TWI799624B - 晶圓的加工方法 - Google Patents

晶圓的加工方法 Download PDF

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Publication number
TWI799624B
TWI799624B TW108126979A TW108126979A TWI799624B TW I799624 B TWI799624 B TW I799624B TW 108126979 A TW108126979 A TW 108126979A TW 108126979 A TW108126979 A TW 108126979A TW I799624 B TWI799624 B TW I799624B
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TW
Taiwan
Prior art keywords
processing method
wafer processing
wafer
processing
Prior art date
Application number
TW108126979A
Other languages
English (en)
Other versions
TW202008442A (zh
Inventor
原田成規
松澤稔
木內逸人
淀良彰
荒川太朗
上里昌充
河村慧美子
藤井祐介
宮井俊輝
大前卷子
Original Assignee
日商迪思科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商迪思科股份有限公司 filed Critical 日商迪思科股份有限公司
Publication of TW202008442A publication Critical patent/TW202008442A/zh
Application granted granted Critical
Publication of TWI799624B publication Critical patent/TWI799624B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H01L21/3043—Making grooves, e.g. cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H01L2221/68322—Auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
TW108126979A 2018-08-06 2019-07-30 晶圓的加工方法 TWI799624B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018147472A JP7191458B2 (ja) 2018-08-06 2018-08-06 ウェーハの加工方法
JP2018-147472 2018-08-06

Publications (2)

Publication Number Publication Date
TW202008442A TW202008442A (zh) 2020-02-16
TWI799624B true TWI799624B (zh) 2023-04-21

Family

ID=69168349

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108126979A TWI799624B (zh) 2018-08-06 2019-07-30 晶圓的加工方法

Country Status (8)

Country Link
US (1) US11037813B2 (zh)
JP (1) JP7191458B2 (zh)
KR (1) KR20200016176A (zh)
CN (1) CN110808209B (zh)
DE (1) DE102019211425A1 (zh)
MY (1) MY191416A (zh)
SG (1) SG10201906897SA (zh)
TW (1) TWI799624B (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7430515B2 (ja) * 2019-11-06 2024-02-13 株式会社ディスコ ウエーハの処理方法
JP2023019193A (ja) * 2021-07-28 2023-02-09 株式会社ディスコ 被加工物の加工方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200308008A (en) * 2002-03-28 2003-12-16 Mitsui Chemicals Inc Adhesive film for protection of semiconductor wafer surface and method of protecting semiconductor wafer with the adhesive film
TW200415754A (en) * 2002-10-25 2004-08-16 Renesas Tech Corp Fabrication method of semiconductor integrated circuit device
US20090209066A1 (en) * 2008-02-14 2009-08-20 Disco Corporation Die bonding method and die bonder
TW201440134A (zh) * 2013-02-11 2014-10-16 Henkel IP & Holding GmbH 作爲切割膠帶黏著劑之晶圓背部塗層
CN107210246A (zh) * 2015-01-15 2017-09-26 Ev 集团 E·索尔纳有限责任公司 用于涂装基体的方法和装置

Family Cites Families (17)

* Cited by examiner, † Cited by third party
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JP3076179B2 (ja) 1993-07-26 2000-08-14 株式会社ディスコ ダイシング装置
JPH09167779A (ja) * 1995-12-14 1997-06-24 Toshiba Corp 半導体製造装置
JP3280876B2 (ja) * 1996-01-22 2002-05-13 日本テキサス・インスツルメンツ株式会社 ウェハダイシング・接着用シートおよび半導体装置の製造方法
JP3076179U (ja) 2000-09-07 2001-03-30 和雄 落合 コップ型ボトルキャップ
US6890836B2 (en) * 2003-05-23 2005-05-10 Texas Instruments Incorporated Scribe street width reduction by deep trench and shallow saw cut
JP2005191297A (ja) 2003-12-25 2005-07-14 Jsr Corp ダイシングフィルム及び半導体ウェハの切断方法
JP4630692B2 (ja) 2005-03-07 2011-02-09 株式会社ディスコ レーザー加工方法
JP4930679B2 (ja) * 2005-12-14 2012-05-16 日本ゼオン株式会社 半導体素子の製造方法
JP2008117943A (ja) * 2006-11-06 2008-05-22 Nitto Denko Corp ウォータージェットレーザダイシング用粘着シート
JP5047838B2 (ja) 2008-02-26 2012-10-10 株式会社ディスコ テープ貼り機
JP5021553B2 (ja) 2008-04-23 2012-09-12 リンテック株式会社 シート貼付装置及び貼付方法
US9786541B2 (en) * 2011-09-30 2017-10-10 Lintec Corporation Dicing sheet with protective film forming layer and chip fabrication method
JP5895676B2 (ja) 2012-04-09 2016-03-30 三菱電機株式会社 半導体装置の製造方法
JP6021433B2 (ja) 2012-05-23 2016-11-09 株式会社ディスコ テープ
JP2015015359A (ja) 2013-07-04 2015-01-22 株式会社ディスコ ウエーハの加工方法
JP6422462B2 (ja) 2016-03-31 2018-11-14 古河電気工業株式会社 電子デバイスパッケージ用テープ
JP2018074123A (ja) * 2016-11-04 2018-05-10 株式会社ディスコ ウエーハの加工方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200308008A (en) * 2002-03-28 2003-12-16 Mitsui Chemicals Inc Adhesive film for protection of semiconductor wafer surface and method of protecting semiconductor wafer with the adhesive film
TW200415754A (en) * 2002-10-25 2004-08-16 Renesas Tech Corp Fabrication method of semiconductor integrated circuit device
US20090209066A1 (en) * 2008-02-14 2009-08-20 Disco Corporation Die bonding method and die bonder
TW201440134A (zh) * 2013-02-11 2014-10-16 Henkel IP & Holding GmbH 作爲切割膠帶黏著劑之晶圓背部塗層
CN107210246A (zh) * 2015-01-15 2017-09-26 Ev 集团 E·索尔纳有限责任公司 用于涂装基体的方法和装置

Also Published As

Publication number Publication date
JP2020024966A (ja) 2020-02-13
JP7191458B2 (ja) 2022-12-19
DE102019211425A1 (de) 2020-02-06
MY191416A (en) 2022-06-27
US11037813B2 (en) 2021-06-15
CN110808209B (zh) 2024-05-17
CN110808209A (zh) 2020-02-18
TW202008442A (zh) 2020-02-16
US20200043772A1 (en) 2020-02-06
SG10201906897SA (en) 2020-03-30
KR20200016176A (ko) 2020-02-14

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