TWI799797B - 基板處理方法及基板處理裝置 - Google Patents

基板處理方法及基板處理裝置 Download PDF

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Publication number
TWI799797B
TWI799797B TW110106604A TW110106604A TWI799797B TW I799797 B TWI799797 B TW I799797B TW 110106604 A TW110106604 A TW 110106604A TW 110106604 A TW110106604 A TW 110106604A TW I799797 B TWI799797 B TW I799797B
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TW
Taiwan
Prior art keywords
substrate processing
processing device
processing method
substrate
processing
Prior art date
Application number
TW110106604A
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English (en)
Other versions
TW202145410A (zh
Inventor
秋山勝哉
吉田幸史
Original Assignee
日商斯庫林集團股份有限公司
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Publication of TW202145410A publication Critical patent/TW202145410A/zh
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Publication of TWI799797B publication Critical patent/TWI799797B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
TW110106604A 2020-02-28 2021-02-25 基板處理方法及基板處理裝置 TWI799797B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020034334A JP7469073B2 (ja) 2020-02-28 2020-02-28 基板処理方法および基板処理装置
JP2020-034334 2020-02-28

Publications (2)

Publication Number Publication Date
TW202145410A TW202145410A (zh) 2021-12-01
TWI799797B true TWI799797B (zh) 2023-04-21

Family

ID=77491319

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110106604A TWI799797B (zh) 2020-02-28 2021-02-25 基板處理方法及基板處理裝置

Country Status (3)

Country Link
JP (1) JP7469073B2 (zh)
TW (1) TWI799797B (zh)
WO (1) WO2021171931A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023238679A1 (ja) * 2022-06-08 2023-12-14 東京エレクトロン株式会社 基板処理装置、基板処理方法及びコンピュータ読み取り可能な記録媒体

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013074126A (ja) * 2011-09-28 2013-04-22 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP2016107272A (ja) * 2014-12-02 2016-06-20 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
WO2019230404A1 (ja) * 2018-05-31 2019-12-05 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
TW202004893A (zh) * 2018-05-31 2020-01-16 日商斯庫林集團股份有限公司 基板處理方法及基板處理裝置
TW202006855A (zh) * 2018-07-13 2020-02-01 日商斯庫林集團股份有限公司 基板處理裝置及基板處理方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6980457B2 (ja) 2017-08-23 2021-12-15 東京エレクトロン株式会社 基板処理装置、基板処理方法および記憶媒体

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013074126A (ja) * 2011-09-28 2013-04-22 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP2016107272A (ja) * 2014-12-02 2016-06-20 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
WO2019230404A1 (ja) * 2018-05-31 2019-12-05 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
TW202004893A (zh) * 2018-05-31 2020-01-16 日商斯庫林集團股份有限公司 基板處理方法及基板處理裝置
TW202006855A (zh) * 2018-07-13 2020-02-01 日商斯庫林集團股份有限公司 基板處理裝置及基板處理方法

Also Published As

Publication number Publication date
TW202145410A (zh) 2021-12-01
JP7469073B2 (ja) 2024-04-16
WO2021171931A1 (ja) 2021-09-02
JP2021136420A (ja) 2021-09-13

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