 2006-11-21 2012-10-10 大日本スクリーン製造株式会社 基板乾燥方法および基板乾燥装置
JP6521242B2 (ja) * 2015-06-16 2019-05-29 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
US10546762B2 (en) * 2016-11-18 2020-01-28 Applied Materials, Inc. Drying high aspect ratio features

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010050143A (ja) * 2008-08-19 2010-03-04 Dainippon Screen Mfg Co Ltd 基板処理方法および基板処理装置
JP2017117954A (ja) 2015-12-24 2017-06-29 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP2018026402A (ja) * 2016-08-08 2018-02-15 東京エレクトロン株式会社 液処理方法、基板処理装置及び記憶媒体
JP2018164058A (ja) 2017-03-27 2018-10-18 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置

Also Published As

Publication number Publication date
WO2020213481A1 (ja) 2020-10-22
JP2020178046A (ja) 2020-10-29
CN113728416A (zh) 2021-11-30
TWI799695B (zh) 2023-04-21
TW202102314A (zh) 2021-01-16
KR20210137182A (ko) 2021-11-17
JP7208091B2 (ja) 2023-01-18

Similar Documents

Publication Publication Date Title
KR102356766B1 (ko) 기판 처리 방법, 기판 처리 장치, 및 건조 전처리액
JP7100564B2 (ja) 基板乾燥方法および基板処理装置
KR102611130B1 (ko) 승화성 물질 함유액의 제조 방법, 기판 건조 방법, 및 기판 처리 장치
KR102301798B1 (ko) 기판 처리 방법 및 기판 처리 장치
KR102638814B1 (ko) 기판 처리 방법 및 기판 처리 장치
KR102273984B1 (ko) 기판 처리 방법 및 기판 처리 장치
CN110634769A (zh) 衬底处理方法、衬底处理装置及干燥前处理液
TWI708339B (zh) 基板處理方法及基板處理裝置
KR20180109718A (ko) 기판 처리 방법 및 기판 처리 장치
WO2020166136A1 (ja) 基板乾燥方法および基板処理装置
US11524314B2 (en) Substrate processing method and substrate processing device
TWI753816B (zh) 基板處理方法
JP7511422B2 (ja) 基板処理方法および基板処理装置
JP7314373B2 (ja) 基板処理方法および基板処理装置
JP7286534B2 (ja) 基板処理方法および基板処理装置

Legal Events

Date Code Title Description
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant