KR102590304B1 - 증발원 장치, 증착 장치 및 증착 시스템 - Google Patents
증발원 장치, 증착 장치 및 증착 시스템 Download PDFInfo
- Publication number
- KR102590304B1 KR102590304B1 KR1020180125114A KR20180125114A KR102590304B1 KR 102590304 B1 KR102590304 B1 KR 102590304B1 KR 1020180125114 A KR1020180125114 A KR 1020180125114A KR 20180125114 A KR20180125114 A KR 20180125114A KR 102590304 B1 KR102590304 B1 KR 102590304B1
- Authority
- KR
- South Korea
- Prior art keywords
- source device
- evaporation source
- container
- evaporation
- cooling
- Prior art date
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/225—Oblique incidence of vaporised material on substrate
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/243—Crucibles for source material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/26—Vacuum evaporation by resistance or inductive heating of the source
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2018-102198 | 2018-05-29 | ||
JP2018102198A JP6686069B2 (ja) | 2018-05-29 | 2018-05-29 | 蒸発源装置、蒸着装置、および蒸着システム |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20190135901A KR20190135901A (ko) | 2019-12-09 |
KR102590304B1 true KR102590304B1 (ko) | 2023-10-16 |
Family
ID=68701307
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020180125114A KR102590304B1 (ko) | 2018-05-29 | 2018-10-19 | 증발원 장치, 증착 장치 및 증착 시스템 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP6686069B2 (ja) |
KR (1) | KR102590304B1 (ja) |
CN (1) | CN110541146B (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109321883B (zh) * | 2018-10-15 | 2020-10-27 | 武汉华星光电半导体显示技术有限公司 | 一种蒸镀机 |
JP7346329B2 (ja) * | 2020-02-28 | 2023-09-19 | 株式会社アルバック | 材料供給装置 |
CN112011762B (zh) * | 2020-07-28 | 2023-05-23 | 云谷(固安)科技有限公司 | 一种蒸镀装置 |
JP7242626B2 (ja) * | 2020-12-10 | 2023-03-20 | キヤノントッキ株式会社 | 成膜装置 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007186787A (ja) | 2005-12-14 | 2007-07-26 | Hitachi Displays Ltd | 蒸着坩堝並びにこれを備えた薄膜形成装置、及び表示装置の製造方法 |
JP2012207238A (ja) | 2011-03-29 | 2012-10-25 | Hitachi High-Technologies Corp | 蒸着方法および蒸着装置 |
JP2014015637A (ja) * | 2012-07-06 | 2014-01-30 | Hitachi High-Technologies Corp | 蒸着装置 |
JP2018003122A (ja) | 2016-07-05 | 2018-01-11 | キヤノントッキ株式会社 | 蒸着装置及び蒸発源 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2967784B2 (ja) * | 1989-12-11 | 1999-10-25 | キヤノン株式会社 | 堆積膜形成方法及びその装置 |
JP2004214120A (ja) * | 2003-01-08 | 2004-07-29 | Sony Corp | 有機電界発光素子の製造装置及び製造方法 |
JP4490160B2 (ja) | 2004-05-13 | 2010-06-23 | 株式会社アルバック | 有機薄膜の成膜装置 |
JP4728882B2 (ja) * | 2006-06-09 | 2011-07-20 | 長州産業株式会社 | 薄膜堆積用分子線源用坩堝の製造方法 |
JP2009064631A (ja) * | 2007-09-05 | 2009-03-26 | Toshiba Matsushita Display Technology Co Ltd | 表示装置の製造装置 |
JP4758513B2 (ja) * | 2009-07-31 | 2011-08-31 | 富士フイルム株式会社 | 容器のスクリーニング方法 |
KR101224773B1 (ko) * | 2012-02-23 | 2013-01-21 | 박철수 | 유도가열 방식을 이용한 초고속 진공 증착기 |
JP6641226B2 (ja) * | 2016-04-28 | 2020-02-05 | キヤノントッキ株式会社 | 真空蒸着装置並びに蒸発源の冷却方法 |
-
2018
- 2018-05-29 JP JP2018102198A patent/JP6686069B2/ja active Active
- 2018-10-19 KR KR1020180125114A patent/KR102590304B1/ko active IP Right Grant
- 2018-11-16 CN CN201811362781.3A patent/CN110541146B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007186787A (ja) | 2005-12-14 | 2007-07-26 | Hitachi Displays Ltd | 蒸着坩堝並びにこれを備えた薄膜形成装置、及び表示装置の製造方法 |
JP2012207238A (ja) | 2011-03-29 | 2012-10-25 | Hitachi High-Technologies Corp | 蒸着方法および蒸着装置 |
JP2014015637A (ja) * | 2012-07-06 | 2014-01-30 | Hitachi High-Technologies Corp | 蒸着装置 |
JP2018003122A (ja) | 2016-07-05 | 2018-01-11 | キヤノントッキ株式会社 | 蒸着装置及び蒸発源 |
Also Published As
Publication number | Publication date |
---|---|
JP2019206733A (ja) | 2019-12-05 |
JP6686069B2 (ja) | 2020-04-22 |
KR20190135901A (ko) | 2019-12-09 |
CN110541146B (zh) | 2023-08-01 |
CN110541146A (zh) | 2019-12-06 |
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