KR102604600B1 - 기판 처리 장치, 기판 처리 시스템 및 적재대를 위치 정렬하는 방법 - Google Patents

기판 처리 장치, 기판 처리 시스템 및 적재대를 위치 정렬하는 방법 Download PDF

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KR102604600B1
KR102604600B1 KR1020217029943A KR20217029943A KR102604600B1 KR 102604600 B1 KR102604600 B1 KR 102604600B1 KR 1020217029943 A KR1020217029943 A KR 1020217029943A KR 20217029943 A KR20217029943 A KR 20217029943A KR 102604600 B1 KR102604600 B1 KR 102604600B1
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South Korea
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substrate
loading
position adjustment
holding
loading table
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Korean (ko)
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KR20210127747A (ko
Inventor
다미히로 고바야시
다카유키 야마기시
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도쿄엘렉트론가부시키가이샤
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Priority claimed from PCT/JP2020/005865 external-priority patent/WO2020175191A1/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • C23C16/4582—Rigid and flat substrates, e.g. plates or discs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020217029943A 2019-02-27 2020-02-14 기판 처리 장치, 기판 처리 시스템 및 적재대를 위치 정렬하는 방법 Active KR102604600B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2019034320 2019-02-27
JPJP-P-2019-034320 2019-02-27
JPJP-P-2019-130348 2019-07-12
JP2019130348A JP2020141118A (ja) 2019-02-27 2019-07-12 基板処理装置、基板処理システム及び載置台を位置合わせする方法
PCT/JP2020/005865 WO2020175191A1 (ja) 2019-02-27 2020-02-14 基板処理装置、基板処理システム及び載置台を位置合わせする方法

Publications (2)

Publication Number Publication Date
KR20210127747A KR20210127747A (ko) 2021-10-22
KR102604600B1 true KR102604600B1 (ko) 2023-11-22

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JP (1) JP2020141118A (enExample)
KR (1) KR102604600B1 (enExample)
CN (1) CN113439328B (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115732381A (zh) * 2022-11-22 2023-03-03 北京北方华创微电子装备有限公司 半导体设备及其基座调节机构
WO2025047616A1 (ja) * 2023-08-31 2025-03-06 キヤノントッキ株式会社 真空チャンバ及び成膜装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003257958A (ja) 2002-03-05 2003-09-12 Tokyo Electron Ltd 熱処理用ボート及び縦型熱処理装置
US20080286444A1 (en) 2003-07-10 2008-11-20 Applied Materials, Inc. In Situ Substrate Holder Leveling Method and Apparatus
JP2010087231A (ja) 2008-09-30 2010-04-15 Tokyo Electron Ltd 真空処理装置
KR101589667B1 (ko) 2015-02-02 2016-01-29 한국기술교육대학교 산학협력단 히터블록 레벨 조절장치
WO2018207616A1 (ja) 2017-05-11 2018-11-15 東京エレクトロン株式会社 真空処理装置

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JP3313609B2 (ja) * 1997-03-19 2002-08-12 ウシオ電機株式会社 ウエハ周辺露光装置のウエハ処理ステージ
US6283692B1 (en) * 1998-12-01 2001-09-04 Applied Materials, Inc. Apparatus for storing and moving a cassette
JP3632575B2 (ja) 2000-08-04 2005-03-23 松下電器産業株式会社 光学素子成形装置
JP2002368066A (ja) * 2001-06-06 2002-12-20 Tokyo Electron Ltd 処理装置
JP2006120799A (ja) * 2004-10-20 2006-05-11 Tokyo Electron Ltd 基板処理装置、基板載置台交換方法、及びプログラム
JP2009241464A (ja) 2008-03-31 2009-10-22 Dowa Metaltech Kk スクリーン印刷装置およびスクリーン版の位置決め方法
JP5088284B2 (ja) * 2008-09-30 2012-12-05 東京エレクトロン株式会社 真空処理装置
JP5544697B2 (ja) * 2008-09-30 2014-07-09 東京エレクトロン株式会社 成膜装置
JP5083193B2 (ja) * 2008-12-12 2012-11-28 東京エレクトロン株式会社 成膜装置、成膜方法及び記憶媒体
US20100326797A1 (en) * 2009-04-23 2010-12-30 Applied Materials, Inc. Carrier for transporting solar cell substrates
JP2011060823A (ja) * 2009-09-07 2011-03-24 Nikon Corp 基板保持装置、露光装置、デバイス製造方法、及び基板保持装置の調整方法
JP2011161621A (ja) 2010-02-12 2011-08-25 Shinko Seimitsu Kanagata Seisakusho:Kk 研削加工用ツインドレッサー装置等の駆動方法等に関する発明
JP5482500B2 (ja) * 2010-06-21 2014-05-07 東京エレクトロン株式会社 基板処理装置
JP6287240B2 (ja) * 2014-01-17 2018-03-07 東京エレクトロン株式会社 真空処理装置及び真空処理方法
WO2016067785A1 (ja) * 2014-10-30 2016-05-06 東京エレクトロン株式会社 基板載置台
JP2017199735A (ja) * 2016-04-25 2017-11-02 東京エレクトロン株式会社 基板の入れ替えシステム、基板の入れ替え方法及び記憶媒体
CN206193392U (zh) * 2016-11-15 2017-05-24 惠科股份有限公司 一种校正机构
CN108465987B (zh) * 2018-05-22 2024-01-30 深圳市金洲精工科技股份有限公司 一种垂直度调整装置及其操作方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003257958A (ja) 2002-03-05 2003-09-12 Tokyo Electron Ltd 熱処理用ボート及び縦型熱処理装置
US20080286444A1 (en) 2003-07-10 2008-11-20 Applied Materials, Inc. In Situ Substrate Holder Leveling Method and Apparatus
JP2010087231A (ja) 2008-09-30 2010-04-15 Tokyo Electron Ltd 真空処理装置
KR101589667B1 (ko) 2015-02-02 2016-01-29 한국기술교육대학교 산학협력단 히터블록 레벨 조절장치
WO2018207616A1 (ja) 2017-05-11 2018-11-15 東京エレクトロン株式会社 真空処理装置

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KR20210127747A (ko) 2021-10-22
CN113439328A (zh) 2021-09-24
JP2020141118A (ja) 2020-09-03
CN113439328B (zh) 2024-04-16

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