TWI799695B - 基板處理方法以及基板處理裝置 - Google Patents

基板處理方法以及基板處理裝置 Download PDF

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Publication number
TWI799695B
TWI799695B TW109112893A TW109112893A TWI799695B TW I799695 B TWI799695 B TW I799695B TW 109112893 A TW109112893 A TW 109112893A TW 109112893 A TW109112893 A TW 109112893A TW I799695 B TWI799695 B TW I799695B
Authority
TW
Taiwan
Prior art keywords
substrate processing
processing device
processing method
substrate
processing
Prior art date
Application number
TW109112893A
Other languages
English (en)
Chinese (zh)
Other versions
TW202102314A (zh
Inventor
根來世
小林健司
奥谷学
阿部博史
Original Assignee
日商斯庫林集團股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商斯庫林集團股份有限公司 filed Critical 日商斯庫林集團股份有限公司
Publication of TW202102314A publication Critical patent/TW202102314A/zh
Application granted granted Critical
Publication of TWI799695B publication Critical patent/TWI799695B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
TW109112893A 2019-04-18 2020-04-17 基板處理方法以及基板處理裝置 TWI799695B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-079465 2019-04-18
JP2019079465A JP7208091B2 (ja) 2019-04-18 2019-04-18 基板処理方法および基板処理装置

Publications (2)

Publication Number Publication Date
TW202102314A TW202102314A (zh) 2021-01-16
TWI799695B true TWI799695B (zh) 2023-04-21

Family

ID=72837785

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109112893A TWI799695B (zh) 2019-04-18 2020-04-17 基板處理方法以及基板處理裝置

Country Status (5)

Country Link
JP (1) JP7208091B2 (ja)
KR (1) KR102638814B1 (ja)
CN (1) CN113728416A (ja)
TW (1) TWI799695B (ja)
WO (1) WO2020213481A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7301662B2 (ja) 2019-07-29 2023-07-03 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP2022178469A (ja) * 2021-05-20 2022-12-02 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200823979A (en) * 2006-09-20 2008-06-01 Dainippon Screen Mfg Substrate treatment apparatus and substrate treatment method
CN100490060C (zh) * 2006-06-19 2009-05-20 大日本网目版制造株式会社 基板处理方法以及基板处理装置
JP2010050143A (ja) * 2008-08-19 2010-03-04 Dainippon Screen Mfg Co Ltd 基板処理方法および基板処理装置
JP2017117954A (ja) * 2015-12-24 2017-06-29 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
TW201806010A (zh) * 2016-08-08 2018-02-16 日商東京威力科創股份有限公司 液體處理方法、基板處理裝置及記錄媒體
TW201820396A (zh) * 2016-11-18 2018-06-01 美商應用材料股份有限公司 乾燥高深寬比特徵
TWI626710B (zh) * 2015-06-16 2018-06-11 思可林集團股份有限公司 基板處理方法及基板處理裝置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5043406B2 (ja) 2006-11-21 2012-10-10 大日本スクリーン製造株式会社 基板乾燥方法および基板乾燥装置
JP6818607B2 (ja) * 2017-03-27 2021-01-20 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100490060C (zh) * 2006-06-19 2009-05-20 大日本网目版制造株式会社 基板处理方法以及基板处理装置
TW200823979A (en) * 2006-09-20 2008-06-01 Dainippon Screen Mfg Substrate treatment apparatus and substrate treatment method
JP2010050143A (ja) * 2008-08-19 2010-03-04 Dainippon Screen Mfg Co Ltd 基板処理方法および基板処理装置
TWI626710B (zh) * 2015-06-16 2018-06-11 思可林集團股份有限公司 基板處理方法及基板處理裝置
JP2017117954A (ja) * 2015-12-24 2017-06-29 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
TW201909248A (zh) * 2015-12-24 2019-03-01 日商斯庫林集團股份有限公司 基板處理裝置及基板處理方法
TW201806010A (zh) * 2016-08-08 2018-02-16 日商東京威力科創股份有限公司 液體處理方法、基板處理裝置及記錄媒體
TW201820396A (zh) * 2016-11-18 2018-06-01 美商應用材料股份有限公司 乾燥高深寬比特徵

Also Published As

Publication number Publication date
JP2020178046A (ja) 2020-10-29
WO2020213481A1 (ja) 2020-10-22
TW202102314A (zh) 2021-01-16
KR102638814B1 (ko) 2024-02-20
CN113728416A (zh) 2021-11-30
JP7208091B2 (ja) 2023-01-18
KR20210137182A (ko) 2021-11-17

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