CN113728416A - 衬底处理方法及衬底处理装置 - Google Patents

衬底处理方法及衬底处理装置 Download PDF

Info

Publication number
CN113728416A
CN113728416A CN202080028876.0A CN202080028876A CN113728416A CN 113728416 A CN113728416 A CN 113728416A CN 202080028876 A CN202080028876 A CN 202080028876A CN 113728416 A CN113728416 A CN 113728416A
Authority
CN
China
Prior art keywords
liquid
substrate
nozzle
liquid film
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202080028876.0A
Other languages
English (en)
Chinese (zh)
Inventor
根来世
小林健司
奥谷学
阿部博史
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Screen Holdings Co Ltd
Original Assignee
Screen Holdings Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Screen Holdings Co Ltd filed Critical Screen Holdings Co Ltd
Publication of CN113728416A publication Critical patent/CN113728416A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
CN202080028876.0A 2019-04-18 2020-04-07 衬底处理方法及衬底处理装置 Pending CN113728416A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019-079465 2019-04-18
JP2019079465A JP7208091B2 (ja) 2019-04-18 2019-04-18 基板処理方法および基板処理装置
PCT/JP2020/015689 WO2020213481A1 (ja) 2019-04-18 2020-04-07 基板処理方法および基板処理装置

Publications (1)

Publication Number Publication Date
CN113728416A true CN113728416A (zh) 2021-11-30

Family

ID=72837785

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080028876.0A Pending CN113728416A (zh) 2019-04-18 2020-04-07 衬底处理方法及衬底处理装置

Country Status (5)

Country Link
JP (1) JP7208091B2 (ja)
KR (1) KR102638814B1 (ja)
CN (1) CN113728416A (ja)
TW (1) TWI799695B (ja)
WO (1) WO2020213481A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7301662B2 (ja) 2019-07-29 2023-07-03 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP2022178469A (ja) * 2021-05-20 2022-12-02 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010050143A (ja) * 2008-08-19 2010-03-04 Dainippon Screen Mfg Co Ltd 基板処理方法および基板処理装置
JP2018026402A (ja) * 2016-08-08 2018-02-15 東京エレクトロン株式会社 液処理方法、基板処理装置及び記憶媒体

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4767767B2 (ja) * 2006-06-19 2011-09-07 大日本スクリーン製造株式会社 基板処理方法および基板処理装置
JP4763563B2 (ja) * 2006-09-20 2011-08-31 大日本スクリーン製造株式会社 基板処理方法
JP5043406B2 (ja) 2006-11-21 2012-10-10 大日本スクリーン製造株式会社 基板乾燥方法および基板乾燥装置
JP6521242B2 (ja) * 2015-06-16 2019-05-29 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP6588819B2 (ja) * 2015-12-24 2019-10-09 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
US10546762B2 (en) * 2016-11-18 2020-01-28 Applied Materials, Inc. Drying high aspect ratio features
JP6818607B2 (ja) * 2017-03-27 2021-01-20 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010050143A (ja) * 2008-08-19 2010-03-04 Dainippon Screen Mfg Co Ltd 基板処理方法および基板処理装置
JP2018026402A (ja) * 2016-08-08 2018-02-15 東京エレクトロン株式会社 液処理方法、基板処理装置及び記憶媒体

Also Published As

Publication number Publication date
JP2020178046A (ja) 2020-10-29
TWI799695B (zh) 2023-04-21
WO2020213481A1 (ja) 2020-10-22
TW202102314A (zh) 2021-01-16
KR102638814B1 (ko) 2024-02-20
JP7208091B2 (ja) 2023-01-18
KR20210137182A (ko) 2021-11-17

Similar Documents

Publication Publication Date Title
JP6670674B2 (ja) 基板処理装置および基板処理方法
CN107871691B (zh) 基板处理方法和基板处理装置
KR102301798B1 (ko) 기판 처리 방법 및 기판 처리 장치
CN111180360A (zh) 基板干燥方法及基板处理装置
CN110660641B (zh) 衬底处理方法及衬底处理装置
KR102476555B1 (ko) 기판 처리 방법 및 기판 처리 장치
CN113874986A (zh) 含有升华性物质的液体的制造方法、基板干燥方法及基板处理装置
CN113053728A (zh) 基板处理方法以及基板处理装置
CN110634769A (zh) 衬底处理方法、衬底处理装置及干燥前处理液
TWI708339B (zh) 基板處理方法及基板處理裝置
CN113728416A (zh) 衬底处理方法及衬底处理装置
CN112309903B (zh) 基板处理方法及基板处理装置
CN108666237B (zh) 基板处理方法及基板处理装置
TW202019564A (zh) 基板處理方法及基板處理裝置
KR102504972B1 (ko) 기판 처리 방법 및 기판 처리 장치
JP2021108348A (ja) 基板処理方法および基板処理装置

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination