KR102604600B1 - How to position and align substrate handling devices, substrate handling systems, and stacking racks - Google Patents

Abstract

A substrate processing device capable of relatively easily adjusting the position of a loading table is provided. The substrate processing apparatus includes a plurality of stacking stands on which substrates to be processed are respectively placed, a plurality of pillars supporting each staging stage from the bottom side, and a common base part supporting the plurality of pillars from the base end side. The position adjustment mechanism is provided between the base portion and each strut, and includes a fixing member on the side of the base portion, a position adjustment member disposed above the proximal end portion for positioning the base end of the prop and adjusting the position of the loading table, and It has a plurality of gap height adjustment portions, each provided at at least three locations surrounding the surrounding area, for installing the position adjusting member relative to the fixing member in a state where the height of the gap between the fixing member and the position adjusting member can be adjusted. At least one position adjustment mechanism of the plurality of position adjustment mechanisms is provided at one location with a fixed installation portion for attaching the position adjustment member to the fixing member while fixing the height of the gap.

Description

How to position and align substrate handling devices, substrate handling systems, and stacking racks

This disclosure relates to a substrate processing apparatus.

In the manufacturing process of a semiconductor device, various processes such as film formation and etching are performed by supplying various processing gases to a semiconductor wafer (hereinafter referred to as a wafer), which is a substrate. This type of substrate processing may be performed with a loading table placed in a processing container and a substrate placed on this loading table.

For example, in Patent Document 1, a technology for adjusting the position of a fixture provided in a twin dresser for forming a grindstone for groove processing is described, and in Patent Document 2, a technology for horizontally moving a mold press plate used for press molding of an optical lens is described. there is. Additionally, Patent Document 3 describes a technique for positioning a screen plate for screen printing.

However, these patent documents do not describe techniques for adjusting the position of the loading table used for substrate processing.

Japanese Patent Publication No. 2011-161621 Japanese Patent Publication No. 2009-241464 Japanese Patent Publication No. 2002-53328

The present disclosure provides a substrate processing apparatus capable of relatively easily adjusting the position of a loading table.

The substrate processing apparatus of the present disclosure is a substrate processing apparatus that performs processing by supplying a processing gas to a substrate,

A plurality of loading tables disposed in the processing container, each of which is loaded with a substrate to be processed,

a plurality of struts that respectively support the plurality of loading tables from a lower side and protrude downwardly through the bottom of the processing vessel;

A common base portion supporting the plurality of struts from the base side,

A fixing member provided between the base portion and the proximal end of each strut and fixed to the base portion side, and disposed above the fixing member to position the proximal end of the prop, thereby forming a loading table supported on the prop. Position adjustment members for adjusting the position, each provided at at least three locations surrounding the support in the circumferential direction, and the height of the gap between the fixing member and the position adjustment member being adjustable, the position adjustment member Provided with a plurality of position adjustment mechanisms having a plurality of gap height adjustment portions provided with respect to the fixing member,

At least one position adjustment mechanism of the plurality of position adjustment mechanisms is to install a position adjustment member with respect to the fixing member, in place of the gap height adjustment part, with the height of the gap fixed, at one of the at least three locations. A fixed installation part is provided.

According to the present disclosure, it becomes possible to relatively easily adjust the position of the mounting table of the substrate processing apparatus.

1 is a plan view illustrating the configuration of a substrate processing system according to an embodiment of the present disclosure.
Figure 2 is a vertical side view of a substrate processing device provided in the substrate processing system.
Figure 3 is an exploded perspective view of the substrate processing apparatus.
Figure 4 is a plan view showing the configuration of the lower part of the support supporting the loading stand.
Figure 5 is a first enlarged longitudinal side view of the position adjustment mechanism of the loading table.
Figure 6 is a second enlarged longitudinal side view of the position adjustment mechanism.
Figure 7 is an enlarged plan view of the position adjustment mechanism.
Figure 8 is a longitudinal side view of the centering of the loading table.
Figure 9 is a plan view of the centering of the loading table.
Figure 10 is a perspective view of the jig used for centering.
Figure 11 is an image of the upper surface of the loading table taken using a wafer equipped with a camera.

An embodiment of the substrate processing system 1 according to the present disclosure will be described with reference to the top view of FIG. 1. This substrate processing system 1 is provided with a loading/unloading port 11, a loading/unloading/unloading module 12, a vacuum transfer module (substrate transfer module) 13, and a substrate processing device 2. In Fig. 1, the A loading/unloading port 11 is connected to the front side of the loading/unloading module 12, and a vacuum transfer module 13 is connected to the inside of the loading/unloading module 12 toward the front-back direction.

The carrying-in/out port 11 is loaded with a carrier C, which is a transfer container containing a substrate to be processed. For example, the substrate is made of a wafer W, which is a circular substrate with a diameter of, for example, 300 mm. The loading and unloading module 12 is a module for loading and unloading the wafer W between the carrier C and the vacuum transfer module 13. The loading and unloading module 12 has a normal pressure transfer chamber 121 in which the wafer W is transferred to and from the carrier C in a normal pressure atmosphere by the transfer mechanism 120, and an atmosphere in which the wafer W is placed is placed at normal pressure. A load lock chamber 122 for switching between an atmosphere and a vacuum atmosphere is provided.

The vacuum transfer module 13 is provided with a vacuum transfer chamber (substrate transfer chamber) 14 in which a vacuum atmosphere is formed, and a substrate transfer mechanism 15 is disposed inside this vacuum transfer chamber 14. For example, the vacuum transfer chamber 14 forms a rectangle with long sides in the front-back direction when viewed in plan. Among the four side walls of the vacuum transfer chamber 14, a plurality of, for example, three substrate processing devices 2 are connected to each of the rectangular opposing long sides, and a loading/unloading module 12 is connected to the front short side. The installed load lock chamber 122 is connected. The symbol G in the figure indicates a gate valve interposed between the loading and unloading module 12 and the vacuum transfer module 13, and between the vacuum transfer module 13 and the substrate processing apparatus 2, respectively. This gate valve G opens and closes the loading/unloading port of the wafer W provided in each module connected to each other.

The substrate transport mechanism 15 is for transporting the wafer W between the loading/unloading module 12 and each substrate processing device 2 in a vacuum atmosphere, and is made up of a multi-joint arm, and carries the wafer W It is provided with a substrate holding support portion 16 that holds and supports. The substrate processing apparatus 2 in this example performs gas processing on a plurality of wafers W, for example, four wafers W, in a vacuum atmosphere, as will be described later. For this reason, the substrate holding portion 16 of the substrate transport mechanism 15 holds, for example, four wafers W so that the four wafers W can be delivered to the substrate processing device 2 at a time. It is structured so that you can do it.

The substrate holding portion 16 includes a first substrate holding portion 161, a second substrate holding portion 162, and a connecting portion 163. The first substrate holding portion 161 and the second substrate holding portion 162 are configured in the shape of two thin and long spatulas extending horizontally in parallel with each other. The connection portion 163 extends in the horizontal direction so as to be perpendicular to the extension direction of the first and second substrate holding portions 161 and 162, and connects the base ends of the first and second substrate holding portions 161 and 162 to each other. It is done. The longitudinal central portion of the connecting portion 163 is provided on the distal end of the articulated arm, and the articulated arm pivots around a vertical pivot axis. The configuration of the first substrate holding portion 161 and the second substrate holding portion 162 will be described later.

Next, see FIGS. 2 and 3 for an example of the substrate processing device 2 being applied to, for example, a film forming device that performs plasma CVD (Chemical Vapor Deposition) treatment, a type of film forming process, on the wafer W. He explains. FIG. 2 is a longitudinal side view explaining the configuration of the substrate processing apparatus 2, and FIG. 3 is an exploded perspective view thereof. In addition, in FIGS. 2 to 4 , subcoordinates (X'-Y'-Z' coordinates) for explaining the arrangement relationship of devices within the substrate processing apparatus 2 are shown together. The subcoordinates are explained by assuming that the position connected to the vacuum transfer module 13 is the front side, the X' direction is the front-back direction, and the Y' direction is the left-right direction.

The six substrate processing devices 2 are configured similarly to each other, and the wafer W can be processed in parallel among the substrate processing devices 2 . The substrate processing apparatus 2 is provided with a processing container 20 that is rectangular in plan view. The processing vessel 20 is configured as a vacuum vessel capable of evacuating the internal atmosphere. In FIGS. 2 and 3, reference numeral 201 refers to the ceiling member of the processing container 20, and reference numeral 202 refers to the container body. On the front side wall of the container body 202, two transfer inlets 21 connected to the vacuum transfer chamber 14 through a gate valve G are arranged in the left and right directions (Y' direction in FIG. 3). It is formed as much as possible. This delivery inlet 21 is opened and closed by a gate valve (G).

As shown in FIG. 3, inside the processing container 20, a first transfer space T1 and a second transfer space T1 extend horizontally from each transfer inlet 21 and where the wafer W is transferred. The space T2 is provided at a position adjacent to each other. Additionally, an intermediate wall portion 203 is provided between the first and second transfer spaces T1 and T2 in the processing container 20 along the extension direction (X' direction in FIG. 3). . The horizontal direction referred to here includes cases where it is slightly tilted in the extension installation direction within a range where there is no influence such as contact between devices during the loading/unloading operation of the wafer W due to the influence of tolerances during manufacturing, etc. .

In the first transfer space T1, two processing spaces S1 and S2 for performing a film forming process on the wafer W are arranged in a row along the extension direction. Also, in the second transfer space T2, two processing spaces S3 and S4 are arranged in a row along the extension direction. Accordingly, in the processing container 20, a total of four processing spaces S1 to S4 are arranged in a 2×2 matrix when viewed from the top side.

The internal structure of the processing vessel 20 including the processing spaces S1 to S4 will be described with reference to FIG. 2 as well. The four processing spaces (S1 to S4) are configured similarly to each other, between a loading table 22 on which the wafer W is loaded, and a gas supply unit 4 disposed opposite to the loading table 22. is formed FIG. 2 shows the processing spaces S1 and S2 of the first conveyance space T1. Hereinafter, the processing space S1 will be described as an example.

The loading table 22 also serves as a lower electrode and is formed, for example, in the shape of a flat disk made of metal or aluminum nitride (AlN) with embedded metal mesh electrodes. In the loading table 22, the center position of the disc is supported from the lower surface by a prop 231. The lower side of the support 231 protrudes downward through the bottom portion 27 of the processing container 20. The support 231 can raise and lower the loading table 22 by the action of the lifting mechanism 81, which will be described later. Additionally, a rotation drive mechanism may be provided at the base end of the support 231 to enable the loading table 22 to rotate around the vertical axis.

In FIG. 2, the loading table 22 in the processing position is shown by a solid line, and the loading table 22 in the delivery position is shown by a dotted line. The processing position is a position when performing a substrate process (film formation process) described later, and the transfer position is a position where the wafer W is transferred to and from the substrate transport mechanism 15 already described. Reference numeral 24 in the drawing indicates heaters embedded in each of the stacking tables 22, and heats each wafer W loaded on the stacking table 22 to 60°C to 600°C. Additionally, the loading table 22 is grounded through a matching device (not shown).

In addition, on the bottom of the processing container 20, a plurality of, for example, three delivery pins 25 are provided at positions corresponding to the loading table 22, while the delivery pins 25 are provided on the loading table 22. A through hole 26 is formed to form a passage area. When the loading table 22 is lowered to the delivery position, the delivery pin 25 passes through the through hole 26, and the upper end of the delivery pin 25 protrudes from the loading surface of the loading table 22. This transfer pin 25 is used to prevent the first and second substrate holding portions 161 and 162 of the substrate transfer mechanism 15 from buffering each other when transferring the wafer W between them. 2 The shape of the substrate holding portions 161 and 162 and the arrangement of the delivery pins 25 are set.

Here, the first and second substrate holding portions 161 and 162 will be described. When the first substrate holding portion 161 enters the first transfer space T1, the wafer W is positioned at a position corresponding to each arrangement position of the processing spaces S1 and S2 in the first transfer space T1. It is structured to hold and support. The positions corresponding to each arrangement position of the processing spaces S1 and S2 in the first conveyance space T1 are located on the two loading tables 22 provided in the processing spaces S1 and S2 of the first conveyance space T1. This is the position set to deliver the wafer (W). In addition, when the second substrate holding portion 162 enters the second transfer space T2, the wafer ( It is configured to hold and support W). The positions corresponding to each arrangement position of the processing spaces S3 and S4 in the second conveyance space T2 are located on the two loading tables 22 provided in the processing spaces S3 and S4 of the second conveyance space T2. This is the position set to deliver the wafer (W).

For example, the first and second substrate holding portions 161 and 162 each have a width smaller than the diameter of the wafer W, and each of the first and second substrate holding portions 161 and 162 has a tip. The back side of the wafer W is supported at a distance from each other on the proximal side and the proximal end side. In addition, the wafer W supported on the tip side and the proximal end side of the first and second substrate holding portions 161 and 162, for example, does not overlap the first and second substrate holding portions 161 and 162. The area exists. In addition, the wafer W supported on the distal ends of the first and second substrate holding portions 161 and 162 has, for example, its central portion supported by the distal ends of the first and second substrate holding portions 161 and 162. do.

In this way, through the cooperative action of the substrate transport mechanism 15, the delivery pin 25, and the loading table 22, the substrate transport mechanism 15 and the loading table 22 in each processing space (S1 to S4) In the meantime, for example, the transfer of four wafers W is configured to be performed simultaneously and in batches. Numeral 27 in FIG. 2 indicates a bottom portion including a bearing portion that holds the support column 231 so that it can move up and down while keeping the inside of the processing container 20 airtight.

Additionally, a gas supply unit 4 forming an upper electrode is provided above the loading table 22 on the ceiling member 201 of the processing container 20 through a guide member 34 made of an insulating member. The gas supply unit 4 is formed between the cover 42, a shower plate 43 forming an opposing surface provided to face the loading surface of the loading table 22, and the cover 42 and the shower plate 43. A gas flow chamber 44 is provided. A gas distribution path 51 is connected to the cover 42, and gas discharge holes 45 penetrating in the thickness direction are arranged, for example, vertically and horizontally, in the shower plate 43 to provide a loading table 22. Gas is discharged in a shower shape toward the target.

The upstream side of the gas distribution path 51 connected to the gas supply section 4 of each processing space S1 to S4 joins the common gas supply path 52 and is connected to the gas supply system 50. The gas supply system 50 includes, for example, a source 53 of a reaction gas (process gas), a source 54 of a purge gas, a source 55 of a cleaning gas for removing the film deposited in the processing container 20, or , piping, valves (V1 to V3), flow rate adjusters (M1 to M3), etc.

A high-frequency power source 41 is connected to the shower plate 43 through a matching device 40. When high-frequency power is applied between the shower plate (upper electrode) 43 and the loading table (lower electrode) 22, the gas supplied from the shower plate 43 to the processing space S1 (the main electrode) is generated by capacitive coupling. In an example, the reaction gas) can be converted into plasma.

Around each of the processing spaces S1 to S4, an annular guide member 34 is provided that forms a slit exhaust port 36 that opens in a slit shape along the circumferential direction of these processing spaces S1 to S4. The guide member 34 is inserted into the recess 204 formed in the container body 202 and forms a flow path 35 through which the gas discharged from the processing spaces S1 to S4 through the slit exhaust port 36 flows. forms. An exhaust port (not shown) is formed in the flow passage 35, and the inside of the substrate processing apparatus 2 is evacuated through an exhaust passage (not shown) connected to the exhaust port.

The operation of performing a film forming process on the wafer W using the substrate processing system 1 having the above-described configuration will be briefly explained.

When the carrier C containing the wafer W to be processed is loaded into the loading/unloading port 11, the wafer W is received under a normal pressure atmosphere by the transfer mechanism 120 of the loading/unloading module 12, and the load is locked. It is conveyed within the room 122. Next, after the inside of the load lock chamber 122 is switched from a normal pressure atmosphere to a vacuum atmosphere, the wafer W in the load lock chamber 122 is received by the substrate transfer mechanism 15 of the vacuum transfer module 13, and the wafer W in the load lock chamber 122 is received and transferred to the vacuum atmosphere. It is transferred to a predetermined substrate processing device 2 through the transfer room 14. As already explained, the substrate transfer mechanism 15 performs processing while holding two wafers W in each of the first substrate holding portion 161 and the second substrate holding portion 162, a total of four wafers W. Enters the container 20. Then, each loading platform 22 in the first and second transfer spaces T1 and T2 is raised and lowered, and the wafer W is delivered to these four loading platforms 22 at the same time.

Next, the first and second substrate holding portions 161 and 162 are retracted from the substrate processing apparatus 2, the gate valve G is closed, and each loading table 22 is raised to the processing position, The pressure in the processing container 20 is adjusted and the wafer W is heated by the heater 24. Then, the reaction gas for film formation is supplied from each gas supply unit 4 in each processing space ( S1 to S4 ), and each high-frequency power supply 41 is turned on to convert the reaction gas into plasma, thereby performing the film formation process.

At this time, the reaction gas is discharged in the form of a shower through the shower plate 43 to the wafer W placed on the loading table 22 in each processing space S1 to S4. Then, the reaction gas flows along the surface of the wafer W in the radial direction and then flows into the flow passage 35 through the slit exhaust port 36 opened in the peripheral portion of the processing space S1 to S4. , is exhausted. At this time, a flow of reaction gases whose flow rate, flow direction, and plasmaization state are aligned with each other is formed in each processing space (S1 to S4), thereby forming a film with aligned film thickness distribution and film quality on the surface of the wafer W. can do.

Then, when the film formation is completed after a predetermined time has elapsed, the supply of the reaction gas and high-frequency power, and the heating of the wafer W are stopped, the pressure inside the processing container 20 is adjusted, and then the procedure is reversed from the loading time. The wafer W after the film formation process is simultaneously unloaded from the processing container 20.

As explained above, in order to perform a film formation process in which the film thickness distribution and film quality are aligned by placing the wafer W in different processing spaces (S1 to S4), the wafers W formed in each processing space (S1 to S4) are It is desirable that the flow of the reaction gas and the state of plasma conversion are adjusted. The flow and plasma state of the reaction gas formed in the processing spaces S1 to S4 are influenced by the distance and degree of parallelism between the lower surface of the shower plate 43 and the upper surface of the loading table 22. In addition, if the guide member 34 formed in an annular shape and the center of the disk-shaped loading table 22 are not aligned, the distance from the outer peripheral end of the loading table 22 to the slit exhaust port 36 will not be uniform. Therefore, there is a risk that bias may occur in the flow of the reaction gas.

For this reason, each loading table 22 needs to be accurately placed at a predetermined position within the processing container 20. Therefore, when newly installing the substrate processing system 1 (substrate processing device 2) or when reassembling the substrate processing device 2 after disassembly and maintenance, the arrangement position of the loading table 22 is adjusted. Examples of items related to adjustment of the arrangement position include adjustment of the tilt of the support column 231 and adjustment of the horizontal position of the loading table 22.

Conventionally, such position adjustment sometimes took several hours for one loading platform 22. However, for example, the substrate processing system 1 shown in FIG. 1 includes six substrate processing devices 2 arranged in four processing spaces S1 to S4, and a total of 24 loading tables 22. ) is provided. For this reason, if it takes several hours to adjust the position of one loading table 22, there is a risk that it will take a lot of time to install and assemble one substrate processing system 1.

In this regard, the substrate processing apparatus 2 of this example is provided with a position adjustment mechanism 6 for relatively easily adjusting the positions of the plurality of stacks 22. Hereinafter, the configuration of the position adjustment mechanism 6 will be described with reference to FIGS. 4 to 7 in addition to FIG. 2 .

In the substrate processing apparatus 2 of this example, two loading tables 22 arranged in the processing spaces S1 and S2 on the first transfer space T1 side, and a processing space on the second transfer space T2 side The two loading tables 22 arranged at (S3, S4) are provided with position adjustment mechanisms 6 of substantially common configuration. FIG. 2 shows a configuration example of the position adjustment mechanism 6 on the processing space S1 and S2 side. However, for convenience of illustration, in FIG. 2, the arrangement positions of the gap height adjustment part 71 and the horizontal position adjustment part 73, which will be described later, are changed, and the description of the fixed installation part 72 is omitted (exact arrangement position (see Figure 4 for ).

As shown in FIG. 2 , the lower ends of each strut 231 protruding downward from the bottom portion 27 of the processing container 20 are supported on a common base portion 62 . Additionally, a position adjustment mechanism 6 is provided between each support 231 and the base portion 62.

The base portion 62 is a plate-shaped member stretched horizontally along the first transport space T1, and a support arm 621 for supporting the position adjustment mechanism 6 is provided from the base portion 62, It extends in the horizontal direction toward the lower area of the loading table 22. As shown in FIGS. 2 and 4, the base portion 62 includes a lifting mechanism ( 81).

The lifting mechanism 81 is connected to the drive unit 811 and includes an elastic rod 812 that expands and contracts in the vertical direction, and a guide plate 814 arranged along the expansion and contraction direction of the elastic rod 812. The base portion 62 is connected to the telescopic rod 812 through a connecting body 815, and moves up and down in accordance with the expansion and contraction motion of the telescopic rod 812. Additionally, on the guide plate 814, two guide rails 813 that extend along the expansion/contraction direction of the expansion/contraction rod 812 are disposed at positions on either side of the expansion/contraction rod 812. A slider 622 having a concave portion that fits into the guide rail 813 is fixed on the base portion 62 side, and by moving the slider 622 along the guide rail 813, the base portion 62 is stably maintained. It can be elevated.

Next, the detailed structure of the position adjustment mechanism 6 will be described. The position adjustment mechanism 6 has a fixed plate (fixing member) 612 fixed to the base portion 62, and a position disposed above the fixed plate 612 while being fixed to the lower end of the support 231. It is provided with an adjustment plate (position adjustment member) 611. Additionally, the position adjustment mechanism 6 is provided with a plurality of gap height adjustment portions 71 and horizontal position adjustment portions 73 for adjusting the relative positional relationship between the fixing plate 612 and the position adjustment plate 611. Additionally, a fixed installation portion 72 is provided at a predetermined position of one position adjustment mechanism 6.

As shown in the enlarged longitudinal side view of FIG. 5, the fixing plate 612 is, for example, a plate-shaped member with a flat upper surface, and is supported from the lower surface by the already described support arm 621 provided on the base portion 62 side. It is supported. In addition, the position adjustment plate 611 is, for example, a plate-shaped member with a flat lower surface, and the base end of the strut 231 is fixed to its upper surface, so that the position of the strut 231 is determined. FIG. 5 shows an example in which the flange portion 232 provided at the base end of the strut 231 is fixed to the position adjustment plate 611 through a fixing screw 233.

Here, in the case of providing a rotation drive mechanism for the loading table 22 at the base end of the prop 231, it is connected to a rotary motor, etc., and a rotation shaft with a smaller diameter than the prop 231 is installed from the lower end surface of the prop 231. It may be protruded toward the lower side. Openings for inserting the rotating shaft are provided on the position adjustment plate 611 and the fixed plate 612, and the rotating shaft is inserted into these openings, and the lower end of the support 231 is placed on the upper surface of the positioning plate 611. The position of the strut 231 may be determined by placing the noodles.

FIG. 4 is a plan view showing the position adjustment mechanism 6 looking down from the lower side of the processing container 20. In FIG. 4 , the arrangement positions of the processing container 20, the gate valve G, and each loading table 22 are indicated with broken lines. In this example, the position adjustment mechanism 6 disposed corresponding to the processing spaces S2 and S4 on the rear side as seen from the gate valve G uses the three gap height adjustment portions 71 to adjust the support column 231. Perform tilt adjustment. On the other hand, the position adjustment mechanism 6 disposed in the processing spaces S1 and S3 on the front side uses two gap height adjustment parts 71 and one fixed installation part 72 to adjust the inclination of the strut 231. Make adjustments. Additionally, the four position adjustment mechanisms 6 all use the two horizontal position adjustment portions 73 to adjust the horizontal position of the loading table 22.

For example, as shown in Figure 5, the gap height adjustment portion 71 includes a pull screw 713 that secures the position adjustment plate 611 with respect to the fixing plate 612, a position adjustment plate 611, and It is provided with a push screw 711 that regulates the proximity of the fixing plate 612.

A male thread is formed at the distal end of the pulling screw 713, and is screw-engaged with a female thread 611a provided to open toward the lower surface of the position adjustment plate 611. Meanwhile, the proximal end of the pulling screw 713 passes through a through hole 612b provided in the fixing plate 612 and is connected to the clamp lever 714.

In addition, the side peripheral surface of the pull screw 713 and the through hole 612b are aligned so that the position adjustment plate 611 can be moved in the horizontal direction with respect to the fixing plate 612 using the horizontal position adjustment portion 73. A gap is formed between the .

The connection portion between the pull screw 713 and the clamp lever 714 is made of a member whose diameter is larger than the opening diameter of the through hole 612b on the fixing plate 612 side. Therefore, the clamp lever 714 serves as a support member for installing the position adjustment plate 611 above the fixing plate 612 by supporting the fixing plate 612 from the lower surface side. In this example, a flat washer 716 is disposed between the lower surface of the fixing plate 612 and the clamp lever 714 forming the support member.

In the above-described configuration, the pull screw 713 is rotated using the clamp lever 714 to increase or decrease the amount of screw engagement with the female screw 611a, so that the upper surface of the fixing plate 612 and the position adjustment plate 611 are adjusted. The height (h) of the gap between the lower surfaces can be changed. The pull screw 713 and the clamp lever 714 constitute the pull screw portion of the gap height adjustment portion 71. In addition, it is not essential to support the fixing plate 612 using the clamp lever 714, and for example, a nut screwed to the external thread formed in the lower end region of the pull screw 713 may be used as a support member.

The press screw 711 brings the head of the pin 612a inserted into the fixing plate 612 into contact with the front end surface of the press screw 711, thereby ensuring the proximity of the fixing plate 612 and the position adjustment plate 611. It plays a role in regulating. Here, the head portion of the pin 612a that contacts the tip surface of the screw 711 is preferably spherical. With this configuration, even if the position where the push screw 711 contacts the pin 612a is shifted in the horizontal direction, the height position that regulates the proximity of the fixing plate 612 and the position adjustment plate 611 can be kept constant. there is.

The proximal end of the fixing member 715 is connected to the micrometer head 712 through a through hole 611b provided in the position adjustment plate 611. The push screw 711 and the micrometer head 712 constitute the push screw portion of the gap height adjustment portion 71. Between the upper surface of the position adjustment plate 611 and the micrometer head 712, a fixing member 715 is provided for fixing the press screw portion to the position adjustment plate 611.

As shown in FIG. 4, the position adjustment mechanisms 6 disposed corresponding to the processing spaces S2 and S4 on the rear side as seen from the gate valve G are spaced apart in the circumferential direction around the support post 231. Gap height adjustment portions 71 are provided at three surrounding locations. In this example, with the support column 231 as the center, three gap height adjustment parts 71 are arranged at equal intervals in the circumferential direction. By adjusting the gap height h at these three locations, the inclination of the strut 231 positioned by the position adjustment plate 611 can be freely adjusted in the X' direction and Y' direction in the figure.

On the other hand, in the position adjustment mechanism 6 disposed corresponding to the processing spaces S1 and S3 on the front side as seen from the gate valve G, there are already two locations surrounding the support 231 spaced apart in the circumferential direction. The gap height adjustment part 71 described is provided. Meanwhile, a fixed installation portion 72 is placed in one remaining location. In this example, these two gap height adjustment parts 71 and one fixed installation part 72 are arranged at equal intervals in the circumferential direction with the support pillar 231 as the center.

FIG. 6 is a vertical side view showing a configuration example of the fixing portion 72. The fixed installation portion 72 includes a block 723, a thrust washer 725, a collar 722, and a fixing bolt 721. The block 723 is provided to be closely fitted to the position adjustment plate 611 using block bolts 724, and a through hole 723a is formed in the vertical direction.

The thrust washers 725 are disposed on the upper and lower sides of the block 723, and the collar 722 is disposed to penetrate these thrust washers 725 and the through hole 723a of the block 723. A flange is formed at the upper end of the collar 722, and the flange is caught on the upper surface of the upper thrust washer 725. Meanwhile, the lower end of the curler 722 is inserted into a through hole opened on the upper surface side of the fixing plate 612 and is caught at the upper end of the reduced diameter portion formed in the through hole. Additionally, a fixing bolt 721 having a head is inserted into the through hole on the side of the collar 722 and the fixing plate 612. By screwing the female thread of the nut 726 to the male thread formed at the lower end of the fixing bolt 721, the fixing plate 612 is supported from the lower surface.

By the above-described configuration, between the head of the fixing bolt 721 and the nut 726, a collar 722, an upper thrust washer 725, a block 723, a lower thrust washer 725, The fixing plates 612 are fastened to each other. And, by disposing the thrust washer 725 between the fixing plate 612 and the position adjustment plate 611, a gap with a height h ₀ corresponding to the thickness of the thrust washer 725 is formed.

The fixed installation portion 72 shown in FIG. 6 can change the height (h ₀ ) of the gap between the fixing plate 612 and the position adjustment plate 611 unless it is changed to a thrust washer 725 of a different thickness. There is no In other words, in the fixed installation portion 72, the gap height is fixed at h ₀ .

In addition, the side peripheral surface of the color 722 and the block 723 penetrate so that the position adjustment plate 611 can be moved in the horizontal direction with respect to the fixing plate 612 using the horizontal position adjustment unit 73. A gap is formed between the spheres 723a.

As shown in FIG. 4, in the substrate processing apparatus 2 of this example, the entry direction of the first and second substrate holding parts 161 and 162 (extended installation of the first and second transfer spaces T1 and T2) A plurality of loading platforms 22 are arranged in one row side by side along the direction (direction). In addition, a fixed installation portion 72 is provided with respect to the position adjustment mechanism 6 of the support 231 supporting the loading platform 22 disposed on the side of the loading/unloading entrance 21 among the loading platforms 22 of each group. there is.

In addition, as shown in FIG. 4, the fixing portion 72 is provided at a position closest to the loading/unloading inlet 21 among three locations surrounding the pillar 231 at a distance from each other in the circumferential direction. In the example shown in the drawing, when viewed in plan, the two position adjustment mechanisms 6 arranged at positions close to the delivery inlet 21 are each positioned approximately equidistant from the delivery inlet 21, with a gap height of One adjustment part 71 and one fixed installation part 72 are arranged. In this case, the fixing portions 72 are disposed at positions that are difficult to access from the side of the substrate processing apparatus 2, that is, at positions far from both side walls of the processing container 20 as viewed from the loading/unloading inlet 21. You can do it.

In the above-mentioned position adjustment mechanism 6, two gap height adjustment parts 71 and one fixed installation part 72 are arranged at equal intervals in the circumferential direction, with the support pillar 231 as the center. Even when the gap height is fixed to h ₀ in one fixed installation part 72, it is possible to adjust h in the remaining two gap height adjustment parts 71. As a result, the tilt of the strut 231 positioned by the position adjustment plate 611 can be freely adjusted in the X' direction and Y' direction in the figure.

Next, a configuration example of the horizontal position adjusting unit 73 for adjusting the horizontal position of the loading table 22 will be described. For example, as shown in FIGS. 2 and 7, the horizontal position adjusting portion 73 is provided on the side of the fixing plate 612. As shown in FIG. 7, when the position adjustment mechanism 6 is viewed in a plan view, a straight line (indicated by a dashed line in the same figure) is drawn from the center of the support 231 toward two mutually intersecting directions (orthogonal directions in this example). The horizontal position adjusting portion 73 is disposed at a position where the indicated x-axis and y-axis) and the side surfaces of the position adjusting plate 611 and the fixing plate 612 intersect. At the position where the horizontal position adjusting portion 73 is disposed, both plates ( 612, 611) are composed.

A holding member 734 is disposed at a position opposite the side surface of the position adjustment plate 611. The holding member 734 is a plate-shaped member arranged so that its plate surface faces the side surface of the position adjustment plate 611, and is fixed to the side surface of the fixing plate 612 by a fixing member 735. The holding member 734 and the fixing member 735 correspond to the holding portion in this example.

The holding member 734 is provided with a pull screw 733 for attaching the position adjusting plate 611 to the holding member 734 in a state where the position of the position adjusting plate 611 can be moved in the horizontal direction. is held and supported. Additionally, the holding member 734 holds a push screw 731 that regulates the proximity of the side surfaces of the holding member 734 and the position adjustment plate 611.

A male thread is formed at the tip of the pulling screw 733, and is screw-engaged with a female thread provided to open toward the side of the position adjustment plate 611. Meanwhile, the proximal end of the pulling screw 733 penetrates the holding member 734 and is fixed to the holding member 734 through the flat washer 733a by a clamp lever 736 provided at the penetrating position. . The position adjustment plate 611 can be moved in the horizontal direction by using the clamp lever 736 to increase or decrease the screw engagement amount of the female screw and the pull screw 733 on the position adjustment plate 611 side. The pull screw 733 and the clamp lever 736 constitute the pull screw portion of the horizontal position adjusting portion 73.

The push screw 731 regulates the proximity of the position adjustment plate 611 and the holding member 734 by bringing its distal end surface into contact with the side surface of the position adjustment plate 611. Perform horizontal positioning. The base end of the push screw 731 penetrates the holding member 734 and is connected to the micrometer head 732. The push screw 731 and the micrometer head 732 constitute the push screw portion of the horizontal position adjusting portion 73.

An example of a method for adjusting the position of the loading table 22 using the position adjusting mechanism 6 having the structure described above will be described. When installing the substrate processing device 2, each loading table 22 is installed on the lifting mechanism 81 through the positioning mechanism 6, and is transported with the temporary position determined. For the substrate processing apparatus 2, position adjustment is started from the loading table 22 connected to the position adjustment mechanism 6 on which the fixed installation portion 72 is provided. In the example shown in FIG. 4, position adjustment is started from the loading table 22 using the position adjustment mechanism 6 provided on the carrying out/inlet 21 side and provided with a fixed installation portion 72. Hereinafter, position adjustment of the loading table 22 disposed in the processing spaces S1 and S2 on the first transfer space T1 side will be described as an example.

First, the ceiling member 201 of the processing container 20 is opened, and each gap height adjustment part 71 and the fixed installation part 72 provided in the two position adjustment mechanisms 6 are positioned above each other. A total of six capacitance sensors (not shown), three each, are placed on the loading platform 22. Then, when the ceiling member 201 is closed, the upper surface of the loading table 22 and the lower surface of the shower plate 43 face each other, and the capacitance sensor measures the distance to the lower surface of the shower plate 43. A signal can be output.

As explained here with reference to FIG. 6, since the position adjustment mechanism 6 on the processing space S1 side is provided with a fixed installation portion 72, at this position, the upper surface of the fixing plate 612 and the position adjustment plate The gap height of the lower surface of (611) is fixed to h ₀ in advance. Therefore, based on the output of the capacitance sensor disposed above the fixed installation portion 72, the height dimension between the upper surface of the loading table 22 and the lower surface of the shower plate 43 reaches a preset value. Raise the loading table (22).

At this time, when the support 231 is tilted, the height dimension is not constant across the opposing surfaces of the loading table 22 and the shower plate 43, so the horizontal position adjusting portions 73 provided at the remaining two locations Use to adjust the gap height (h) at each location. That is, based on the output of the electrostatic capacitance sensor above each horizontal position adjusting portion 73, when the height dimension is small, the gap height h on the position adjusting mechanism 6 side is reduced, and the height dimension is reduced. If it is large, adjustment is made to increase the clearance height h on the position adjustment mechanism 6 side.

5, when increasing the gap height h, the pull screw 713 is turned by the clamp lever 714 to remove the fixing plate from the position adjustment plate 611 with some margin. 612) are separated. Then, after lowering the tip of the press screw 711 by a predetermined amount using the micrometer head 712, the clamp lever 714 is turned in the opposite direction so that the head of the pin 612a is pressed against the press screw 711. Raise the fixing plate 612 to a position where it touches the front end surface of. On the other hand, when reducing the gap height (h), use the micrometer head 712 to raise the tip surface of the press screw 711 by a predetermined amount, and then turn the clamp lever 714 to remove the pin 612a. The fixing plate 612 is raised to a position where the head portion abuts the front end surface of the press screw 711.

Since the proximity of the fixing plate 612 and the position adjustment plate 611 is regulated using the micrometer head 712, the gap height (h) can be precisely adjusted. Additionally, since a clamp lever 714 is provided on the pulling screw 713, which is operated from the lower surface of the fixing plate 612, operation is easy.

In this way, when the height dimension at the upper position of the gap height adjustment portions 71 provided at two locations becomes a preset value, the height dimension becomes constant across the entire opposing surfaces between the loading table 22 and the shower plate 43. When the height dimension on the fixed installation portion 72 side changes by adjusting the inclination of the strut 231, fine adjustments are made, such as slightly raising and lowering the loading table 22 using the lifting mechanism 81.

Then, the position of the loading table 22 on the processing space S2 side is adjusted.

Since the loading platforms 22 disposed on the two processing spaces S1 and S2 sides are supported on a common base portion 62, the two loading platforms 22 are raised and lowered synchronously. Therefore, as shown in FIG. 2, when the height of the struts 231 supporting each loading platform 22 and the thickness of the loading platform 22 itself are configured to be similar to each other, the upper surfaces of both loading platforms 22 are They are located at almost the same height.

Therefore, based on the above height dimension at the position above the fixed installation portion 72 on the processing space S1 side, the height dimension between the loading table 22 on the processing space S2 side and the shower plate 43 carry out adjustment. That is, based on the output of the capacitance sensor located above the gap height adjustment portion 71 provided at three locations in the position adjustment mechanism 6 on the processing space S2 side, the height dimension is set to a preset value. Adjust the gap height (h) of each gap height adjustment unit 71.

By the method described above, the tilt of the support 231 supporting the loading table 22 arranged in a row along the first transfer space T1 is adjusted, and the loading table 22 - shower plate 43 ) The height dimension can be kept constant between opposing surfaces. When the position adjustment is completed, the ceiling member 201 is opened and the capacitance sensor on the loading table 22 is removed.

Next, an example of a method for adjusting the horizontal position using the horizontal position adjusting unit 73 will be described. First, with the loading table 22 raised to the processing position, the ceiling member 201 is opened, and a nozzle or the like is used to connect the side peripheral surface of the loading table 22 and the guide member 34 (slit exhaust port 36). Measure the distribution of dimensions across the width of the annular gap. From this measurement result, the amount of deviation between the center of the loading table 22 and the center of the guide member 34 is determined, and the position adjustment plate 611 in each direction of the x-axis and y-axis in FIG. 7 is used to eliminate this amount of deviation. ) Specifies the amount of movement.

7 , when moving the position adjustment plate 611 in a direction away from the holding member 734, the pull screw 733 is turned by the clamp lever 736 to provide a certain amount of clearance. The side surface of the position adjustment plate 611 is spaced from the holding member 734. Then, using the micrometer head 732, the tip surface of the press screw 731 is protruded by a predetermined amount, and then the clamp lever 736 is turned in the opposite direction, so that the side is pressed by the pull screw 733. The position adjustment plate 611 is moved to a position where it contacts the distal end surface of the screw 731. On the other hand, when moving the position adjustment plate 611 in a direction approaching the holding member 734, the tip surface of the press screw 731 is retracted by a predetermined amount using the micrometer head 732. Then, the pull screw 733 is turned by the clamp lever 736 to move the position adjustment plate 611 to a position where the side surface abuts the distal end surface of the pull screw 733.

Since the proximity of the position adjustment plate 611 and the holding member 734 is regulated using the micrometer head 732, the horizontal position of the position adjustment plate 611 can be precisely adjusted.

As explained here using FIGS. 5 and 6, around the pull screw 713 penetrating the through hole 612b of the fixing plate 612 or around the color ( A gap is formed around 722). And, thrust washers 725 are provided on the upper and lower sides of the block 723, which is provided integrally with the position adjustment plate 611. With this configuration, the position adjustment plate 611 can move in the horizontal direction relative to the fixed plate 612 by the action of the above-described fixed installation portion 72.

Additionally, in each horizontal position adjusting portion 73, a gap (not shown) is formed at a position where the pulling screw 733 penetrates the holding member 734. With this configuration, when the position adjustment plate 611 is moved in the horizontal direction using one horizontal position adjusting portion 73, the other horizontal position adjusting portion 73 moves with respect to the pull screw 733. Retention support member 734 may be relatively movable.

By using the method described above, the positions of the stacks 22 on the second transfer space T2 side are also adjusted, thereby adjusting the positions of all stacks 22 in the substrate processing apparatus 2 without using tools. This is done. In addition, the order of performing the position adjustment of the loading table 22 is after sequentially adjusting the inclination of the support column 231 for the four loading tables 22 in the first and second transfer spaces T1 and T2, You may adjust the position in the horizontal direction.

Once the position adjustment is completed, the ceiling member 201 of the processing container 20 is installed, each substrate processing device 2 is connected to the vacuum transfer module 13, various piping is connected, etc., and the substrate processing system is installed. It constitutes (1).

According to the substrate processing apparatus 2 of the present disclosure, by using the position adjustment mechanism 6, it becomes possible to relatively easily adjust the position of the loading table 22 without using a tool. In particular, among the two loading tables 22 supported on the common base portion 62, one position adjustment mechanism 6 is connected to the fixing plate 612 and the position adjustment plate 611 by the fixed installation portion 72. ) gap height is fixed at h ₀ . For this reason, the position of the loading table 22 supported on the common base portion 62 can be adjusted relatively easily based on the position where the fixing portion 72 is provided.

As a comparison with the present disclosure, when the gap height adjustment portion 71 is provided at all positions of the two position adjustment mechanisms 6 on the processing spaces S1 and S2 (first transfer space T1) in FIG. 4. think about In this case, the height dimension between the loading table 22 and the shower plate 43 is the height of the base portion 62, which is raised and lowered by the lifting mechanism 81, and the clearance height h. It is determined by factors.

Therefore, when setting the height dimension to a predetermined value, many combination cases of the arrangement height of the base portion 62 and the clearance height h arise, making it difficult to determine which combination case should be selected. As a result, there is a risk that time will be required to adjust the inclination of each support 231.

Meanwhile, a comparative technique in which one fixed installation portion 72 is provided for each of the two position adjustment mechanisms 6 on the processing space S1 and S2 side in FIG. 4 will also be examined. For example, due to tolerances when manufacturing structural members such as the position adjustment plate 611, support 231, and loading table 22, or distortion of the members, etc. There are cases where the height dimensions are different. In this case, if both position adjustment mechanisms 6 are provided with fixed installation portions 72, in order to align the height dimensions of both positions, thrust washers 725 of different thicknesses are procured and the position adjustment mechanisms 6 are provided. It becomes necessary to disassemble and replace the thrust washer 725.

Compared to each comparative technology described above, the substrate processing apparatus 2 of the present disclosure can perform precise position adjustment with simple operation while maintaining the flexibility of position adjustment of the loading table 22. However, when the scope of attention is expanded from the two position adjustment mechanisms 6 supported on the common base portion 62 and the substrate processing apparatus 2 is viewed as a whole, the substrate processing apparatus 2 has four position adjustment mechanisms. A mechanism 6 is provided. In addition, two of the position adjustment mechanisms 6 are provided with fixed installation portions 72 (FIG. 4).

In addition, in the present disclosure, a fixed installation portion 72 that does not perform position adjustment operation is provided in the position adjustment mechanism 6 for position adjustment of the loading table 22 disposed on the side of the loading/unloading entrance 21. . In addition, among the three installation positions surrounding the pillar 231 at a distance in the circumferential direction, the fixed installation portion 72 is provided at the position closest to the loading/unloading inlet 21.

At this time, for example, as shown in FIG. 1, in a state where a plurality of substrate processing devices 2 are connected to the vacuum transfer module 13, maintenance for position adjustment using the position adjustment mechanism 6 is performed. Let’s say a need arises. Even in this case, the fixing portion 72 is disposed at a position that is most difficult to access from the outer side of the side wall of the processing container 20. For this reason, it becomes possible to arrange the gap height adjustment portion 71, which can adjust the gap height h, in a more accessible position.

In addition, as in the example shown in FIG. 4, when two rows in which a plurality of loading tables 22 are arranged are provided, a fixed installation part is installed at a position adjacent to these rows (center side as seen from the loading/unloading entrance 21). (72) may be placed. In this case as well, the clearance height adjusting portion 71 can be placed on both side walls as viewed from the loading/unloading inlet 21 and at a position easily accessible from the outside.

Variations of the above-described embodiment will be explained. The fixing member and the position adjusting member are not limited to those formed by a plate. For example, a thin and long bar extends radially from the disk supporting the support 231 toward the placement positions of each gap height adjustment portion 71, the fixed installation portion 72, and the horizontal position adjusting portion 73. A shaped plate member may be provided.

The mounting table 22, which is supported on the common base portion 62 and whose position is adjusted by the position adjustment mechanism 6, is not limited to two examples and may be three or more. In addition, in consideration of correction of distortion of the loading table 22, etc., the gap height adjustment portions 71 may be provided at four or more locations spaced apart in the circumferential direction around the support column 231 (in this case as well, at one location) A fixed installation portion 72 is provided at one location of the adjustment mechanism 6). In addition, in cases where there is a small request to place the gap height adjustment part 71 in an easily accessible position, the arrangement position of the fixed installation part 72 may be freely set.

And, when a plurality of position adjustment mechanisms 6 are provided on the common base portion 62, it cannot be said that it is an essential requirement to provide a fixed installation portion 72 for only one position adjustment mechanism 6. For example, when a member that is unlikely to cause distortion is used and the difference in height dimension between the plurality of fixed installation parts 72 provided on the common base part 62 is within the allowable range, such a position adjustment mechanism 6 ) A fixed installation portion 72 may be provided for each.

Next, for example, when installing the loading table 22 in the substrate processing apparatus 2, an example of a method of aligning the positioning of the loading table 22 using the position adjustment mechanism 6 described above is shown in FIG. 8 This will be explained with reference to 11 to 11. Figures 8 and 9 show an example where the stack 22 arranged in the processing space S1 explained using Figures 1 and 2 is selected as the target stack to be aligned.

In this example, a method of performing centering to place the center of the loading table 22 at the correct position within the processing space S1 will be described using the horizontal position adjusting unit 73 already described. In addition, centering can be performed in other processing spaces S2 to S4 by a method similar to the example described below.

FIG. 8 is an enlarged longitudinal side view of the area around the processing space S1 in the substrate processing apparatus 2 shown in FIG. 2, and FIG. 9 is a plan view of the area.

The examples shown in FIGS. 8 and 9 are the state before installing the ceiling member 201, the shower plate 43, and the guide member 34 for forming the flow path 35 explained using FIG. 2, and are in the processing space ( Position alignment is performed with the upper opening 440 of S1) open.

As shown in FIGS. 8 and 9, at the center of the upper surface side of the loading table 22 inserted into the processing container 20 (container body 202) toward the processing space S1, there is a center for centering. A target groove 221, which is a position-specific mark, is formed. In the example described below, centering of the loading table 22 is performed based on the results of photographing the target groove 221. And, as an imaging unit for imaging the target groove 221, a wafer with a camera (substrate with a camera) 92 can be transported using the substrate holding portion 161 provided in the substrate transport mechanism 15 already described. Use . In addition, similar to the example of transporting the wafer W explained using FIG. 1 and the like, the substrate holding portion 161 is used for the processing space S2, and the substrate holding portion 162 is used for the processing spaces S3 and S4. ) can be used to transport the wafer 92 with a camera.

The camera-equipped wafer 92 has a structure in which the camera 921 is provided at the center of a disc-shaped member of the same size as the wafer W, and a commercially available product can be used. For example, the camera-equipped wafer 92 outputs a captured image to the image processing unit through wireless communication or the like, and the result is displayed on the monitor. Then, with the camera 921 facing the lower side, the camera-equipped wafer 92 is held in the upper position of the loading table 22, thereby creating a target groove 221 formed on the upper surface side of the loading table 22. You can shoot.

Here, as shown in FIG. 11, within the imaging range of the camera-equipped wafer 92, an aiming point 922 that serves as a target position for aligning the arrangement position of the target groove 221 is set. Therefore, by holding the camera-equipped wafer 92 at a preset position and aligning the position of the target groove 221 with respect to the aim 922, centering of the loading table 22 can be performed. In this way, as a method of holding the camera-equipped wafer 92 at a preset position, the holding jig 91 is used in this example.

As shown in FIGS. 8 and 9, the processing container 20 (container body 202) has a retainer for holding the wafer 92 with a camera at a preset position for centering the loading table 22. A support jig 91 is placed.

As shown in the external perspective view of FIG. 10, the holding jig 91 includes a main body portion 911 made of a circular member, and an inner peripheral portion on the lower surface side of the main body portion 911 when viewed from the side. It is provided to protrude in an L-shape toward and is provided with a plurality of wafer pockets 912, which are members that hold the peripheral portion of the camera-equipped wafer 92 from the lower surface side.

8 and 9, for example, the holding jig 91 is positioned above the processing space S1 so that each wafer pocket 912 is inserted toward the inside of the processing space S1. It is installed in the side perimeter area. In this example, the main body portion 911 of the holding jig 91 is positioned on the bottom side by the bottom of the previously described concave portion 204, which is formed in the main body container 202 and before the guide member 34 is disposed. Supported by As shown in FIG. 9, at this time, the alignment projection 204a provided at a predetermined position of the concave portion 204 is held to be inserted into the notch 913 formed at a predetermined position of the main body portion 911. By installing the holding jig 91, the holding jig 91 is positioned (step of installing the holding jig 91).

Then, using the substrate transfer mechanism 15 whose transfer position is taught in advance, the camera-equipped wafer 92 is transferred so that the camera 921 is placed at a preset position for performing the above-mentioned centering. Then, the camera-equipped wafer 92 is passed to the holding jig 91, and the peripheral portion of the camera-equipped wafer 92 is supported from the lower side by the wafer pocket 912, so that the camera-equipped wafer 92 is It is held in the preset position.

At this time, as shown in FIG. 10, a notch 910 is formed in the annular body portion 911 in an area corresponding to the movement path of the substrate holding portion 161 holding the camera-equipped wafer 92. It is done. With this configuration, the camera-equipped wafer 92 can be transferred while avoiding interference between the substrate holding portion 161 and the holding jig 91 (the camera-equipped wafer 92 is placed in the holding jig 91). process to retain and support).

Next, after the substrate holding portion 161 is retracted from the processing space S1, the upper surface of the loading table 22 is photographed using the camera 921 (step of photographing the target groove 221). The camera-equipped wafer 92 is held at a preset position by the holding jig 91, and the support 231 supporting the loading table 22 is also attached to the bottom portion 27 of the container body 202. It is inserted into the formed opening 271, and approximate positioning is achieved. As a result, the target groove 221 formed on the upper surface of the loading table 22 is usually located within the imaging range of the camera 921.

In addition, around each support 231, there is an opening 271 including the opening 271 in order to prevent outside air from entering the processing spaces S1 to S4 through the opening 271 formed in the bottom portion 27. A bellows (not shown) is provided to airtightly cover the space around the support 231.

And, as shown in FIG. 11, the already described position adjustment mechanism 6 provided on the loading table 22 so that the target groove 221 captured in the captured image is aligned with the aim 922 set within the imaging range. Centering is performed using the horizontal position adjusting unit 73 (a process of aligning the horizontal position of the loading table 22).

In this way, when the centering of the loading table 22 with respect to the processing space S1 is completed, the installation position of the holding jig 91 is sequentially changed to the other processing spaces S3 to S4, and the same operation as the above-described example is performed. Centering of the other loading table 22 is performed in this order.

According to the above-described method, for example, in the case where centering is performed by placing a position adjustment jig between the outer peripheral side of the loading table 22 and the inner peripheral side of the container body 202 forming the processing space S1, In comparison, there is no risk of misalignment when removing the position adjustment jig. Additionally, since centering is performed using a captured image obtained using the camera 921, the precision of position alignment, etc. can be numerically managed based on the number of pixels, etc.

Additionally, the configuration of the imaging unit that photographs the target groove 221 is not limited to the case of using the camera-equipped wafer 92 shown in FIGS. 8 and 9. Centering of the loading table 22 may be performed using a holding jig 91 capable of holding a CCD (Charge Coupled Device) camera at a preset position.

In addition, regarding the centering method of the loading table 22 described above, a method of holding the camera-equipped wafer 92 at a predetermined position of the holding jig 91 using the previously taught substrate transfer mechanism 15; Centering may be performed using another method. For example, a configuration may be adopted in which a guide groove or the like is provided on the wafer pocket 912 side of the holding jig 91 and the camera-equipped wafer 92 is guided and held toward the preset position.

Also, at this time, the teaching of the substrate transport mechanism 15 may be corrected using the centering result of the loading table 22.

As a teaching correction method, for example, the wafer 92 with the camera after centering the loading table 22 is unloaded into the load lock chamber 122, and the wafer W provided in the load lock chamber 122 is removed. Take photos of the loading dock. Like the loading table 22 on the processing container 20 side, a position confirmation mark is formed on the loading table on the load lock chamber 122 side, and the mark is photographed using the wafer 92 with a camera. . Then, the photographing result of the target groove 221 of the loading table 22 on the side of the processing container 20 on which centering has been performed is compared with the photographing result of the mark on the load lock chamber 122 side. Based on this comparison result, the substrate transfer mechanism 15 accurately transports the wafer between a preset position on the loading table in the load lock chamber 122 and a preset position on the loading table 22 on the processing container 20 side. In order to be able to transport (W), the teaching position can be corrected for the control mechanism of the substrate transport mechanism 15.

The vacuum processing performed in the substrate processing apparatus 2 according to each of the embodiments described above is not limited to film forming processing using the CVD method, and may also be film forming processing using the ALD (Atomic Layer Deposition) method or etching processing. In the film forming process by the ALD method, the step of adsorbing the raw material gas to the wafer W and the step of reacting the raw material gas adsorbed on the wafer W and the reaction gas to generate a reaction product are repeated multiple times to produce the reaction product. It is a layering film forming process. Additionally, in the substrate processing system 1, there may be only one substrate processing device 2 connected to the vacuum transfer chamber 14.

The embodiment disclosed this time should be considered illustrative in all respects and not restrictive. The above embodiments may be omitted, replaced, or changed in various forms without departing from the appended claims and the general spirit thereof.

W: wafer
2: Substrate processing device
20: Processing container
22: loading stand
231: Landowner
6: Position adjustment mechanism
611: Position adjustment plate
612: fixing plate
62: base part
71: Gap height adjustment unit
72: Fixed installation part

Claims (14)

In a substrate processing apparatus that supplies processing gas to a substrate to perform processing,
A plurality of loading tables disposed in the processing container, each of which is loaded with a substrate to be processed,
a plurality of struts that respectively support the plurality of loading tables from a lower side and protrude downwardly through the bottom of the processing vessel;
A common base portion supporting the plurality of struts from the base side,
A fixing member provided between the base portion and the proximal end of each strut and fixed to the base portion side, and a load disposed above the fixing member to position the proximal end of the prop and supported on the prop. Position adjustment members for adjusting the position of the stand, each provided at at least three locations surrounding the support in the circumferential direction, and the height of the gap between the fixing member and the position adjustment member being adjustable, the position adjustment member Provided with a plurality of position adjustment mechanisms having a plurality of gap height adjustment portions installed with respect to the fixing member,
At least one position adjustment mechanism of the plurality of position adjustment mechanisms is to install a position adjustment member with respect to the fixing member, in place of the gap height adjustment part, with the height of the gap fixed, at one of the at least three locations. A substrate processing device provided with a fixed installation portion. The method of claim 1, wherein the gap height adjusting portion includes a pull screw portion that installs the position adjusting member with respect to the fixing member in a state in which the gap height can be changed, and a push screw portion that regulates the proximity of the fixing member and the position adjusting member. A substrate processing device comprising: The substrate processing apparatus according to claim 2, wherein the pressing screw portion of the gap height adjustment portion is provided with a micrometer head. The substrate processing apparatus of claim 2, wherein the pull screw portion of the gap height adjustment portion is provided with a clamp lever. The method according to claim 1, wherein the position adjustment mechanism includes a plurality of horizontal position adjustment parts that horizontally move the installation position of the position adjustment member relative to the fixing member in two directions that intersect each other when viewed in plan. A substrate processing device. The method according to claim 5, wherein the horizontal position adjusting portion is fixed to the fixing member and includes a retaining member disposed at a position opposite to a side surface of the position adjusting member, and is held by the retaining member. , a pulling screw portion for attaching the position adjustment member to the holding member in a state in which the position of the position adjusting member can be moved in the horizontal direction, and a push regulating the proximity of the side surfaces of the holding member and the position adjusting member. A substrate processing device including a screw portion. The substrate processing apparatus according to claim 6, wherein the press screw portion of the horizontal position adjusting portion is provided with a micrometer head. The substrate processing apparatus of claim 6, wherein the pull screw portion of the horizontal position adjusting portion includes a clamp lever. The substrate processing apparatus according to claim 1, wherein the base unit is connected to a common lifting mechanism for raising and lowering each loading table supported on the plurality of supports. A substrate transfer module provided with a substrate transfer chamber and a substrate transfer mechanism disposed within the substrate transfer room and provided with a substrate holding support for transferring the substrate;
A substrate processing apparatus according to claim 1, wherein transfer of a substrate between the substrate transfer chamber and a processing container is performed by allowing the substrate holding unit to enter through a transfer inlet connected to the substrate transfer chamber,
A plurality of loading platforms supported on a common base through the plurality of supports are arranged side by side in a row along an entry direction of the substrate holding portion from the loading/unloading entrance, and
The substrate processing system, wherein the fixed installation portion is provided in a position adjustment mechanism of a support supporting a loading table most disposed on the loading/unloading entrance side among the plurality of loading tables arranged side by side in a row. The substrate according to claim 10, wherein the fixing portion is provided at a position most on the loading/unloading inlet side among at least three locations circumferentially surrounding the strut supporting the loading stand disposed on the loading/unloading/inlet side. processing system. In a method of positioning a loading table provided in a substrate processing apparatus and on which substrates to be processed are loaded,
At a preset position above the target loading platform, which is the loading platform for the position alignment target selected from the plurality of loading platforms provided in the substrate processing apparatus according to claim 5, an imaging unit is provided for photographing a position-specific mark provided on the upper surface of the target loading platform. A step of installing a holding jig to the processing vessel to support it,
A step of holding the imaging unit on the holding jig installed in the processing container;
A step of photographing, by a photographing unit held at the preset position by the holding jig, a mark for specifying the position of the target loading table;
Using the horizontal position adjusting portion of the position adjusting mechanism provided for the object loading stand so that the position specifying mark photographed by the imaging process is aligned with a target position set within the imaging range of the photographing portion, A method comprising a step of aligning the horizontal direction of a loading table. The method according to claim 12, wherein the imaging unit is a substrate with a camera that can be transported by a substrate holding portion provided in a substrate transport mechanism that transports the substrate to be processed to the loading table. The method according to claim 13, wherein in the step of holding the imaging unit on the holding jig, interference with the substrate holding section when the substrate holding section holding the camera-equipped substrate is entered into the processing container is avoided. To this end, a method in which a notch is formed in the holding jig in an area corresponding to the movement path of the substrate holding portion holding the camera-equipped substrate.

Images